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1. 发明授权

US08167659B2 Connector block feature 有权
标题翻译：连接器块功能
公开(公告)号：US08167659B2
公开(公告)日：2012-05-01
申请号：US12983752
申请日：2011-01-03
申请人： Robert C. Miller
发明人： Robert C. Miller
IPC分类号： H01R24/00
CPC分类号： H01R27/00 , H01R13/642
摘要： A memory card connector, within a slot of a host device, for receiving a first memory card having a first row of contact fingers and a second row of contact fingers and a second memory card having only a single row of contact fingers. The memory card connector includes a first row of contact pins, a second row of contact pins and a protrusion. The first row of contact pins are configured to mate with the first row of contact fingers of the first memory card. The second row of contact pins are configured to mate with the second row of contact fingers of the first memory card. The protrusion is received within a contact finger in the second row of contact fingers of the first memory card to allow full insertion of the first memory card into the connector, and abuts against a distal end of one of the contact fingers of the second memory card to prevent full insertion of the second memory card into the connector.
摘要翻译：一种存储卡连接器，位于主机设备的插槽内，用于接收具有第一行接触指和第二行接触指的第一存储卡，以及仅具有单排接触指的第二存储卡。存储卡连接器包括第一排接触针，第二排接触针和突起。第一排接触针被配置为与第一存储卡的第一行接触指针配合。第二排接触针被配置为与第一存储卡的第二排接触指针配合。突起被接收在第一存储卡的第二排接触指的接触指状物内，以允许将第一存储卡完全插入连接器中，并且抵靠第二存储卡的一个接触指的远端以防止将第二存储卡完全插入连接器。

2. 发明申请

US20120009732A1 SYSTEM-IN-A-PACKAGE BASED FLASH MEMORY CARD 有权
公开(公告)号：US20120009732A1
公开(公告)日：2012-01-12
申请号：US13235852
申请日：2011-09-19
申请人： Hem Takiar , Robert C. Miller , Warren Middlekauff , Michael W. Patterson , Shrikar Bhagath
发明人： Hem Takiar , Robert C. Miller , Warren Middlekauff , Michael W. Patterson , Shrikar Bhagath
IPC分类号： H01L21/56
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

3. 发明授权

US08022519B2 System-in-a-package based flash memory card 有权
标题翻译：基于系统的包装闪存卡
公开(公告)号：US08022519B2
公开(公告)日：2011-09-20
申请号：US11133576
申请日：2005-05-19
申请人： Hem Takiar , Robert C. Miller , Warren Middlekauff , Michael W. Patterson , Shrikar Bhagath
发明人： Hem Takiar , Robert C. Miller , Warren Middlekauff , Michael W. Patterson , Shrikar Bhagath
IPC分类号： H01L23/02
CPC分类号： G06K19/07745 , G06K19/07732 , G11C5/04 , H01L21/565 , H01L23/3107 , H01L24/48 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L2223/5442 , H01L2223/54433 , H01L2223/54473 , H01L2223/54486 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K1/181 , H05K3/0052 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
摘要翻译：一种基于系统的基于包的闪存卡，其包括集成电路封装，其占据卡内的小的整体区域并且被切割以符合卡的盖的形状。集成电路可以从面板切割成适合于并符合成品存储卡（例如SD卡）的盖的形状的形状。集成电路封装可以是系统级封装，多芯片模块或其中在单个封装中形成完整电子系统的其它布置。

4. 外观设计

USD628202S1 MicroSD memory card with different color surfaces 有权
标题翻译：具有不同颜色表面的MicroSD存储卡
公开(公告)号：USD628202S1
公开(公告)日：2010-11-30
申请号：US29359213
申请日：2010-04-07
申请人： Itzhak Pomerantz , Robert C. Miller
设计人： Itzhak Pomerantz , Robert C. Miller

