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1. 发明申请

US20080000606A1 Middle layer of die structure that comprises a cavity that holds an alkali metal 有权
标题翻译：包含保持碱金属的空腔的模具结构的中间层
公开(公告)号：US20080000606A1
公开(公告)日：2008-01-03
申请号：US11900244
申请日：2007-09-11
申请人： Henry Abbink , William Debley , Christine Geosling , Daryl Sakaida , Robert Stewart
发明人： Henry Abbink , William Debley , Christine Geosling , Daryl Sakaida , Robert Stewart
IPC分类号： B22D25/02 , B22D27/00 , B22D27/15
CPC分类号： G04F5/14
摘要： An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.
摘要翻译：一个示例中的装置包括包括中间层，第一外层和第二外层的管芯结构。中间层包括保持碱金属的空腔，并且第一外层和第二外层中的一个包括通向空腔的通道。中间层，第一外层和第二外层包括来自一个或多个晶片衬底的管芯。

2. 发明申请

US20050236460A1 Middle layer of die structure that comprises a cavity that holds an alkali metal 有权
标题翻译：包含保持碱金属的空腔的模具结构的中间层
公开(公告)号：US20050236460A1
公开(公告)日：2005-10-27
申请号：US10831812
申请日：2004-04-26
申请人： Henry Abbink , William Debley , Christine Geosling , Daryl Sakaida , Robert Stewart
发明人： Henry Abbink , William Debley , Christine Geosling , Daryl Sakaida , Robert Stewart
IPC分类号： G04F5/14 , B22D1/00
CPC分类号： G04F5/14
摘要： An apparatus in one example comprises a die structure that comprises a middle layer, a first outside layer, and a second outside layer. The middle layer comprises a cavity that holds an alkali metal, and one of the first outside layer and the second outside layer comprises a channel that leads to the cavity. The middle layer, the first outside layer, and the second outside layer comprise dies from one or more wafer substrates.
摘要翻译：一个示例中的装置包括包括中间层，第一外层和第二外层的管芯结构。中间层包括保持碱金属的空腔，并且第一外层和第二外层中的一个包括通向空腔的通道。中间层，第一外层和第二外层包括来自一个或多个晶片衬底的管芯。

3. 发明申请

US20050212077A1 Dissipation of a charge buildup on a wafer portion 失效
标题翻译：在晶片部分上耗散电荷的耗散
公开(公告)号：US20050212077A1
公开(公告)日：2005-09-29
申请号：US10811512
申请日：2004-03-29
申请人： Youngmin Choi , Christine Geosling , Henry Abbink
发明人： Youngmin Choi , Christine Geosling , Henry Abbink
IPC分类号： B81B1/00 , B81C1/00 , H01L21/306 , H01L21/3065 , H01L21/8238 , H05F3/00
CPC分类号： H01L21/30655 , B81C1/00579
摘要： An apparatus in one example comprises a wafer portion that comprises a conduction layer. Upon exposure of the conduction layer during a etch of the wafer portion, the conduction layer serves to dissipate a portion of a charge buildup on the wafer portion during an etch of the wafer portion.
摘要翻译：一个示例中的装置包括包括导电层的晶片部分。在晶片部分的蚀刻期间，当导电层暴露时，导电层用于在晶片部分的蚀刻期间耗散晶片部分上的电荷积累的一部分。

4. 发明授权

US07038293B2 Dissipation of a charge buildup on a wafer portion 失效
标题翻译：在晶片部分上耗散电荷的耗散
公开(公告)号：US07038293B2
公开(公告)日：2006-05-02
申请号：US10811512
申请日：2004-03-29
申请人： Youngmin A. Choi , Christine Geosling , Henry Abbink
发明人： Youngmin A. Choi , Christine Geosling , Henry Abbink
IPC分类号： H01L29/00
CPC分类号： H01L21/30655 , B81C1/00579
摘要： An apparatus in one example comprises a wafer portion that comprises a conduction layer. Upon exposure of the conduction layer during a etch of the wafer portion, the conduction layer serves to dissipate a portion of a charge buildup on the wafer portion during an etch of the wafer portion.
摘要翻译：一个示例中的装置包括包括导电层的晶片部分。在晶片部分的蚀刻期间，当导电层暴露时，导电层用于在晶片部分的蚀刻期间耗散晶片部分上的电荷积累的一部分。

