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1. 发明授权

US5608028A Polybutadiene urethane potting material 失效
标题翻译：聚丁二烯聚氨酯灌封材料
公开(公告)号：US5608028A
公开(公告)日：1997-03-04
申请号：US189984
申请日：1994-02-02
申请人： Henry M. Sanftleben , Ralph D. Hermansen
发明人： Henry M. Sanftleben , Ralph D. Hermansen
IPC分类号： C08G18/40 , C08G18/69 , C08G59/32 , H01B3/30 , C08G4/00 , C08G59/00
CPC分类号： H01B3/302 , C08G18/4045 , C08G18/698 , C08G59/3218 , Y10S528/905
摘要： An adhesive material is provided which is particularly suitable for potting a sensing element within a container. The adhesive material is characterized by mechanical and physical properties which enable the adhesive material to maintain its adhesive and structural integrity under intense thermal cycling conditions, so as to exclude foreign elements from the sensing element when potted within a container with the potting material. The adhesive material can be formulated so as to be sufficiently adherent for use with containers formed from materials such as polybutylene terephthalate, polyethylene terephthalate, and E-coated steel, by including additions of a flexibilized polyol/polyepoxide epoxy novolac in an amount of up to about 15 parts by weight.
摘要翻译：提供了一种粘合剂材料，其特别适合于将感测元件灌封在容器内。粘合剂材料的特征在于机械和物理性质，其使得粘合剂材料能够在强烈的热循环条件下保持其粘合剂和结构完整性，以便当将其包封在具有灌封材料的容器内时，将异物从感测元件排除。粘合剂材料可以被配制成足够的粘附性，以便与诸如聚对苯二甲酸丁二醇酯，聚对苯二甲酸乙二醇酯和E涂层钢等材料形成的容器一起使用，包括添加可挠曲的多元醇/聚环氧化物环氧酚醛清漆，其量可达约15重量份。

2. 发明授权

US5510138A Hot melt conformal coating materials 失效
标题翻译：热熔保形涂料
公开(公告)号：US5510138A
公开(公告)日：1996-04-23
申请号：US248043
申请日：1994-05-24
申请人： Henry M. Sanftleben , James M. Rosson , Ralph D. Hermansen
发明人： Henry M. Sanftleben , James M. Rosson , Ralph D. Hermansen
IPC分类号： H01L21/56 , H01L23/31 , H05K3/28 , B05D5/12
CPC分类号： H01L21/56 , H01L23/3121 , H05K3/284 , H01L2924/0002
摘要： Conformal coating materials are provided for forming a protective conformal coating on the surface of an electronic assembly. The conformal coating materials are characterized by being hot melt materials, in that they are each initially a solid or semisolid at approximately room temperature, a liquid at an elevated temperature at which the coating material is applied to the electronic assembly, and solidify upon cooling to a temperature corresponding to a service temperature of the electronic assembly. As such, the coating systems can be rapidly applied through various highly controllable techniques associated with hot melt dispensing equipment. In addition, the coating systems quickly solidify upon cooling to allow handling of the electronic assembly. The conformal coating systems may be nonreactive, indicating that the system can be remelted, or reactive, indicating that a post-application curing process occurs over time at a temperature less than the elevated application temperature.
摘要翻译：提供保形涂层材料用于在电子组件的表面上形成保护性保形涂层。保形涂层材料的特征在于是热熔材料，因为它们在大约室温下首先是固体或半固体，在涂覆材料施加到电子组件的高温下的液体，并且在冷却时固化对应于电子组件的使用温度的温度。因此，可以通过与热熔胶分配设备相关的各种高度可控的技术快速施加涂层体系。此外，涂层系统在冷却时快速固化以允许处理电子组件。保形涂层系统可以是非反应性的，表明该系统可被重熔或反应，表明在低于提高的应用温度的温度下随着时间的推移发生后应用固化过程。