5. 发明授权

US07822883B2 Memory card with two standard sets of contacts and a hinged contact covering mechanism 有权
标题翻译：存储卡带两个标准触点和一个铰链式触点覆盖机构
公开(公告)号：US07822883B2
公开(公告)日：2010-10-26
申请号：US12361165
申请日：2009-01-28
申请人： Robert C. Miller , Hem P. Takiar , Joel Jacobs , Robert A. Howard , Motohide Hatanaka , Robert F. Wallace , Edwin J. Cuellar , Eliyahou Harari
发明人： Robert C. Miller , Hem P. Takiar , Joel Jacobs , Robert A. Howard , Motohide Hatanaka , Robert F. Wallace , Edwin J. Cuellar , Eliyahou Harari
IPC分类号： G06F3/00
CPC分类号： G06K19/077 , G06K19/07732 , G06K19/07733 , G06K19/07741 , G06K19/07743 , H01R13/447 , H01R27/00
摘要： Enclosed re-programmable non-volatile memory cards include at least two sets of electrical contacts to which the internal memory is connected. The two sets of contacts have different patterns, preferably in accordance with two different contact standards such as a memory card standard and that of the Universal Serial Bus (USB). One memory card standard that can be followed is that of the Secure Digital (SD) card. The cards can thus be used with different hosts that are compatible with one set of contacts but not the other. A cover that is hinged to the card to normally cover one set of contacts can be manually rotated out of the way when that set of contacts is being used.
摘要翻译：封闭的可重新编程的非易失性存储卡包括至少两组电触点，内部存储器连接至该组。两组触点具有不同的图案，优选地根据两种不同的接触标准，例如存储卡标准和通用串行总线（USB）的标准。可以遵循的一种存储卡标准是安全数字（SD）卡的标准。因此，这些卡可以与与一组联系而不是另一组相容的不同主机使用。当使用该组触点时，铰接到卡上的盖通常覆盖一组触点可以手动旋转。

6. 发明授权

US07784240B2 Modular track system for exterior decorative trim 有权
标题翻译：用于外部装饰装饰的模块化轨道系统
公开(公告)号：US07784240B2
公开(公告)日：2010-08-31
申请号：US12009506
申请日：2008-01-18
申请人： Robert C. Miller
发明人： Robert C. Miller
IPC分类号： E04C5/00
CPC分类号： E04F19/02 , E04F2011/1868
摘要： A modular exterior decorative track molding assembly including a securing track having a base section including a first channel portion, and a securing section including a second channel portion; the securing section having securing lips and a narrowed width relative to the base section; a trim module having a support rail carrying a decorative trim element received in the securing track; the support rail having a complementary shape to the base section and the securing section and including retaining channels receiving the securing lips of the securing track to resist separation between the securing track and the support rail; and, a trim element base included in the support rail carrying a decorative trim element and disposed between the retaining channels, wherein the trim element base extends through a trim module opening of the securing track.
摘要翻译：一种模块化的外部装饰轨道模制组件，包括具有包括第一通道部分的基部的固定轨道和包括第二通道部分的固定部分; 所述固定部分具有固定唇部并且相对于所述基部部分的宽度变窄; 装饰模块，其具有承载在所述固定轨道中的装饰装饰元件的支撑轨道; 所述支撑轨道具有与所述基部部分和所述固定部分互补的形状，并且包括保持通道，所述保持通道接收所述固定轨道的固定唇缘以抵抗所述固定轨道和所述支撑轨道之间的分离; 以及包括在所述支撑轨道中的装饰元件基座，其承载装饰装饰元件并且设置在所述保持通道之间，其中所述装饰元件基座延伸穿过所述固定轨道的修剪模块开口。

7. 发明授权

US07772686B2 Memory card fabricated using SiP/SMT hybrid technology 有权
标题翻译：使用SiP / SMT混合技术制造的存储卡
公开(公告)号：US07772686B2
公开(公告)日：2010-08-10
申请号：US11769954
申请日：2007-06-28
申请人： Ning Ye , Robert C. Miller , Cheemen Yu , Hem Takiar , Andre McKenzie
发明人： Ning Ye , Robert C. Miller , Cheemen Yu , Hem Takiar , Andre McKenzie
IPC分类号： H01L23/52 , H01L23/58 , H01L23/48
CPC分类号： G11C29/48 , G11C29/1201 , H01L23/5388 , H01L2224/16225 , H05K1/0271 , H05K1/117 , H05K1/141 , H05K2201/09063 , H05K2201/10159
摘要： A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.
摘要翻译：公开了一种由多模组件形成的便携式存储卡及其制造方法。一个这样的多模组件包括LGA SiP半导体封装和两个贴在PCB上的基于引线框架的SMT封装。如此形成的多模组件可以被封装在标准盖中以形成完整的便携式存储卡，例如标准SD TM卡。 LGA SiP封装上用于测试封装制造后的操作的测试焊盘也可用于将LGA SiP封装物理和电耦合到PCB。

