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1. 发明申请

US20080000606A1 Middle layer of die structure that comprises a cavity that holds an alkali metal 有权
标题翻译：包含保持碱金属的空腔的模具结构的中间层
公开(公告)号：US20080000606A1
公开(公告)日：2008-01-03
申请号：US11900244
申请日：2007-09-11
申请人： Henry Abbink , William Debley , Christine Geosling , Daryl Sakaida , Robert Stewart
发明人： Henry Abbink , William Debley , Christine Geosling , Daryl Sakaida , Robert Stewart
IPC分类号： B22D25/02 , B22D27/00 , B22D27/15
CPC分类号： G04F5/14
摘要： An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.
摘要翻译：一个示例中的装置包括包括中间层，第一外层和第二外层的管芯结构。中间层包括保持碱金属的空腔，并且第一外层和第二外层中的一个包括通向空腔的通道。中间层，第一外层和第二外层包括来自一个或多个晶片衬底的管芯。

2. 发明申请

US20050236460A1 Middle layer of die structure that comprises a cavity that holds an alkali metal 有权
标题翻译：包含保持碱金属的空腔的模具结构的中间层
公开(公告)号：US20050236460A1
公开(公告)日：2005-10-27
申请号：US10831812
申请日：2004-04-26
申请人： Henry Abbink , William Debley , Christine Geosling , Daryl Sakaida , Robert Stewart
发明人： Henry Abbink , William Debley , Christine Geosling , Daryl Sakaida , Robert Stewart
IPC分类号： G04F5/14 , B22D1/00
CPC分类号： G04F5/14
摘要： An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.
摘要翻译：一个示例中的装置包括包括中间层，第一外层和第二外层的管芯结构。中间层包括保持碱金属的空腔，并且第一外层和第二外层中的一个包括通向空腔的通道。中间层，第一外层和第二外层包括来自一个或多个晶片衬底的管芯。

3. 发明授权

US09229026B2 Accelerometer systems and methods 有权
标题翻译：加速度计系统和方法
公开(公告)号：US09229026B2
公开(公告)日：2016-01-05
申请号：US13085900
申请日：2011-04-13
申请人： Robert E. Stewart , Daryl Sakaida , Michael D. Bulatowicz , Ming Li , John Thomson Douglass
发明人： Robert E. Stewart , Daryl Sakaida , Michael D. Bulatowicz , Ming Li , John Thomson Douglass
IPC分类号： G01P15/00 , G01P15/13 , G01C19/5705 , G01P15/125 , G01P15/08
CPC分类号： G01P15/131 , G01C19/5705 , G01P15/125 , G01P2015/0834
摘要： An accelerometer system can include a sensor element comprising first and second proofmasses, the first proofmass accelerating in a first direction and the second proofmass accelerating in a second direction opposite the first direction in response to an external acceleration. A force rebalance controller applies control signals to at least one control element to provide a first force to accelerate the first proofmass toward a first null position and to at least one control element to provide a second force to accelerate the second proofmass toward a second null position. The force rebalance controller can also generate opposite polarity first and second output signals associated with respective displacements of the first and second proofmasses relative to the respective first and second null positions. An acceleration component calculates the external acceleration based on the first and second output signals.
摘要翻译：加速度计系统可以包括传感器元件，该传感器元件包括第一和第二校准物，第一校准物质沿第一方向加速，第二校正物质响应于外部加速度沿与第一方向相反的第二方向加速。力重平衡控制器将控制信号施加到至少一个控制元件，以提供第一力，以将第一校正力朝着第一零位置加速，以及至少一个控制元件，以提供第二力以将第二校正力加速到第二零位置。力重平衡控制器还可以产生与第一和第二校准物相对于相应的第一和第二无效位置的相应位移相关联的相反极性的第一和第二输出信号。加速度分量基于第一和第二输出信号来计算外部加速度。

4. 发明授权

US08007166B2 Method for optimizing direct wafer bond line width for reduction of parasitic capacitance in MEMS accelerometers 有权
标题翻译：用于优化直接晶片接合线宽度以减少MEMS加速度计中的寄生电容的方法
公开(公告)号：US08007166B2
公开(公告)日：2011-08-30
申请号：US11914932
申请日：2006-05-24
申请人： Henry C. Abbink , Gabriel M. Kuhn , Howard Ge , Daryl Sakaida
发明人： Henry C. Abbink , Gabriel M. Kuhn , Howard Ge , Daryl Sakaida
IPC分类号： G01N25/06 , G01N25/14
CPC分类号： G01P15/0802 , B81C3/008 , G01P1/023 , G01P15/125 , G01P21/00 , G01P2015/0828
摘要： A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.
摘要翻译：一种用于通过减小第一和第二晶片之间的接合线的宽度来优化直接晶片接合线宽度以降低MEMS器件中的寄生电容的方法，将MEMS器件暴露于水蒸气预定时间段第一温度能够蒸发水，在能够冷冻水的第二温度下冷却MEMS器件，以及在能够冷冻水的第三温度下操作MEMS器件，以确定在操作期间是否存在不连续性。

