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1. 发明授权

US4684975A Molded semiconductor package having improved heat dissipation 失效
标题翻译：具有改善散热性能的模制半导体封装
公开(公告)号：US4684975A
公开(公告)日：1987-08-04
申请号：US809442
申请日：1985-12-16
申请人： Hem P. Takiar , Kamal N. Mehta
发明人： Hem P. Takiar , Kamal N. Mehta
IPC分类号： H01L23/495 , H01L23/36
CPC分类号： H01L24/50 , H01L23/49568 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082
摘要： An improved metal tape for tape automated bonding provides for enhanced heat dissipation from the packaged semiconductor device. The invention includes two aspects. In the first aspect, individual metal tape leads are extended inward beyond the peripheral bonding pads of the semiconductor and over the active region of the semiconductor device. In this way, the leads are able to conduct heat away from the active region of the device. The second aspect of the invention relates to improved heat dissipation through the individual leads. The leads are flared or otherwise increased in area in the direction away from the active region of the semiconductor device to prove the radiative dissipation.
摘要翻译：用于胶带自动接合的改进的金属带提供了从封装的半导体器件增强的散热。本发明包括两个方面。在第一方面中，单独的金属带引线向内延伸超过半导体的周边接合焊盘并超过半导体器件的有源区。以这种方式，引线能够从设备的有源区域传导热量。本发明的第二方面涉及通过各个引线改善散热。引线在远离半导体器件的有源区域的方向上以面积扩大或以其它方式增加，以证明辐射耗散。

2. 发明申请

US20090134228A1 MEMORY CARDS HAVING TWO STANDARD SETS OF CONTACTS AND A HINGED CONTACT COVERING MECHANISM 有权
标题翻译：具有两个标准联系人和铰链接触覆盖机构的记忆卡
公开(公告)号：US20090134228A1
公开(公告)日：2009-05-28
申请号：US12361165
申请日：2009-01-28
申请人： Robert C. Miller , Hem P. Takiar , Joel Jacobs , Robert Howard , Motohide Hatanaka , Robert F. Wallace , Edwin J. Cuellar , Eliyahou Harari
发明人： Robert C. Miller , Hem P. Takiar , Joel Jacobs , Robert Howard , Motohide Hatanaka , Robert F. Wallace , Edwin J. Cuellar , Eliyahou Harari
IPC分类号： G06K19/067 , G06F3/00
CPC分类号： G06K19/077 , G06K19/07732 , G06K19/07733 , G06K19/07741 , G06K19/07743 , H01R13/447 , H01R27/00
摘要： Enclosed re-programmable non-volatile memory cards include at least two sets of electrical contacts to which the internal memory is connected. The two sets of contacts have different patterns, preferably in accordance with two different contact standards such as a memory card standard and that of the Universal Serial Bus (USB). One memory card standard that can be followed is that of the Secure Digital (SD) card. The cards can thus be used with different hosts that are compatible with one set of contacts but not the other. A cover that is hinged to the card to normally cover one set of contacts can be manually rotated out of the way when that set of contacts is being used.
摘要翻译：封闭的可重新编程的非易失性存储卡包括至少两组电触点，内部存储器与之连接。两组触点具有不同的图案，优选地根据两种不同的接触标准，例如存储卡标准和通用串行总线（USB）的标准。可以遵循的一种存储卡标准是安全数字（SD）卡的标准。因此，这些卡可以与与一组联系而不是另一组相容的不同主机使用。当使用该组触点时，铰接到卡上的盖通常覆盖一组触点可以手动旋转。

3. 发明授权

US07416132B2 Memory card with and without enclosure 有权
标题翻译：带和不带外壳的存储卡
公开(公告)号：US07416132B2
公开(公告)日：2008-08-26
申请号：US10851466
申请日：2004-05-20
申请人： Hem P. Takiar , Robert Miller
发明人： Hem P. Takiar , Robert Miller
IPC分类号： G06K19/06
CPC分类号： G06K19/07732 , G06K13/0825 , G06K19/077 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2924/01004 , H01L2924/1815 , H01L2924/19041 , H05K1/02 , H05K1/0268 , H05K1/117 , H05K3/284 , H05K2201/09045 , H05K2201/09154 , H05K2203/0271 , Y10T29/4913 , H01L2924/00014
摘要： The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.
摘要翻译：大致描述的本发明涉及一种小型存储卡，其包括允许存储卡更容易由用户处理的特征。在各种实施例中，存储卡可以包括倒角和/或凸起部分，其允许存储卡被人的手（或机械装置）更容易地抓住，并且还提供额外的空间以存储诸如电容器和/ 或电阻。因为不同的电子设备使用不同类型的存储卡，所以提供了一种适配器，其允许本文所公开的存储卡被用在用于其他类型的存储卡的电子设备上的端口或连接器中。