3. 发明授权

US5185498A Circuit assembly encapsulated with polybutadiene urethane 失效
标题翻译：用聚丁二烯聚氨酯封装的电路组件
公开(公告)号：US5185498A
公开(公告)日：1993-02-09
申请号：US714148
申请日：1991-06-11
申请人： Henry M. Sanftleben , Ralph D. Hermansen , Gary R. Shelton , Petrina L. Schnabel , Dennis T. Baird , Douglas C. Smith
发明人： Henry M. Sanftleben , Ralph D. Hermansen , Gary R. Shelton , Petrina L. Schnabel , Dennis T. Baird , Douglas C. Smith
IPC分类号： G01P1/02
CPC分类号： G01P1/023 , Y10T428/31551
摘要： An acceleration sensor is packaged in an open can and encapsulated in an elastomeric polybutadiene compound which maintains its mechanical properties over a range of -40.degree. C. to 105.degree. C. and transmits acceleration to the sensor with a unity transfer function. The encapsulation material comprises about 90 to 100 pbw of polyol and about 20 pbw of isocyanate, the polyol consisting of at least 70% of hydroxy-polybutadiene. For enhanced adhesion a foaming agent and/or an epoxy is added to the mixture.
摘要翻译：加速度传感器被封装在敞开的罐中，并且封装在弹性体聚丁二烯化合物中，其在-40℃至105℃的范围内保持其机械性能，并以加速传递函数将加速度传递到传感器。包封材料包含约90至100pbw的多元醇和约20pbw的异氰酸酯，多元醇由至少70％的羟基聚丁二烯组成。为了增强附着力，向混合物中加入发泡剂和/或环氧树脂。

4. 发明授权

US07324191B2 Optical seat belt tension sensor 有权
标题翻译：光学安全带张力传感器
公开(公告)号：US07324191B2
公开(公告)日：2008-01-29
申请号：US11096532
申请日：2005-04-01
申请人： Morgan D. Murphy , Henry M. Sanftleben , Pamela A. Roe
发明人： Morgan D. Murphy , Henry M. Sanftleben , Pamela A. Roe
IPC分类号： G01J1/00
CPC分类号： B60R21/0155 , B60R21/01548 , B60R2021/01088 , Y10T24/45665
摘要： A belt tension sensor includes an armature that is displaced in relation to belt tension and an optical sensing mechanism that detects armature displacement as a measure of belt tension. In a first mechanization, a lens element is mounted on the armature for movement therewith, and light emitted by a light source passes through the lens element before impinging on a light responsive element; the lens element variably diffuses the emitted light in relation to the belt tension, and the light impinging on the light responsive element provides a measure of the belt tension. In a second mechanization, the armature includes a protuberance that abuts and variably collapses a compressible optical waveguide to vary its optical transmissivity in relation to the armature displacement, and the optical transmissivity of the optical waveguide provides a measure of the belt tension.
摘要翻译：带张力传感器包括相对于皮带张力移位的电枢和检测电枢位移作为皮带张力的量度的光学感测机构。在第一机械化中，透镜元件安装在电枢上以与其一起运动，并且由光源发射的光在撞击光响应元件之前穿过透镜元件; 透镜元件相对于带张力可变地扩散发射的光，并且入射到光响应元件上的光提供带张力的量度。在第二机械化中，电枢包括一个突起，该突起邻接和可变地折叠可压缩光波导以相对于电枢位移改变其透光率，并且光波导的光透射率提供了带张力的量度。

5. 发明授权

US07365981B2 Fluid-cooled electronic system 有权
标题翻译：流体冷却电子系统
公开(公告)号：US07365981B2
公开(公告)日：2008-04-29
申请号：US11168882
申请日：2005-06-28
申请人： Bruce A. Myers , Darrel E. Peugh , Henry M. Sanftleben
发明人： Bruce A. Myers , Darrel E. Peugh , Henry M. Sanftleben
IPC分类号： H05K7/20 , H01L23/12 , F28F7/00
CPC分类号： H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/09701 , H01L2924/16251 , H01L2924/00
摘要： A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and the fluid outlet, and an electronic device disposed within the fluid containment chamber and connected to the base, the electronic device having a plurality of microchannels adapted to receive a cooling fluid flow therethrough, wherein the cap is shaped to direct a fluid flow from the fluid inlet to the microchannels such that a pressure drop between the fluid inlet and the fluid outlet is reduced.
摘要翻译：一种流体冷却的电子组件，包括其中具有流体入口和流体出口的底座，附接到基座以在其间形成流体容纳室的盖，其中流体容纳室与流体入口和流体出口流体连通以及设置在所述流体容纳室内并连接到所述基座的电子设备，所述电子设备具有多个微通道，所述多个微通道适于接收通过其中的冷却流体流，其中所述盖被成形为将流体流从所述流体入口引导到微通道，使得流体入口和流体出口之间的压降降低。