5. 发明申请

US20120265481A1 ACCELEROMETER SYSTEMS AND METHODS 有权
标题翻译：加速度计系统和方法
公开(公告)号：US20120265481A1
公开(公告)日：2012-10-18
申请号：US13085900
申请日：2011-04-13
申请人： ROBERT E. STEWART , Daryl Sakaida , Michael D. Bulatowicz , Ming Li , John Thomson Douglass
发明人： ROBERT E. STEWART , Daryl Sakaida , Michael D. Bulatowicz , Ming Li , John Thomson Douglass
IPC分类号： G01P15/00
CPC分类号： G01P15/131 , G01C19/5705 , G01P15/125 , G01P2015/0834
摘要： An accelerometer system can include a sensor element comprising first and second proofmasses, the first proofmass accelerating in a first direction and the second proofmass accelerating in a second direction opposite the first direction in response to an external acceleration. A force rebalance controller applies control signals to at least one control element to provide a first force to accelerate the first proofmass toward a first null position and to at least one control element to provide a second force to accelerate the second proofmass toward a second null position. The force rebalance controller can also generate opposite polarity first and second output signals associated with respective displacements of the first and second proofmasses relative to the respective first and second null positions. An acceleration component calculates the external acceleration based on the first and second output signals.
摘要翻译：加速度计系统可以包括传感器元件，该传感器元件包括第一和第二校准物，第一校准物质沿第一方向加速，第二校正物质响应于外部加速度沿与第一方向相反的第二方向加速。力重平衡控制器将控制信号施加到至少一个控制元件，以提供第一力，以将第一校正力朝着第一零位置加速，以及至少一个控制元件，以提供第二力以将第二校正力加速到第二零位置。力重平衡控制器还可以产生与第一和第二校准物相对于相应的第一和第二无效位置的相应位移相关联的相反极性的第一和第二输出信号。加速度分量基于第一和第二输出信号来计算外部加速度。

6. 发明授权

US08579502B2 Method for determining leak rate through a bond line of a MEMS device 有权
标题翻译：用于确定通过MEMS器件的接合线的泄漏速率的方法
公开(公告)号：US08579502B2
公开(公告)日：2013-11-12
申请号：US13185723
申请日：2011-07-19
申请人： Henry C. Abbink , Gabriel M. Kuhn , Howard Ge , Daryl Sakaida
发明人： Henry C. Abbink , Gabriel M. Kuhn , Howard Ge , Daryl Sakaida
IPC分类号： G01N25/06 , G01N25/14
CPC分类号： G01P15/0802 , B81C3/008 , G01P1/023 , G01P15/125 , G01P21/00 , G01P2015/0828
摘要： A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.
摘要翻译：一种用于通过减小第一和第二晶片之间的接合线的宽度来优化直接晶片接合线宽度以降低MEMS器件中的寄生电容的方法，将MEMS器件暴露于水蒸气预定时间段第一温度能够蒸发水，在能够冷冻水的第二温度下冷却MEMS器件，以及在能够冷冻水的第三温度下操作MEMS器件，以确定在操作期间是否存在不连续性。

7. 发明申请

US20110271744A1 METHOD FOR DETERMINING LEAK RATE THROUGH A BOND LINE OF A MEMS DEVICE 有权
标题翻译：用于确定通过MEMS器件的连接线的泄漏速率的方法
公开(公告)号：US20110271744A1
公开(公告)日：2011-11-10
申请号：US13185723
申请日：2011-07-19
申请人： Henry C. Abbink , Gabriel M. Kuhn , Howard Ge , Daryl Sakaida
发明人： Henry C. Abbink , Gabriel M. Kuhn , Howard Ge , Daryl Sakaida
IPC分类号： G01M3/04
CPC分类号： G01P15/0802 , B81C3/008 , G01P1/023 , G01P15/125 , G01P21/00 , G01P2015/0828
摘要： A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.
摘要翻译：一种用于通过减小第一和第二晶片之间的接合线的宽度来优化直接晶片接合线宽度以降低MEMS器件中的寄生电容的方法，将MEMS器件暴露于水蒸气预定时间段第一温度能够蒸发水，在能够冷冻水的第二温度下冷却MEMS器件，以及在能够冷冻水的第三温度下操作MEMS器件，以确定在操作期间是否存在不连续性。

8. 发明申请

US20080184778A1 Method for Optimizing Direct Wafer Bond Line Width for Reduction of Parasitic Capacitance in Mems Accelerometers 有权
标题翻译：用于优化直接晶圆结合线宽度以减少Mems加速度计中寄生电容的方法
公开(公告)号：US20080184778A1
公开(公告)日：2008-08-07
申请号：US11914932
申请日：2006-05-24
申请人： Henry C. Abbink , Gabriel M. Kuln , Howard Ge , Daryl Sakaida
发明人： Henry C. Abbink , Gabriel M. Kuln , Howard Ge , Daryl Sakaida
IPC分类号： G01M3/04
CPC分类号： G01P15/0802 , B81C3/008 , G01P1/023 , G01P15/125 , G01P21/00 , G01P2015/0828
摘要： A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.
摘要翻译：一种用于通过减小第一和第二晶片之间的接合线的宽度来优化直接晶片接合线宽度以降低MEMS器件中的寄生电容的方法，将MEMS器件暴露于水蒸气预定时间段第一温度能够蒸发水，在能够冷冻水的第二温度下冷却MEMS器件，以及在能够冷冻水的第三温度下操作MEMS器件，以确定在操作期间是否存在不连续性。

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