8. 发明授权

US07710736B2 Memory card with latching mechanism for hinged cover 失效
标题翻译：带铰链盖的锁定机构的存储卡
公开(公告)号：US07710736B2
公开(公告)日：2010-05-04
申请号：US11462430
申请日：2006-08-04
申请人： Warren Middlekauff , Robert C. Miller
发明人： Warren Middlekauff , Robert C. Miller
IPC分类号： H05K5/03
CPC分类号： G06K19/077 , G06K19/07732 , G06K19/07743 , H01R12/88 , H05K5/026 , H05K5/0278
摘要： An enclosed re-programmable non-volatile memory card includes a cover that is hinged to the card to normally cover a set of external contacts to which the memory is connected but which can be rotated out of the way by hand to expose that set of contacts for connection with a mating receptacle of a host device. A second set of electrical contacts having a different pattern than the covered set may also be provided on the card. The covered set of contacts may be in accordance with the universal serial bus (USB) plug standards. A latching mechanism built into the hinged cover holds it firmly in a closed position but allows its manual release to expose the covered set of contacts. One exemplary release mechanism utilizes a resiliently held element that is moveable by hand against the resilience, and another employs a hand slideable latch.
摘要翻译：封闭的可重新编程的非易失性存储卡包括铰链到卡的盖，以正常覆盖一组外部触点，存储器连接到该外部触点，但是可以用手旋转以露出该组触点用于与主机设备的配合插座连接。具有与覆盖组不同的图案的第二组电触点也可以设置在卡上。覆盖的触点组可能符合通用串行总线（USB）插头标准。内置在铰链盖中的锁定机构将其牢固地保持在关闭位置，但允许其手动释放以暴露所覆盖的一组触点。一种示例性的释放机构利用可弹性保持的元件，该元件可用手抵靠弹性移动，另一种采用手动滑动闩锁。

9. 发明申请

US20090001365A1 MEMORY CARD FABRICATED USING SIP/SMT HYBRID TECHNOLOGY 有权
标题翻译：使用SIP / SMT混合技术制作的记忆卡
公开(公告)号：US20090001365A1
公开(公告)日：2009-01-01
申请号：US11769954
申请日：2007-06-28
申请人： Ning Ye , Robert C. Miller , Cheemen Yu , Hem Takiar , Andre McKenzie
发明人： Ning Ye , Robert C. Miller , Cheemen Yu , Hem Takiar , Andre McKenzie
IPC分类号： H01L23/58 , H01L23/48
CPC分类号： G11C29/48 , G11C29/1201 , H01L23/5388 , H01L2224/16225 , H05K1/0271 , H05K1/117 , H05K1/141 , H05K2201/09063 , H05K2201/10159
摘要： A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.
摘要翻译：公开了一种由多模组件形成的便携式存储卡及其制造方法。一个这样的多模组件包括LGA SiP半导体封装和两个贴在PCB上的基于引线框架的SMT封装。如此形成的多模组件可以被封装在标准盖中以形成完整的便携式存储卡，例如标准SD（TM）卡。 LGA SiP封装上用于测试封装制造后的操作的测试焊盘也可用于将LGA SiP封装物理和电耦合到PCB。

10. 外观设计

USD548740S1 SIP based flash memory card 有权
标题翻译：基于SIP的闪存卡
公开(公告)号：USD548740S1
公开(公告)日：2007-08-14
申请号：US29230382
申请日：2005-05-19
申请人： Hem Takiar , Robert C. Miller , Warren Middlekauff , Michael W. Patterson , Shrikar Bhagath
设计人： Hem Takiar , Robert C. Miller , Warren Middlekauff , Michael W. Patterson , Shrikar Bhagath

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