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1. 发明授权

US6155724A Light transmitting module for optical communication and light transmitting unit thereof 失效
标题翻译：光通信用光传输模块及其发光单元
公开(公告)号：US6155724A
公开(公告)日：2000-12-05
申请号：US034348
申请日：1998-03-04
申请人： Haruhiko Ichino , Masaki Hirose , Yoshihisa Warashina , Mikio Kyomasu
发明人： Haruhiko Ichino , Masaki Hirose , Yoshihisa Warashina , Mikio Kyomasu
IPC分类号： G02B6/42 , G02B6/24
CPC分类号： G02B6/4219 , G02B6/4204 , G02B6/4244 , G02B6/4245 , G02B6/4257 , G02B6/4272 , G02B6/4208 , G02B6/4269 , G02B6/4271 , G02B6/4286 , H01L2224/48091 , H01L2224/48137 , H01L2924/30107
摘要： A light emitting unit including a light emitting device of a light emitting module for optical communication is constituted by a laser diode for emitting communication light, a sub-mount having a good thermal conductivity and holding the laser diode on its upper surface, a heat sink for removing the heat generated by the laser diode, a photodiode for monitoring a light output from the laser diode, a laser driver IC which is thermally isolated from the laser diode, has an electric contact placed near the electric contact of the laser diode and connected thereto by wire bonding, and drives the laser diode, and a metal package for holding the heat sink, the photodiode, and the laser driver IC. A light emitting module for optical communication uses the light emitting unit.
摘要翻译：包括用于光通信的发光模块的发光装置的发光单元由用于发射通信光的激光二极管，具有良好导热性的子座和在其上表面上保持激光二极管构成，散热器为了去除由激光二极管产生的热量，用于监测从激光二极管输出的光的光电二极管，与激光二极管热隔离的激光驱动器IC，在激光二极管的电接触附近具有电接触，并连接通过引线接合来驱动激光二极管，以及用于保持散热器，光电二极管和激光驱动器IC的金属封装。用于光通信的发光模块使用发光单元。

2. 发明授权

US6071016A Light receiving module for optical communication and light receiving unit thereof 失效
标题翻译：用于光通信的光接收模块及其光接收单元
公开(公告)号：US6071016A
公开(公告)日：2000-06-06
申请号：US34366
申请日：1998-03-04
申请人： Haruhiko Ichino , Masaki Hirose , Yoshihisa Warashina , Mikio Kyomasu
发明人： Haruhiko Ichino , Masaki Hirose , Yoshihisa Warashina , Mikio Kyomasu
IPC分类号： G02B6/42 , G02B6/36
CPC分类号： G02B6/4225 , G02B6/4204 , G02B6/4292 , H01L2224/48091 , H01L2224/48137 , H01L2924/3011
摘要： A photodetector unit for a photodetector module for optical communication includes a photodetector circuit unit constituted by a ceramic board on which a photodiode for converting input light into an electrical signal and a preamplifier IC connected to the photodiode by bump bonding are mounted, and which has a photodetector circuit connected to the preamplifier IC by bump bonding, and a main amplification circuit unit constituted by a ceramic board on which a main amplification IC is mounted, and which has a main amplification circuit connected to the main amplification IC by bump bonding. The ceramic boards of the photodetector circuit unit and the main amplification circuit unit are mechanically and electrically connected to each other such that a mount surface of the preamplifier IC becomes perpendicular to a mount surface of the main amplification IC.
摘要翻译：一种用于光通信的光检测器模块的光检测器单元包括：由陶瓷板构成的光电检测器单元，其上安装用于将输入光转换为电信号的光电二极管和通过凸块接合连接到光电二极管的前置放大器IC，通过凸块接合连接到前置放大器IC的光电检测器电路，以及由其上安装有主放大IC的陶瓷板构成的主放大电路单元，并且具有通过凸块接合连接到主放大IC的主放大电路。光电检测器电路单元和主放大电路单元的陶瓷板彼此机械地和电连接，使得前置放大器IC的安装表面垂直于主放大IC的安装表面。