5. 发明申请

US20050202594A1 Vacuum sealed microdevice packaging with getters 有权
标题翻译：真空密封微型设备包装与吸气剂
公开(公告)号：US20050202594A1
公开(公告)日：2005-09-15
申请号：US10797322
申请日：2004-03-09
申请人： Christine Geosling
发明人： Christine Geosling
IPC分类号： B81B7/00 , G01C19/56 , G01C25/00 , H01L21/44 , H01L21/322 , H01L21/48 , H01L21/50
CPC分类号： B81C1/00285 , G01C19/56 , G01C25/00
摘要： One embodiment of the invention relates to a microdevice package containing getters for maintaining a constant vacuum level within the sealed microdevice package. A stacked wafer assembly, containing a plurality of microdevice packages, is formed by aligning a bottom cover wafer with a center wafer. The bottom cover wafer includes one or more bond pads to receive one or more getters. The center wafer includes one or more vias substantially aligned and corresponding to the one or more bond pads. One or more getters are inserted into the one or more vias. The stacked wafer assembly is completed by aligning a top cover wafer opposite the bottom cover wafer to sandwich the center wafer in between. A constant vacuum level is maintained inside the microdevice packages by aligning the wafers, activating the getters, and sealing the microdevice packages in a given sequence.
摘要翻译：本发明的一个实施方案涉及一种含有吸气剂的微型装置包，用于在密封微型装置包装内保持恒定的真空度。通过将底盖晶片与中心晶片对准来形成包含多个微器件封装的堆叠晶片组件。底盖晶片包括一个或多个接合焊盘以接收一个或多个吸气剂。中心晶片包括基本上对准并对应于一个或多个接合焊盘的一个或多个通孔。一个或多个吸气剂被插入到一个或多个通孔中。通过对准与底盖晶片相对的顶盖晶片将中间晶片夹在中间来完成堆叠的晶片组件。通过对准晶片，激活吸气剂并以给定的顺序密封微器件封装件，在微器件封装内保持恒定的真空度。

6. 发明申请

US20110123164A1 Implementation of one or more optical waveguides in reduced optical material 有权
公开(公告)号：US20110123164A1
公开(公告)日：2011-05-26
申请号：US12930986
申请日：2011-01-21
申请人： Christine Geosling
发明人： Christine Geosling
IPC分类号： G02B6/10 , H01L33/00
CPC分类号： G02B6/1345 , G02B6/1342 , G02B2006/1204
摘要： One or more first portions of a reduced optical material wafer are covered with a masking layer that leaves uncovered one or more second portions of the reduced optical material wafer. The reduced optical material wafer is exposed to an oxidizing atmosphere to reverse a reduction of the one or more second portions of the reduced optical material wafer that makes the one or more second portions receptive for implementation of one or more optical waveguides.

7. 发明授权

US07903920B2 Implementation of one or more optical waveguides in reduced optical material 有权
标题翻译：在减少的光学材料中实现一个或多个光波导
公开(公告)号：US07903920B2
公开(公告)日：2011-03-08
申请号：US11097600
申请日：2005-04-01
申请人： Christine Geosling
发明人： Christine Geosling
IPC分类号： H01L21/00
CPC分类号： G02B6/1345 , G02B6/1342 , G02B2006/1204
摘要： One or more first portions of a reduced optical material wafer are covered with a masking layer that leaves uncovered one or more second portions of the reduced optical material wafer. The reduced optical material wafer is exposed to an oxidizing atmosphere to reverse a reduction of the one or more second portions of the reduced optical material wafer that makes the one or more second portions receptive for implementation of one or more optical waveguides.
摘要翻译：还原的光学材料晶片的一个或多个第一部分被掩蔽层覆盖，该掩蔽层未被覆盖在还原的光学材料晶片上的一个或多个第二部分。减小的光学材料晶片暴露于氧化气氛以反转减小的光学材料晶片的一个或多个第二部分的减小，使得一个或多个第二部分可接受用于实现一个或多个光波导。

8. 发明申请

US20060148132A1 METHOD OF FABRICATING A VACUUM SEALED MICRODEVICE PACKAGE WITH GETTERS 有权
标题翻译：用于制造真空密封的MICRODEVICE包装的方法
公开(公告)号：US20060148132A1
公开(公告)日：2006-07-06
申请号：US11366088
申请日：2006-03-02
申请人： Christine Geosling
发明人： Christine Geosling
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： B81C1/00285 , G01C19/56 , G01C25/00
摘要： One embodiment of the invention relates to a microdevice package containing getters for maintaining a constant vacuum level within the sealed microdevice package. A stacked wafer assembly, containing a plurality of microdevice packages, is formed by aligning a bottom cover wafer with a center wafer. The bottom cover wafer includes one or more bond pads to receive one or more getters. The center wafer includes one or more vias substantially aligned and corresponding to the one or more bond pads. One or more getters are inserted into the one or more vias. The stacked wafer assembly is completed by aligning a top cover wafer opposite the bottom cover wafer to sandwich the center wafer in between. A constant vacuum level is maintained inside the microdevice packages by aligning the wafers, activating the getters, and sealing the microdevice packages in a given sequence.
摘要翻译：本发明的一个实施方案涉及一种含有吸气剂的微型装置包，用于在密封微型装置包装内保持恒定的真空度。通过将底盖晶片与中心晶片对准来形成包含多个微器件封装的堆叠晶片组件。底盖晶片包括一个或多个接合焊盘以接收一个或多个吸气剂。中心晶片包括基本上对准并对应于一个或多个接合焊盘的一个或多个通孔。一个或多个吸气剂被插入到一个或多个通孔中。通过对准与底盖晶片相对的顶盖晶片将中间晶片夹在中间来完成堆叠的晶片组件。通过对准晶片，激活吸气剂并以给定的顺序密封微器件封装件，在微器件封装内保持恒定的真空度。

