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1. 发明授权

US5510138A Hot melt conformal coating materials 失效
标题翻译：热熔保形涂料
公开(公告)号：US5510138A
公开(公告)日：1996-04-23
申请号：US248043
申请日：1994-05-24
申请人： Henry M. Sanftleben , James M. Rosson , Ralph D. Hermansen
发明人： Henry M. Sanftleben , James M. Rosson , Ralph D. Hermansen
IPC分类号： H01L21/56 , H01L23/31 , H05K3/28 , B05D5/12
CPC分类号： H01L21/56 , H01L23/3121 , H05K3/284 , H01L2924/0002
摘要： Conformal coating materials are provided for forming a protective conformal coating on the surface of an electronic assembly. The conformal coating materials are characterized by being hot melt materials, in that they are each initially a solid or semisolid at approximately room temperature, a liquid at an elevated temperature at which the coating material is applied to the electronic assembly, and solidify upon cooling to a temperature corresponding to a service temperature of the electronic assembly. As such, the coating systems can be rapidly applied through various highly controllable techniques associated with hot melt dispensing equipment. In addition, the coating systems quickly solidify upon cooling to allow handling of the electronic assembly. The conformal coating systems may be nonreactive, indicating that the system can be remelted, or reactive, indicating that a post-application curing process occurs over time at a temperature less than the elevated application temperature.
摘要翻译：提供保形涂层材料用于在电子组件的表面上形成保护性保形涂层。保形涂层材料的特征在于是热熔材料，因为它们在大约室温下首先是固体或半固体，在涂覆材料施加到电子组件的高温下的液体，并且在冷却时固化对应于电子组件的使用温度的温度。因此，可以通过与热熔胶分配设备相关的各种高度可控的技术快速施加涂层体系。此外，涂层系统在冷却时快速固化以允许处理电子组件。保形涂层系统可以是非反应性的，表明该系统可被重熔或反应，表明在低于提高的应用温度的温度下随着时间的推移发生后应用固化过程。

2. 发明授权

US5460767A Hot melt masking materials 失效
标题翻译：热熔屏蔽材料
公开(公告)号：US5460767A
公开(公告)日：1995-10-24
申请号：US251700
申请日：1994-05-31
申请人： Henry M. Sanftleben , James M. Rosson
发明人： Henry M. Sanftleben , James M. Rosson
IPC分类号： B29C39/02 , B29C39/10 , B29C39/22 , C08L23/02 , C09D5/00 , H05K3/28 , H05K3/34 , B29C65/52 , B29C39/12 , B29C65/40
CPC分类号： H05K3/284 , B29C39/021 , B29C39/10 , B29C39/22 , C08L23/02 , C09D5/008 , C08L63/00 , C08L91/06 , H05K3/3421 , Y10T29/49146
摘要： A method is provided for processing an electronic circuit assembly having surface mount integrated circuit packages mounted to its substrate, in which ingress of a conformal coating into a void present between the IC package and the substrate is prevented by a masking composition which forms a barrier around the IC package prior to the conformal coating process. The masking compositions are hot melt materials, in that each is initially a solid at roughly room temperature, melts to become a liquid at an elevated temperature at which the masking composition is applied to the electronic assembly, and forms a solid upon cooling to a temperature corresponding to a service temperature of the electronic assembly. As such, the masking compositions can be rapidly applied through various highly controllable techniques, and will quickly and sufficiently solidify upon cooling to allow handling of the electronic assembly. The masking compositions may be nonreactive, indicating that the barrier can be remelted, or reactive, indicating that a post-application curing process occurs over time at a temperature less than the elevated application temperature.
摘要翻译：提供一种用于处理具有安装到其基板上的表面安装集成电路封装的电子电路组件的方法，其中通过形成围绕屏障的屏蔽组合物来防止保形涂层进入IC封装和基板之间的空隙中 IC封装在保形涂层工艺之前。掩蔽组合物是热熔体材料，其中每个最初都是在大约室温下的固体，在掩蔽组合物被施加到电子组件的高温下熔化成液体，并且在冷却至温度时形成固体对应于电子组件的使用温度。因此，掩模组合物可以通过各种高度可控的技术快速施加，并且在冷却时将快速且充分地固化以允许处理电子组件。掩蔽组合物可以是非反应性的，指示可以重新熔化或反应阻挡层，这表明在小于提高的施加温度的温度下随时间推移施用后固化过程。

3. 发明授权

US5759730A Solder joint encapsulation material 失效
标题翻译：焊接封装材料
公开(公告)号：US5759730A
公开(公告)日：1998-06-02
申请号：US897410
申请日：1997-07-21
申请人： Ralph D. Hermansen , Theresa Renee Lindley , Samuel R. Wennberg , Henry Morris Sanftleben , James M. Rosson
发明人： Ralph D. Hermansen , Theresa Renee Lindley , Samuel R. Wennberg , Henry Morris Sanftleben , James M. Rosson
IPC分类号： C08G59/18 , C08L63/00 , H05K3/28 , H05K3/34 , H01L21/60
CPC分类号： C08L63/00 , C08G59/18 , H05K3/284 , H05K3/3421 , H05K2201/10689 , H05K2201/10977 , Y02P70/613
摘要： A method and encapsulation material are provided for processing an electronic circuit assembly having surface mount integrated circuit packages mounted with soldered leads to its substrate, in which encapsulation of the soldered lead joints serves to enhance the fatigue life of the solder joints. The encapsulation material is a reactive hot melt epoxy that is curable at temperatures significantly lower than that required for previous epoxy-based encapsulation materials. As such, processing of the circuit assembly is greatly facilitated, while the benefit of encapsulated solder joints is achieved for the assembly. The encapsulation material further includes a latent curative and a filler material for lower the coefficient of thermal expansion of the encapsulation material.
摘要翻译：提供了一种方法和封装材料，用于处理电子电路组件，该电子电路组件具有安装有焊接引线到其衬底的表面贴装集成电路封装，其中焊接引线接头的封装用于增强焊点的疲劳寿命。封装材料是反应性热熔环氧树脂，其在明显低于以前的环氧基封装材料所需的温度下可固化。因此，极大地方便了电路组件的处理，同时为组装实现了封装的焊点的益处。封装材料还包括用于降低封装材料的热膨胀系数的潜在固化剂和填充材料。