3. 发明授权

US09557555B2 Optical module and production method for same 有权
标题翻译：光模块及其制作方法相同
公开(公告)号：US09557555B2
公开(公告)日：2017-01-31
申请号：US14117396
申请日：2012-04-04
申请人： Yoshihisa Warashina , Tomofumi Suzuki , Kohei Kasamori
发明人： Yoshihisa Warashina , Tomofumi Suzuki , Kohei Kasamori
IPC分类号： G02B26/00 , G02B26/08 , G01B9/02 , G02B5/08 , G01J3/453
CPC分类号： G02B26/001 , G01B9/02051 , G01B9/02056 , G01J3/4535 , G01J3/4537 , G02B5/08 , G02B26/0833
摘要： An optical module includes a first plate-shaped member having a light transmissive optical component which is formed by applying etching to a silicon region, and a second plate-shaped member having light reflective optical components (mirrors) for reflecting light transmitting through the light transmissive optical component. The first and second plate-shaped members are bonded to one another, and an optical path for light transmitting through the light transmissive optical component is along a component forming surface of the first plate-shaped member and a principal surface of the second plate-shaped member. Thereby, realizing an optical module in which it is possible to dispose the light reflective optical component and the light transmissive optical component close to one another, and a manufacturing method for the optical module.
摘要翻译：光学模块包括具有通过对硅区域进行蚀刻形成的透光光学部件的第一板状部件和具有反射透过透光性的光的反射光学部件（反射镜）的第二板状部件光学元件。第一和第二板状构件彼此接合，并且用于透过透光性光学构件的光的光路沿着第一板状构件的构件形成表面，并且第二板状构件的主表面会员。由此，实现了可以将光反射型光学部件和透光性光学部件配置成彼此靠近的光学模块，以及光学模块的制造方法。

4. 发明授权

US07254301B2 Optical module 失效
标题翻译：光模块
公开(公告)号：US07254301B2
公开(公告)日：2007-08-07
申请号：US10546187
申请日：2004-02-19
申请人： Yasuji Hoshino , Takashi Iida , Yoshihisa Warashina , Kei Tabata
发明人： Yasuji Hoshino , Takashi Iida , Yoshihisa Warashina , Kei Tabata
IPC分类号： G02B6/26
CPC分类号： G02B6/423 , G02B6/4201 , G02B6/4214 , G02B6/4243 , G02B6/4249 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An optical module comprises: a sub-mount 1, having four photodiodes 12 and two guide grooves 10 disposed on an optical element mounting surface 16; a fiber fixing member 2, having four V-grooves 21, four concave mirrors 22, and two guide rails 20 disposed on an optical fiber fixing surface 26; and four optical fibers 3, fixed to the fiber fixing member 2. With this optical module, the sub-mount 1 and fiber fixing member 2 are aligned and fixed by the fitting together of the guide grooves 10 and guide rails 20. A passive alignment type optical module that enables mass production and cost reduction is thus realized.
摘要翻译：光学模块包括：具有设置在光学元件安装表面16上的四个光电二极管12和两个引导槽10的子安装件1; 具有设置在光纤固定面26上的四个V形槽21，四个凹面镜22和两个导轨20的光纤固定部件2，和固定在光纤固定部件2上的四根光纤3。通过该光学模块，副安装座1和光纤固定部件2通过引导槽10和导轨20的嵌合而对准和固定。从而实现了能够进行批量生产和降低成本的无源对准型光学模块。

5. 发明授权

US5034921A High speed optical memory circuit 失效
标题翻译：高速光存储电路
公开(公告)号：US5034921A
公开(公告)日：1991-07-23
申请号：US375983
申请日：1989-07-06
申请人： Kazutoshi Nakajima , Hirofumi Kan , Kenichi Sugimoto , Yoshihiko Mizushima , Toru Hirohata , Takashi Iida , Yoshihisa Warashina , Toru Hirohata , Takashi Iida
发明人： Kazutoshi Nakajima , Hirofumi Kan , Kenichi Sugimoto , Yoshihiko Mizushima , Toru Hirohata , Takashi Iida , Yoshihisa Warashina , Toru Hirohata , Takashi Iida
IPC分类号： G11C11/42 , G11C7/00 , G11C11/36
CPC分类号： G11C7/005 , G11C11/36
摘要： An optical memory circuit comprises two photodetectors, and an intermediate signal conductor for connecting the two photodetectors, wherein the two photodetectors and the signal conductor are connected in series in a closed circuit, wherein each of the photodetectors comprises two spaced Schottky electrodes symmetrically disposed on a semiconductor substrate and the signal conductor has a capacitance with a time constant of a potential of the signal conductor such that charges are stored in the signal conductor when an optical write signal is incident on one photodetector and stored charges are released from the signal conductor when an optical read signal is incident on the other photodetector.

6. 发明授权

US5020064A Electromagnetic wave device 失效
标题翻译：电磁波装置
公开(公告)号：US5020064A
公开(公告)日：1991-05-28
申请号：US393275
申请日：1989-08-14
申请人： Yoshihiko Mizushima , Takashi Iida , Toru Hirohata , Kenichi Sugimoto , Yoshihisa Warashina , Kazutoshi Nakajima
发明人： Yoshihiko Mizushima , Takashi Iida , Toru Hirohata , Kenichi Sugimoto , Yoshihisa Warashina , Kazutoshi Nakajima
IPC分类号： G01R23/16 , H01S3/09 , H01S3/10 , H01S3/108 , H01S3/30 , H01S4/00
CPC分类号： H01S3/0903
摘要： An electromagnetic wave device having an amplification function comprises a medium containing free carriers, means for applying a magnetic field to the medium, means for applying an input electromagnetic wave to the medium in a direction perpendicular to the magnetic field, and means for generating an electric field to accelerating the carriers in the direction of the input electromagnetic wave. A frequency of the input electromagnetic wave is within the range of the plasma frequency plus or minus the cyclotron frequency, and a polarization direction of the input electromagnetic wave is perpendicular both to the magnetic field and its own traveling direction. Furthermore, the device has such functions as oscillation, modulation, frequency conversion, etc. depending on the type of added units.

