专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5038496A Vapor reflow type soldering apparatus 失效
标题翻译：蒸汽回流焊接装置
公开(公告)号：US5038496A
公开(公告)日：1991-08-13
申请号：US385160
申请日：1989-07-26
申请人： Haruo Mishina , Shinya Yamama , Yukio Yamada , Keizo Tsuchiya
发明人： Haruo Mishina , Shinya Yamama , Yukio Yamada , Keizo Tsuchiya
IPC分类号： B23K1/015
CPC分类号： B23K1/015
摘要： A vapor reflow type soldering apparatus comprises a vapor generating tank disposed substantially centrally in the apparatus for receiving therein a thermal medium and saturated vapor of said thermal medium; a preheating chamber arranged upstream of the vapor generating tank; a cooling chamber arranged downstream of the vapor generating tank; an inlet side passage connecting the vapor generating tank and the preheating chamber; an outlet side passage connecting the vapor generating tank and the cooling chamber; a conveyor extending horizontally through the preheating chamber, the inlet side passage, the vapor generating tank, the outlet side passage and the cooling chamber, wherein the conveyor can vary the width thereof; an outlet side exhaust port provided at the outlet side passage; an inlet side cooler arranged beneath the inlet side passage and having a cover at an upper position thereof; an outlet side cooler arranged beneath the outlet side passage and extending close to the outlet side exhaust port; a lower vapor discharge opening formed below the conveyor within the vapor generating tank; and a shutter connected with a movable conveyor guide and also with the peripheral part of the lower vapor discharge opening, whereby the opening area of said lower vapor discharge opening can be varied as the movable conveyor guide is moved widthwise.
摘要翻译：蒸汽回流型焊接装置包括蒸发发生罐，其基本上设置在该装置中的中间，用于在其中容纳热介质和所述热介质的饱和蒸气; 预热室，其布置在所述蒸汽发生罐的上游; 布置在蒸汽发生罐下游的冷却室; 连接蒸汽发生罐和预热室的入口侧通道; 连接蒸汽发生罐和冷却室的出口侧通道; 输送机横向延伸穿过预热室，入口侧通道，蒸汽发生罐，出口侧通道和冷却室，其中输送机可以改变其宽度; 出口侧排气口，设置在出口侧通道; 入口侧冷却器，其布置在入口侧通道下方并且在其上部位置具有盖; 出口侧冷却器，布置在出口侧通道下方并且靠近出口侧排气口延伸; 在蒸汽发生罐内形成在输送机下面的较低蒸汽排放口; 以及与可移动的输送机引导件连接并且还与下部蒸汽排出口的周边部分连接的闸门，由此可移动的输送机引导件沿宽度方向移动，所述下部蒸汽排出口的开口面积可以变化。

2. 发明授权

US4996781A Vapor reflow type soldering apparatus with an improved flux separating unit 失效
标题翻译：具有改进的通量分离装置的蒸汽回流焊接装置
公开(公告)号：US4996781A
公开(公告)日：1991-03-05
申请号：US426434
申请日：1989-10-25
申请人： Haruo Mishina , Yushi Takahashi , Keizo Tsuchiya
发明人： Haruo Mishina , Yushi Takahashi , Keizo Tsuchiya
IPC分类号： B23K1/012
CPC分类号： B23K1/012
摘要： A vapor reflow type soldering apparatus comprising a tank that is filled with saturated vapor of a heat medium and a passage extending through the tank. An article to be processed is transferred through the passage and is brought into contact with the saturated vapor so that a solder material on the article is heated and molten. Also, a discharge gas collecting unit is provided in the apparatus and includes a chilled water system through which water at a constant temperature is caused to flow. The heat medium is collected out of the discharge gas from the apparatus and is returned back to a tank. A flux separating unit is connected to the chilled water system of the discharge gas unit through a pipes and switching valves. The chilled water in the chilled water system is selectively introduced into the flux separating unit to cool the heat medium within the tank, and a flux molten into the heat medium is removed from the molten solder material.
摘要翻译：一种蒸汽回流焊接装置，其包括填充有热介质的饱和蒸气的罐和延伸穿过该罐的通道。待处理的物品通过通道转移并与饱和蒸气接触，使得物品上的焊料材料被加热并熔融。此外，在该装置中设置有放电气体收集单元，并且包括冷却水系统，通过该冷却水系统使恒定温度的水流过。热介质从设备的排出气体中收集出来并返回到罐中。通量分配单元通过管道和切换阀连接到排放气体单元的冷冻水系统。冷冻水系统中的冷冻水被选择性地引入通量分离单元以冷却罐内的热介质，并且熔融到热介质中的焊剂从熔融焊料材料中去除。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式