4. 发明授权

US5708056A Hot melt epoxy encapsulation material 失效
标题翻译：热熔环氧树脂封装材料
公开(公告)号：US5708056A
公开(公告)日：1998-01-13
申请号：US566519
申请日：1995-12-04
申请人： Theresa Renee Lindley , Samuel R. Wennberg , Henry Morris Sanftleben , James M. Rosson , Ralph D. Hermansen
发明人： Theresa Renee Lindley , Samuel R. Wennberg , Henry Morris Sanftleben , James M. Rosson , Ralph D. Hermansen
IPC分类号： C08G59/18 , C08L63/00 , H05K3/28 , H05K3/34 , C08K7/20 , C08L63/02 , C08L63/04
CPC分类号： C08L63/00 , C08G59/18 , H05K3/284 , H05K3/3421 , H05K2201/10689 , H05K2201/10977 , Y02P70/613
摘要： A method and encapsulation material are provided for processing an electronic circuit assembly having surface mount integrated circuit packages mounted with soldered leads to its substrate, in which encapsulation of the soldered lead joints serves to enhance the fatigue life of the solder joints. The encapsulation material is a reactive hot melt epoxy that is curable at temperatures significantly lower than that required for previous epoxy-based encapsulation materials. As such, processing of the circuit assembly is greatly facilitated, while the benefit of encapsulated solder joints is achieved for the assembly. The encapsulation material further includes a latent curative and a filler material for lower the coefficient of thermal expansion of the encapsulation material.
摘要翻译：提供了一种方法和封装材料，用于处理电子电路组件，该电子电路组件具有安装有焊接引线到其衬底的表面贴装集成电路封装，其中焊接引线接头的封装用于增强焊点的疲劳寿命。封装材料是反应性热熔环氧树脂，其在明显低于以前的环氧基封装材料所需的温度下可固化。因此，极大地方便了电路组件的处理，同时为组装实现了封装的焊点的益处。封装材料还包括用于降低封装材料的热膨胀系数的潜在固化剂和填充材料。

5. 发明授权

US5953814A Process for producing flip chip circuit board assembly exhibiting enhanced reliability 失效
标题翻译：用于制造具有增强的可靠性的倒装芯片电路板组件的工艺
公开(公告)号：US5953814A
公开(公告)日：1999-09-21
申请号：US32148
申请日：1998-02-27
申请人： Wayne Anthony Sozansky , Michael D. Gibson , Susan Acheson Mack , Michael Patrick Meehan , Darrel Eugene Peugh , James M. Rosson , Robin L. Sellers , Michael Ray Witty
发明人： Wayne Anthony Sozansky , Michael D. Gibson , Susan Acheson Mack , Michael Patrick Meehan , Darrel Eugene Peugh , James M. Rosson , Robin L. Sellers , Michael Ray Witty
IPC分类号： H01L21/56 , H01L21/60 , H05K3/28 , H05K3/34
CPC分类号： H01L24/81 , H01L21/563 , H01L2224/13111 , H01L2224/73203 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/351 , H05K3/284 , H05K3/3436 , H05K3/3452 , Y10T29/49144 , Y10T29/49146
摘要： A process and combination of materials for underfilling a surface-mount IC device (12), such as a flip chip, for the purpose of increasing the thermal cycle fatigue life of the terminals (14) that attach the device (12) to a thin-laminate organic circuit board (10), such as a printed wiring board (PWB) or printed circuit board (PCB). The process parameters and materials, including the underfill (20), masking (22) and cleaning materials used, exhibit a synergistic effect that increases thermal cycle fatigue resistance to a level at which a flip chip processed in accordance with this invention is capable of reliably withstanding at least 1000 one-hour cycles between -40.degree. C. and 150.degree. C. The materials and the manner in which the device (12) and circuit board (10) are prepared for application of the materials are critical to eliminating tendencies for inconsistent reliability in underfilled SM devices.
摘要翻译：为了增加将装置（12）附接到薄片（12）的端子（14）的热循环疲劳寿命的目的，用于底部填充表面安装IC器件（12）的倒装芯片的材料的处理和组合，层压有机电路板（10），例如印刷线路板（PWB）或印刷电路板（PCB）。包括底部填充物（20），掩模（22）和使用的清洁材料的工艺参数和材料表现出协同效应，其将热循环疲劳性提高到根据本发明加工的倒装芯片能够可靠地达到的水平在-40℃至150℃之间经受至少1000个一小时的循环。材料和设备（12）和电路板（10）准备用于施加材料的方式对消除未充足的SM设备的可靠性不一致。

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