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1. 发明授权

US5333774A Vapor reflow soldering apparatus 失效
标题翻译：蒸汽回流焊接装置
公开(公告)号：US5333774A
公开(公告)日：1994-08-02
申请号：US31878
申请日：1993-03-16
申请人： Haruo Mishina , Shinya Yamama
发明人： Haruo Mishina , Shinya Yamama
IPC分类号： B23K1/015 , H05K3/34
CPC分类号： B23K1/015 , B23K2201/42 , Y02P70/181
摘要： A vapor reflow soldering apparatus includes a unit for delivering an article processed to a vapor generating tank for generating saturated vapor of thermal medium, for allowing the article to be to come in contact with the saturated vapor, and for heating and melting solder of the article. A thermal medium recovery system collects thermal medium which flows in the article delivery path. There is also provided an arrangement for leading at least one part of exhaust gas containing mist from a recovery tank of the thermal medium recovery system for collecting and cooling thermal medium to the outlet-side delivery path for delivering the article. The exhaust gas with mist is blown off to the article being processed. The gas containing the mist is obtained by cooling the thermal medium in vapor phase state. The blown off gas containing mist to increases the cooling speed for the soldered part and the bonding strength, and reduces the consumption of thermal medium.
摘要翻译：蒸汽回流焊接装置包括用于将处理过的物品输送到用于产生热介质的饱和蒸气的蒸汽发生罐的装置，用于使物品与饱和蒸气接触，并且用于加热和熔化物品的焊料。热介质回收系统收集在物品输送路径中流动的热介质。还提供了一种用于将来自热介质回收系统的回收罐的含有雾的废气的至少一部分引导到用于将热介质收集和冷却到用于输送物品的出口侧输送路径的布置。带有雾气的废气被吹送到待处理的物品上。通过在蒸气相状态下冷却热介质，得到含有雾的气体。含有雾气的吹出气体增加焊接部件的冷却速度和粘合强度，并降低热介质的消耗。

2. 发明授权

US5467912A Reflow soldering apparatus for soldering electronic parts to circuit substrate 失效
标题翻译：用于将电子部件焊接到电路基板的回流焊接装置
公开(公告)号：US5467912A
公开(公告)日：1995-11-21
申请号：US155798
申请日：1993-11-23
申请人： Haruo Mishina , Masafumi Wada , Mituo Fukuda , Masato Itagaki , Shinya Yamama
发明人： Haruo Mishina , Masafumi Wada , Mituo Fukuda , Masato Itagaki , Shinya Yamama
IPC分类号： B23K1/012 , B23K35/38
CPC分类号： B23K1/012
摘要： There is provided a reflow soldering apparatus for soldering electronic parts to a circuit substrate by blowing various inert hot gases of a desired density and temperature. A device for detecting whether or not a processing object is being conveyed into the apparatus is provided, so that the amount of inert gas to be supplied and the gas blowing speed are decreased when no processing object is present inside the apparatus. As a result, the amount of gas which flows out is made small, and a decrease in the temperature of the apparatus can be prevented. When the processing object is conveyed into the apparatus, the amount of supplied gas is increased so as to obtain a sufficient gas density. Thus, it is possible to prevent solder from being oxidized, and satisfactory solderability can be obtained.
摘要翻译：提供了一种回流焊接装置，用于通过吹送所需密度和温度的各种惰性热气体将电子部件焊接到电路基板。提供了一种用于检测处理对象是否被传送到设备中的装置，使得当在设备内部没有处理对象时，提供的惰性气体的量和气体吹送速度降低。结果，流出的气体的量变小，并且可以防止装置的温度的降低。当处理对象被输送到设备中时，增加供应气体的量以获得足够的气体密度。因此，可以防止焊料被氧化，并且可以获得令人满意的可焊性。

3. 发明授权

US5146694A Vapor reflow type soldering apparatus 失效
标题翻译：蒸汽回流焊接装置
公开(公告)号：US5146694A
公开(公告)日：1992-09-15
申请号：US591884
申请日：1990-10-02
申请人： Haruo Mishina , Shinya Yamama
发明人： Haruo Mishina , Shinya Yamama
IPC分类号： B23K1/015
CPC分类号： B23K1/015
摘要： A vapor reflow type soldering apparatus with an upper supply hole of vapor for heating the upper surface of an article to be processed, the position of which is displaced to the downstream side along a direction of delivery with respect to that of a lower supply hole of vapor for heating the lower surface of the article, so that the temperature of the upper surface of the article to be processed can be raised more moderately than that of the lower surface thereof.
摘要翻译：一种蒸气回流焊接装置，具有用于加热待加工物品的上表面的上部蒸汽供应孔的蒸汽回流型焊接装置，其位置相对于下一个供给孔的输送方向位移到下游侧用于加热制品的下表面的蒸汽，使得待处理制品的上表面的温度可以比其下表面的温度更适度地升高。