4. 发明授权

US07340540B2 Memory card with contacts, device connector, and a connector covering mechanism 有权
标题翻译：带触点，设备连接器和连接器覆盖机构的存储卡
公开(公告)号：US07340540B2
公开(公告)日：2008-03-04
申请号：US11419172
申请日：2006-05-18
申请人： Robert C. Miller , Hem P. Takiar , Joel Jacobs , Robert Howard , Motohide Hatanaka , Robert F. Wallace , Edwin J. Cuellar , Eliyahou Harari , Matt Peterson
发明人： Robert C. Miller , Hem P. Takiar , Joel Jacobs , Robert Howard , Motohide Hatanaka , Robert F. Wallace , Edwin J. Cuellar , Eliyahou Harari , Matt Peterson
IPC分类号： G06F3/00
CPC分类号： G06K19/077 , G06K19/07732 , G06K19/07733 , G06K19/07741 , G06K19/07743 , H01R13/447 , H01R27/00
摘要： Enclosed re-programmable non-volatile memory cards include at least two sets of electrical contacts to which the internal memory is connected. The two sets of contacts have different patterns, preferably in accordance with two different contact standards such as a memory card standard and that of the Universal Serial Bus (USB). One memory card standard that can be followed is that of the Secure Digital (SD) card. The cards can thus be used with different hosts that are compatible with one set of contacts but not the other. A cover that is hinged to the card to normally cover one set of contacts can be rotated out of the way by hand when that set of contacts is being used.
摘要翻译：封闭的可重新编程的非易失性存储卡包括至少两组电触点，内部存储器与之连接。两组触点具有不同的图案，优选地根据两种不同的接触标准，例如存储卡标准和通用串行总线（USB）的标准。可以遵循的一种存储卡标准是安全数字（SD）卡的标准。因此，这些卡可以与与一组联系而不是另一组相容的不同主机使用。当使用该组触点时，铰接到卡上的盖通常覆盖一组触点可以手动旋转。

5. 发明授权

US07094633B2 Method for efficiently producing removable peripheral cards 有权
公开(公告)号：US07094633B2
公开(公告)日：2006-08-22
申请号：US10602373
申请日：2003-06-23
申请人： Hem P. Takiar
发明人： Hem P. Takiar
IPC分类号： H01L21/48
CPC分类号： H01L21/6835 , G06K19/077 , G06K19/07718 , G06K19/07732 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/544 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2221/68331 , H01L2223/54473 , H01L2223/54486 , H01L2224/05599 , H01L2224/32145 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention is that the integrated circuit products are produced a batch at a time, and that singulation of the batch into individualized integrated circuit products uses a non-linear (e.g., non-rectangular or curvilinear) sawing or cutting action so that the resulting individualized integrated circuit packages no longer need to be completely rectangular. Another aspect of the invention is that the integrated circuit products can be produced with semiconductor assembly processing such that the need to provide an external package or container becomes optional.

6. 外观设计

USD525623S1 Memory card 有权
公开(公告)号：USD525623S1
公开(公告)日：2006-07-25
申请号：US29236672
申请日：2005-08-19
申请人： Hem P. Takiar , Michael W. Patterson
设计人： Hem P. Takiar , Michael W. Patterson

7. 外观设计

USD523435S1 Memory card 失效
公开(公告)号：USD523435S1
公开(公告)日：2006-06-20
申请号：US29194064
申请日：2003-11-19
申请人： Hem P. Takiar , Michael W. Patterson
设计人： Hem P. Takiar , Michael W. Patterson

8. 发明授权

US06521970B1 Chip scale package with compliant leads 有权
标题翻译：芯片级封装符合引脚
公开(公告)号：US06521970B1
公开(公告)日：2003-02-18
申请号：US09653820
申请日：2000-09-01
申请人： Hem P. Takiar , Nikhil Vishwanath Kelkar
发明人： Hem P. Takiar , Nikhil Vishwanath Kelkar
IPC分类号： H01L2900
CPC分类号： H01L24/12 , H01L23/3114 , H01L24/11 , H01L2224/0231 , H01L2224/02335 , H01L2224/0401 , H01L2224/05008 , H01L2224/05666 , H01L2224/13099 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/01029 , H01L2924/013
摘要： A wafer level fabricated chip scale integrated circuit package having an air gap formed between the integrated circuit die of the package and compliant leads located over and conductively attached to the die is described. Contact bumps offset on the compliant leads provide for connection of the integrated circuit package to other substrates. In some embodiments, the compliant leads include a conductive layer overlaid with an outer resilient layer, and may further include an inner resilient layer beneath the conductive layer. The outer resilient layer has a via formed through it exposing the underlying conductive layer. The via is offset along the compliant lead a horizontal distance from the bond pad to which the compliant lead is conductively coupled. The chip scale package provides a highly compliant connection between the die and any substrate that the die is attached to.
摘要翻译：描述了一种晶片级制造的芯片级集成电路封装，其具有形成在封装的集成电路管芯之间的空气间隙和位于管芯上并导电地附接于管芯的柔性引线。柔性引线上的接触凸块偏移可提供集成电路封装与其他基板的连接。在一些实施例中，柔性引线包括覆盖有外部弹性层的导电层，并且还可以包括导电层下面的内部弹性层。外部弹性层具有通过其形成的通孔，其暴露下面的导电层。通孔沿柔性引线偏离与接合焊盘的水平距离，其中顺应引线与导电耦合。芯片尺寸封装提供了管芯与管芯所连接的任何衬底之间高度兼容的连接。