6. 发明授权

US5460767A Hot melt masking materials 失效
标题翻译：热熔屏蔽材料
公开(公告)号：US5460767A
公开(公告)日：1995-10-24
申请号：US251700
申请日：1994-05-31
申请人： Henry M. Sanftleben , James M. Rosson
发明人： Henry M. Sanftleben , James M. Rosson
IPC分类号： B29C39/02 , B29C39/10 , B29C39/22 , C08L23/02 , C09D5/00 , H05K3/28 , H05K3/34 , B29C65/52 , B29C39/12 , B29C65/40
CPC分类号： H05K3/284 , B29C39/021 , B29C39/10 , B29C39/22 , C08L23/02 , C09D5/008 , C08L63/00 , C08L91/06 , H05K3/3421 , Y10T29/49146
摘要： A method is provided for processing an electronic circuit assembly having surface mount integrated circuit packages mounted to its substrate, in which ingress of a conformal coating into a void present between the IC package and the substrate is prevented by a masking composition which forms a barrier around the IC package prior to the conformal coating process. The masking compositions are hot melt materials, in that each is initially a solid at roughly room temperature, melts to become a liquid at an elevated temperature at which the masking composition is applied to the electronic assembly, and forms a solid upon cooling to a temperature corresponding to a service temperature of the electronic assembly. As such, the masking compositions can be rapidly applied through various highly controllable techniques, and will quickly and sufficiently solidify upon cooling to allow handling of the electronic assembly. The masking compositions may be nonreactive, indicating that the barrier can be remelted, or reactive, indicating that a post-application curing process occurs over time at a temperature less than the elevated application temperature.
摘要翻译：提供一种用于处理具有安装到其基板上的表面安装集成电路封装的电子电路组件的方法，其中通过形成围绕屏障的屏蔽组合物来防止保形涂层进入IC封装和基板之间的空隙中 IC封装在保形涂层工艺之前。掩蔽组合物是热熔体材料，其中每个最初都是在大约室温下的固体，在掩蔽组合物被施加到电子组件的高温下熔化成液体，并且在冷却至温度时形成固体对应于电子组件的使用温度。因此，掩模组合物可以通过各种高度可控的技术快速施加，并且在冷却时将快速且充分地固化以允许处理电子组件。掩蔽组合物可以是非反应性的，指示可以重新熔化或反应阻挡层，这表明在小于提高的施加温度的温度下随时间推移施用后固化过程。

7. 发明授权

US07159471B2 Capacitive load cell apparatus having silicone-impregnated foam dielectric pads 失效
标题翻译：具有硅氧烷浸渍的泡沫介电垫的电容式称重传感器装置
公开(公告)号：US07159471B2
公开(公告)日：2007-01-09
申请号：US11070045
申请日：2005-03-02
申请人： Duane D. Fortune , Henry M. Sanftleben
发明人： Duane D. Fortune , Henry M. Sanftleben
IPC分类号： G01B7/16
CPC分类号： G01G7/06 , G01G19/4142
摘要： A capacitive load cell includes upper and lower capacitor plates and an intermediate array of dielectric pads formed of silicone-impregnated open-cell urethane foam (i.e., gel pads). The silicone essentially displaces air that would otherwise be trapped in the foam, contributing to a dielectric having minimal humidity-related variability. The upper capacitor plate is defined by an array of individual charge plates, the lower capacitor plate defines a ground plane conductor common to each of the charge plates, and the dielectric pads are disposed between the ground plane conductor and each of the charge plates, leaving channels between adjacent dielectric pads. When occupant weight is applied to the seat, the dielectric pads transmitting the weight distend laterally into the channels to reduce the separation between the respective upper and lower capacitor plates, and the consequent change in capacitance is detected as a measure of the applied force and the force distribution.
摘要翻译：电容性测力传感器包括上部和下部电容器板以及由硅氧烷浸渍的开孔聚氨酯泡沫（即凝胶垫）形成的介质垫的中间阵列。硅氧烷基本上置换了否则将被捕获在泡沫中的空气，有助于具有最小湿度相关变化性的电介质。上电容器板由单独的充电板的阵列限定，下电容器板限定每个充电板公共的接地平面导体，并且介电垫设置在接地平面导体和每个充电板之间，留下相邻电介质垫之间的通道。当乘员重量被施加到座椅时，传递重量的介质垫片横向扩张到通道中以减小相应的上部和下部电容器板之间的间隔，并且随后的电容变化被检测为施加的力的量度，并且力分布。

