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1. 发明授权

US4809443A Apparatus for fixing electronic parts to printed circuit board 失效
标题翻译：用于将电子部件固定到印刷电路板的装置
公开(公告)号：US4809443A
公开(公告)日：1989-03-07
申请号：US943749
申请日：1986-12-19
申请人： Haruo Mishina , Yukio Yamada , Noriaki Mukai , Yushi Takahashi
发明人： Haruo Mishina , Yukio Yamada , Noriaki Mukai , Yushi Takahashi
IPC分类号： B23K1/015 , H05K3/34 , F26B21/06
CPC分类号： B23K1/015 , H05K3/3489
摘要： An apparatus for fixing electronic parts to a printed circuit board is disclosed which comprises a vapor generating tank or boiling and generating a thermal medium and a returning tank for receiving the thermal medium containing flux. The vapor generating tank and the returning tank are separated from each other. By utilizing the level difference between the vapor generating tank and the returning tank, the thermal medium is charged into a flux separator and discharged therefrom. Thus, the mixture of the flux into the thermal medium may be reduced and its maintenance work may readily be carried out, thereby reducing a running cost of the apparatus.
摘要翻译：公开了一种用于将电子部件固定到印刷电路板的装置，其包括蒸汽发生罐或沸腾并产生热介质和用于接收含有焊剂的热介质的返回槽。蒸汽发生罐和返回槽彼此分离。通过利用蒸汽发生罐和返回槽之间的液位差，将热介质装入助熔剂中并从其中排出。因此，可以减少进入热介质的助熔剂的混合物，并且可以容易地进行其维护工作，从而降低装置的运行成本。

2. 发明授权

US4776105A Apparatus for fixing electronic parts to printed circuit board 失效
标题翻译：将电子部件固定到印刷电路板的装置
公开(公告)号：US4776105A
公开(公告)日：1988-10-11
申请号：US944572
申请日：1986-12-22
申请人： Haruo Mishina , Yukio Yamada , Noriaki Mukai , Yushi Takahashi
发明人： Haruo Mishina , Yukio Yamada , Noriaki Mukai , Yushi Takahashi
IPC分类号： B23K1/015 , H05K13/04 , F26B15/18
CPC分类号： B23K1/015 , H05K13/0465
摘要： An apparatus for fitting electronic parts to a printed circuit board is disclosed which comprises a collector for collecting thermal medium adhered to a conveyor that is travelling out of a vapor tank. Thus, it is possible to prevent generation of poisonous gas and to enhance a safety aspect of the apparatus. Also, since it is possible to collect the thermal medium, the running cost may be reduced.
摘要翻译：公开了一种用于将电子部件装配到印刷电路板的装置，其包括用于收集粘附到从蒸气箱移出的输送机的热介质的收集器。因此，可以防止有毒气体的产生并且增强装置的安全性。此外，由于可以收集热介质，因此可能降低运行成本。

3. 发明授权

US4996781A Vapor reflow type soldering apparatus with an improved flux separating unit 失效
标题翻译：具有改进的通量分离装置的蒸汽回流焊接装置
公开(公告)号：US4996781A
公开(公告)日：1991-03-05
申请号：US426434
申请日：1989-10-25
申请人： Haruo Mishina , Yushi Takahashi , Keizo Tsuchiya
发明人： Haruo Mishina , Yushi Takahashi , Keizo Tsuchiya
IPC分类号： B23K1/012
CPC分类号： B23K1/012
摘要： A vapor reflow type soldering apparatus comprising a tank that is filled with saturated vapor of a heat medium and a passage extending through the tank. An article to be processed is transferred through the passage and is brought into contact with the saturated vapor so that a solder material on the article is heated and molten. Also, a discharge gas collecting unit is provided in the apparatus and includes a chilled water system through which water at a constant temperature is caused to flow. The heat medium is collected out of the discharge gas from the apparatus and is returned back to a tank. A flux separating unit is connected to the chilled water system of the discharge gas unit through a pipes and switching valves. The chilled water in the chilled water system is selectively introduced into the flux separating unit to cool the heat medium within the tank, and a flux molten into the heat medium is removed from the molten solder material.
摘要翻译：一种蒸汽回流焊接装置，其包括填充有热介质的饱和蒸气的罐和延伸穿过该罐的通道。待处理的物品通过通道转移并与饱和蒸气接触，使得物品上的焊料材料被加热并熔融。此外，在该装置中设置有放电气体收集单元，并且包括冷却水系统，通过该冷却水系统使恒定温度的水流过。热介质从设备的排出气体中收集出来并返回到罐中。通量分配单元通过管道和切换阀连接到排放气体单元的冷冻水系统。冷冻水系统中的冷冻水被选择性地引入通量分离单元以冷却罐内的热介质，并且熔融到热介质中的焊剂从熔融焊料材料中去除。

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