9. 发明授权

US06459143B2 Method of packaging fuses 失效
标题翻译：包装保险丝的方法
公开(公告)号：US06459143B2
公开(公告)日：2002-10-01
申请号：US09844062
申请日：2001-04-26
申请人： Inderjit Singh , Hem P. Takiar , Ranjan J. Mathew , Nikhil V. Kelkar
发明人： Inderjit Singh , Hem P. Takiar , Ranjan J. Mathew , Nikhil V. Kelkar
IPC分类号： H01L2358
CPC分类号： H01L23/62 , H01L2224/13
摘要： Improved methods of packaging external fuses together with integrated circuit devices are described. A pair of frame strips are provided that each have an associated set of contact pads. A resistor paste is applied to one of the contact pad sets and the frame strips are laminated together by curing the resistor paste which is positioned between the contact pad sets. Dice are mounted to the opposite sides of the second contact pads to form integrated circuit devices having integrally packaged external fuses. The packaged devices are eventually singulated for use. In some embodiments, the contact pads each have downturned tabs that form wings on opposite sides of each die. When the dice are flip chips, a device may be attached to a substrate board by soldering both the bumps on the die and the tab wing tips to the substrate board. In a preferred embodiment, the resistor paste is a positive temperature coefficient resistor paste.
摘要翻译：描述了与集成电路器件一起封装外部保险丝的改进方法。提供了一对框带，每个框带具有一组相关的接触垫。将电阻浆料施加到接触垫组中的一个，并且通过固化位于接触垫组之间的电阻浆料将框带层压在一起。骰子安装到第二接触焊盘的相对侧，以形成具有整体封装的外部熔断器的集成电路器件。封装的装置最终被单独使用。在一些实施例中，接触垫每个都具有在每个管芯的相对侧上形成翅膀的下降的突片。当芯片是倒装芯片时，可以通过将裸片上的凸起和凸片翼尖焊接到基板来将装置附接到基板。在优选实施例中，电阻膏是正温度系数电阻膏。

10. 发明授权

US06384890B1 Connection assembly for reflective liquid crystal projection with branched PCB display 有权
标题翻译：具有分支PCB显示的反射液晶投影连接组件
公开(公告)号：US06384890B1
公开(公告)日：2002-05-07
申请号：US09440218
申请日：1999-11-15
申请人： Hem P. Takiar , Ranjan J. Mathew
发明人： Hem P. Takiar , Ranjan J. Mathew
IPC分类号： G02F11345
CPC分类号： G02F1/13452 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H04N9/3105 , H04N9/317 , H05K1/118 , H05K3/361 , H01L2924/00014 , H01L2924/00
摘要： A connection assembly (40) for operably coupling a plurality of independent imaging devices (41, 41′, 41″) to an optical subsystem (42). The connection assembly (40) includes a unitary flex circuit device (43) having an elongated arm portion (45), and a plurality independent finger portions (46, 46′, 46″) extending from a distal end of the arm portion (45). Each finger portion (46, 46′, 46″) defines a coupling region (47, 47′, 47″) adapted to operably couple a respective imaging device (41, 41′, 41″) to a respective finger portion (46, 46′, 46″) for support thereof. The finger portions (46, 46′, 46″) are further adapted to strategically couple each respective imaging device (41, 41′, 41″) to the optical subsystem (42) as a unit. The flex circuit device (30) includes a plurality of circuits (65) terminating at respective terminals (40) of a coupling region (47) thereof. The terminals (66) supportively and communicably coupled to the bond pads (67) of the die (58) for support thereof. The coupling region (47) further includes an adhesive mount (76) mounting the flex circuit device (43) to the transparent plate to supportably suspend the display assembly (57) between the die (58) and the transparent plate (61).
摘要翻译：一种用于将多个独立成像装置（41,41'，41“）可操作地耦合到光学子系统（42）的连接组件（40）。连接组件（40）包括具有细长臂部分（45）的单一柔性电路装置（43）和从臂部分的远端延伸的多个独立的指状部分（46,46'，46“） 45）。每个指部分（46,46'，46“）限定适于将相应的成像装置（41,41'，41”）可操作地耦合到相应的手指部分的耦合区域（47,47'，47“）（46,46'，46“），用于支撑它。手指部分（46,46'，46“）还适于将每个相应的成像装置（41,41'，41”）策略性地耦合到作为一个单元的光学子系统（42）。柔性电路装置（30）包括终止于其耦合区域（47）的各个端子（40）处的多个电路（65）。端子（66）支撑并可通信地耦合到模具（58）的接合焊盘（67）以用于其支撑。耦合区域（47）还包括将柔性电路装置（43）安装到透明板上以将显示组件（57）可支撑地悬挂在模具（58）和透明板（61）之间的粘合剂安装件（76）。

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