9. 发明授权

US07042076B2 Vacuum sealed microdevice packaging with getters 有权
标题翻译：真空密封微型设备包装与吸气剂
公开(公告)号：US07042076B2
公开(公告)日：2006-05-09
申请号：US10797322
申请日：2004-03-09
申请人： Christine Geosling
发明人： Christine Geosling
IPC分类号： H01L23/20
CPC分类号： B81C1/00285 , G01C19/56 , G01C25/00
摘要： One embodiment of the invention relates to a microdevice package containing getters for maintaining a constant vacuum level within the sealed microdevice package. A stacked wafer assembly, containing a plurality of microdevice packages, is formed by aligning a bottom cover wafer with a center wafer. The bottom cover wafer includes one or more bond pads to receive one or more getters. The center wafer includes one or more vias substantially aligned and corresponding to the one or more bond pads. One or more getters are inserted into the one or more vias. The stacked wafer assembly is completed by aligning a top cover wafer opposite the bottom cover wafer to sandwich the center wafer in between. A constant vacuum level is maintained inside the microdevice packages by aligning the wafers, activating the getters, and sealing the microdevice packages in a given sequence.
摘要翻译：本发明的一个实施方案涉及一种含有吸气剂的微型装置包，用于在密封微型装置包装内保持恒定的真空度。通过将底盖晶片与中心晶片对准来形成包含多个微器件封装的堆叠晶片组件。底盖晶片包括一个或多个接合焊盘以接收一个或多个吸气剂。中心晶片包括基本上对准并对应于一个或多个接合焊盘的一个或多个通孔。一个或多个吸气剂被插入到一个或多个通孔中。通过对准与底盖晶片相对的顶盖晶片将中间晶片夹在中间来完成堆叠的晶片组件。通过对准晶片，激活吸气剂并以给定的顺序密封微器件封装件，在微器件封装内保持恒定的真空度。

10. 发明授权

US07078268B1 Method of fabricating a vacuum sealed microdevice package with getters 有权
标题翻译：用吸气剂制造真空密封微型装置包装的方法
公开(公告)号：US07078268B1
公开(公告)日：2006-07-18
申请号：US11366088
申请日：2006-03-02
申请人： Christine Geosling
发明人： Christine Geosling
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： B81C1/00285 , G01C19/56 , G01C25/00
摘要： One embodiment of the invention relates to a microdevice package containing getters for maintaining a constant vacuum level within the sealed microdevice package. A stacked wafer assembly, containing a plurality of microdevice packages, is formed by aligning a bottom cover wafer with a center wafer. The bottom cover wafer includes one or more bond pads to receive one or more getters. The center wafer includes one or more vias substantially aligned and corresponding to the one or more bond pads. One or more getters are inserted into the one or more vias. The stacked wafer assembly is completed by aligning a top cover wafer opposite the bottom cover wafer to sandwich the center wafer in between. A constant vacuum level is maintained inside the microdevice packages by aligning the wafers, activating the getters, and sealing the microdevice packages in a given sequence.
摘要翻译：本发明的一个实施方案涉及一种含有吸气剂的微型装置包，用于在密封微型装置包装内保持恒定的真空度。通过将底盖晶片与中心晶片对准来形成包含多个微器件封装的堆叠晶片组件。底盖晶片包括一个或多个接合焊盘以接收一个或多个吸气剂。中心晶片包括基本上对准并对应于一个或多个接合焊盘的一个或多个通孔。一个或多个吸气剂被插入到一个或多个通孔中。通过对准与底盖晶片相对的顶盖晶片将中间晶片夹在中间来完成堆叠的晶片组件。通过对准晶片，激活吸气剂并以给定的顺序密封微器件封装件，在微器件封装内保持恒定的真空度。

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