8. 发明授权

US06999301B1 Capacitive load cell apparatus having an annealed synthetic woven spring dielectric 失效
标题翻译：具有退火的合成编织弹簧电介质的电容式称重传感器装置
公开(公告)号：US06999301B1
公开(公告)日：2006-02-14
申请号：US11053522
申请日：2005-02-08
申请人： Henry M. Sanftleben , William W. Fultz , Eric M Berg , Morgan D. Murphy , Dennis P. Griffin
发明人： Henry M. Sanftleben , William W. Fultz , Eric M Berg , Morgan D. Murphy , Dennis P. Griffin
IPC分类号： H01G4/20
CPC分类号： G01G19/4142 , G01G7/06
摘要： A capacitive load cell apparatus includes upper and lower capacitor plates and an intermediate dielectric in the form of a synthetic knit spacer material having upper and lower fabric layers interconnected by an array of deflectable synthetic fibers. When occupant weight is applied to the seat, the synthetic fibers deflect to locally reduce the separation between the upper and lower capacitor plates, and the consequent change in capacitance is detected as a measure of the applied weight. The load cell or just the dielectric may be encased in a polymeric sheath to prevent intrusion of foreign matter, and a fluid such as silicone may be dispersed in woven dielectric.
摘要翻译：电容式测力传感器装置包括上和下电容器板以及合成针织间隔物形式的中间电介质，其具有通过可偏转的合成纤维阵列互连的上和下织物层。当乘员重量施加到座椅上时，合成纤维偏转以局部地减小上部和下部电容器板之间的间隔，并且随后的电容变化被检测为所施加的重量的量度。称重传感器或只是电介质可以封装在聚合物护套中以防止异物侵入，并且诸如硅氧烷的流体可以分散在机织电介质中。

9. 发明授权

US06614108B1 Electronic package and method therefor 有权
标题翻译：电子封装及其方法
公开(公告)号：US06614108B1
公开(公告)日：2003-09-02
申请号：US09692886
申请日：2000-10-23
申请人： Henry M. Sanftleben , Derek S. Ferraro
发明人： Henry M. Sanftleben , Derek S. Ferraro
IPC分类号： H01L2310
CPC分类号： H05K5/064 , H01L23/10 , H01L2924/0002 , H01L2924/00
摘要： An electronic package and a method for packaging an electronic component, particularly a shock-sensitive component such as a yaw rate sensor or an accelerometer mounted to a circuit board. The package includes a case having an opening through which the circuit board is placed within the case, so that a peripheral edge of the circuit board is adjacent but spaced apart from a wall of the case. A thixotropic gel is present in the space between the peripheral edge of the circuit board and the wall of the case, so as to separate and control the mechanical decoupling of the circuit board and case. An optional spacer can be used to space the circuit board from the shelf. Alternatively, the gel may be filled with a polymer particulate material. A potting material preferably fills an upper cavity within the case to encapsulate and secure the circuit board within the case.
摘要翻译：一种用于封装电子部件的电子封装和方法，特别是安装在电路板上的偏转率传感器或加速度计等的冲击敏感部件。该封装包括具有开口的壳体，电路板通过该开口放置在壳体内，使得电路板的周边边缘与壳体的壁相邻但间隔开。触电凝胶存在于电路板的外围边缘与壳体的壁之间的空间中，以便分离和控制电路板和壳体的机械解耦。可以使用可选的间隔器将电路板从搁板上放置。或者，凝胶可以填充聚合物颗粒材料。灌封材料优选地填充壳体内的上腔体以将电路板封装并固定在壳体内。

10. 发明授权

US06560110B1 Corrosive resistant flip chip thermal management structure 失效
标题翻译：防腐倒装芯片散热管理结构
公开(公告)号：US06560110B1
公开(公告)日：2003-05-06
申请号：US10079760
申请日：2002-02-22
申请人： Bruce A. Myers , Thomas A. Degenkolb , Henry M. Sanftleben , Darrel E. Peugh
发明人： Bruce A. Myers , Thomas A. Degenkolb , Henry M. Sanftleben , Darrel E. Peugh
IPC分类号： H05K720
CPC分类号： H05K5/064 , H05K7/20463
摘要： A corrosive resistant electronics assembly 10 is provided including at least one heat generating electronics component 12 mounted on a substrate 14 and positioned within potting material 18. A thermally conductive block element 24 is thermally mounted to the at least one heat generating electronics component 12 and positioned within the potting material 18, thereby providing a corrosive resistant electronics assembly 10 with improved thermal dissipation.
摘要翻译：提供了一种抗腐蚀电子组件10，其包括安装在基板14上并位于灌封材料18内的至少一个发热电子元件12.导热块元件24热安装到至少一个发热电子元件12上并定位在灌封材料18内，从而提供具有改善的热耗散的耐腐蚀电子组件10。

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