4. 发明授权

US5038496A Vapor reflow type soldering apparatus 失效
标题翻译：蒸汽回流焊接装置
公开(公告)号：US5038496A
公开(公告)日：1991-08-13
申请号：US385160
申请日：1989-07-26
申请人： Haruo Mishina , Shinya Yamama , Yukio Yamada , Keizo Tsuchiya
发明人： Haruo Mishina , Shinya Yamama , Yukio Yamada , Keizo Tsuchiya
IPC分类号： B23K1/015
CPC分类号： B23K1/015
摘要： A vapor reflow type soldering apparatus comprises a vapor generating tank disposed substantially centrally in the apparatus for receiving therein a thermal medium and saturated vapor of said thermal medium; a preheating chamber arranged upstream of the vapor generating tank; a cooling chamber arranged downstream of the vapor generating tank; an inlet side passage connecting the vapor generating tank and the preheating chamber; an outlet side passage connecting the vapor generating tank and the cooling chamber; a conveyor extending horizontally through the preheating chamber, the inlet side passage, the vapor generating tank, the outlet side passage and the cooling chamber, wherein the conveyor can vary the width thereof; an outlet side exhaust port provided at the outlet side passage; an inlet side cooler arranged beneath the inlet side passage and having a cover at an upper position thereof; an outlet side cooler arranged beneath the outlet side passage and extending close to the outlet side exhaust port; a lower vapor discharge opening formed below the conveyor within the vapor generating tank; and a shutter connected with a movable conveyor guide and also with the peripheral part of the lower vapor discharge opening, whereby the opening area of said lower vapor discharge opening can be varied as the movable conveyor guide is moved widthwise.
摘要翻译：蒸汽回流型焊接装置包括蒸发发生罐，其基本上设置在该装置中的中间，用于在其中容纳热介质和所述热介质的饱和蒸气; 预热室，其布置在所述蒸汽发生罐的上游; 布置在蒸汽发生罐下游的冷却室; 连接蒸汽发生罐和预热室的入口侧通道; 连接蒸汽发生罐和冷却室的出口侧通道; 输送机横向延伸穿过预热室，入口侧通道，蒸汽发生罐，出口侧通道和冷却室，其中输送机可以改变其宽度; 出口侧排气口，设置在出口侧通道; 入口侧冷却器，其布置在入口侧通道下方并且在其上部位置具有盖; 出口侧冷却器，布置在出口侧通道下方并且靠近出口侧排气口延伸; 在蒸汽发生罐内形成在输送机下面的较低蒸汽排放口; 以及与可移动的输送机引导件连接并且还与下部蒸汽排出口的周边部分连接的闸门，由此可移动的输送机引导件沿宽度方向移动，所述下部蒸汽排出口的开口面积可以变化。

5. 发明授权

US5716207A Heating furnace 失效
标题翻译：加热炉
公开(公告)号：US5716207A
公开(公告)日：1998-02-10
申请号：US686692
申请日：1996-07-26
申请人： Haruo Mishina , Kiyoshi Imaisumi , Shinya Yamama
发明人： Haruo Mishina , Kiyoshi Imaisumi , Shinya Yamama
IPC分类号： H01L21/00 , F27D5/00
CPC分类号： H01L21/67098
摘要： A heating furnace and a method for uniformly thermo-setting a paste applied onto the surface of a substrate, and for manufacturing a high quality substrate. The heating furnace can be installed in a small area. A plurality of up-and-down moving pins are provided in a furnace body. The plurality of up-and-down moving pins are penetrating a hot plate having a heater and are vertically movable. A substrate loaded through an opening port in an isolation wall is mounted onto the up-and-down moving pins moved in their upper position. The substrate moved down near the hot plate using the up-and-down moving pins is preheated by the heated hot plate. Then, the substrate is further moved down and vacuum attracted to the hot plate to be heated by the hot plate. After that, the substrate is moved up to the original position and nitrogen gas from nozzles of a gas supply pipe is blown on the surface of the substrate to accelerate cooling of the substrate. After being cooled, the substrate is unloaded through the opening port.
摘要翻译：一种加热炉和用于均匀地热固化施加到基材表面上的糊料并用于制造高质量基材的方法。加热炉可以安装在一个小区域。在炉体中设置有多个上下移动销。多个上下移动销穿透具有加热器的加热板并且可垂直移动。通过隔离壁中的开口装载的基板安装在上下移动的销上移动的位置上。使用上下移动的引脚将基板向下移动到热板附近，由加热的热板预热。然后，基板进一步向下移动，真空吸引到热板上，由热板加热。之后，将基板移动到原来的位置，并且从气体供给管的喷嘴吹出氮气吹送到基板的表面，以促进基板的冷却。冷却后，基板通过开口卸载。

6. 发明授权

US5156325A Vapor reflow type soldering method and apparatus therefor 失效
标题翻译：蒸汽回流焊接方法及其设备
公开(公告)号：US5156325A
公开(公告)日：1992-10-20
申请号：US630811
申请日：1990-12-20
申请人： Haruo Mishina , Shinya Yamama
发明人： Haruo Mishina , Shinya Yamama
IPC分类号： B23K1/015
CPC分类号： B23K1/015
摘要： In case of suspending an apparatus upon the completion of soldering operation, from not smaller than 50% to less than 95% of a thermomedium in a reflow section is transferred to a filtering tank and the remaining thermomedium is made to pass through a water separator in advance of suspending the apparatus, so that water in the thermomedium is removed. This water removing operation makes it possible to prevent the corrosion of the reflow section and the deterioration of the thermomedium. Additionally, a method is disclosed for preventing water to be mixed with the thermomedium by warming the reflow section before operation.
摘要翻译：在完成焊接操作时暂停设备的情况下，回流部中的热电偶的不低于50％至小于95％的转移到过滤罐中，并使剩余的热电偶通过水分离器提前悬挂装置，使得热电偶中的水被去除。这种除水操作使得可以防止回流部分的腐蚀和热熔体的劣化。此外，公开了一种方法，用于通过在操作之前加热回流部分来防止水与热电偶混合。

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