7. 发明授权

US08847080B2 Laminated wiring board 有权
标题翻译：层压接线板
公开(公告)号：US08847080B2
公开(公告)日：2014-09-30
申请号：US13378110
申请日：2010-06-03
申请人： Yoshihisa Warashina
发明人： Yoshihisa Warashina
IPC分类号： H05K1/09 , H01L23/14 , H01L23/498 , H01L23/13 , H01L27/146
CPC分类号： H01L23/147 , H01L23/13 , H01L23/49822 , H01L23/49827 , H01L23/49872 , H01L27/14636 , H01L2224/16225 , H01L2924/157 , H01L2924/3011
摘要： In a multilayer wiring board, a low resistance silicon substrate having a predetermined resistivity and a high resistance silicon substrate having a resistivity higher than the predetermined resistivity are stacked while interposing an insulating layer therebetween. The low resistance silicon substrate is provided with an electric passage part surrounded by a ring-shaped groove, while a wiring film electrically connected to the electric passage part through an opening of the insulating layer is disposed on a rear face of the high resistance silicon substrate and an inner face of a recess. Since the high resistance silicon substrate is thus provided with the wiring film, an optical semiconductor element and an electronic circuit element which differ from each other in terms of the number and positions of electrode pads can be electrically connected to each other on the front and rear face sides of the multilayer wiring board.
摘要翻译：在多层布线板中，层叠具有预定电阻率的低电阻硅基板和具有比预定电阻率高的电阻率的高电阻硅基板，同时在其间插入绝缘层。低电阻硅基板设置有被环状槽包围的电通路部分，而通过绝缘层的开口电连接到电通路部分的布线膜设置在高电阻硅衬底的背面上和凹部的内表面。由于高电阻硅衬底因此设置有布线膜，所以在电极焊盘的数量和位置方面彼此不同的光半导体元件和电子电路元件可以在前后互相电连接多层布线板的正面。

8. 发明授权

US07433554B2 Optical wiring board and method for manufacturing optical wiring board 失效
标题翻译：光接线板及其制造方法
公开(公告)号：US07433554B2
公开(公告)日：2008-10-07
申请号：US10589604
申请日：2005-02-15
申请人： Yoshihisa Warashina , Yasuji Hoshino , Hajime Takeyama , Masaaki Muto
发明人： Yoshihisa Warashina , Yasuji Hoshino , Hajime Takeyama , Masaaki Muto
IPC分类号： G02B6/12 , G02B6/10
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274
摘要： An optical wiring board by which an optical waveguide can be easily aligned with a light emitting element and a light detecting element. The optical wiring board (1) is provided with a substrate (10). On the substrate (10), a plurality of recessed parts (12) are formed, and the optical waveguide (13) is formed between the recessed parts (12). In the recessed part (12), a light receiving/emitting member (30), which is mounted on an inserting part (22) on a base member (20), is arranged. In the inserting member (22), reflecting planes (26, 27) are formed on inclined planes, and an optical path of the optical waveguide (13) matches with that of a light detecting part (34) and a light emitting part (37) in the light receiving/emitting member (30) via the reflecting planes (26, 27).
摘要翻译：光学布线基板，光波导可以容易地与发光元件和光检测元件对准。光配线板（1）设置有基板（10）。在基板（10）上形成有多个凹部（12），在凹部（12）之间形成有光波导（13）。在凹部（12）中，设置有安装在基部构件（20）上的插入部（22）上的受光/发射构件（30）。在插入构件（22）中，反射面（26,27）形成在倾斜面上，光波导（13）的光路与光检测部（34）和发光部（37）的光路一致）经由反射面（26,27）在光接收/发射构件（30）中。

9. 发明申请

US20050100293A1 High-frequency signal transmitting optical module and method of fabricating the same 有权
标题翻译：高频信号发射光模块及其制造方法
公开(公告)号：US20050100293A1
公开(公告)日：2005-05-12
申请号：US10984748
申请日：2004-11-10
申请人： Yoshihisa Warashina , Yasuji Hoshino , Kei Tabata , Shogo Iyama
发明人： Yoshihisa Warashina , Yasuji Hoshino , Kei Tabata , Shogo Iyama
IPC分类号： G02B6/36 , H01L31/0203 , H01L31/032 , H01L31/18 , H01S5/022
CPC分类号： H01L25/167 , H01L31/0203 , H01L2224/48137 , H01L2224/48195 , H01L2924/3011 , H01S5/02212 , H01S5/0427 , H01S5/06226 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a high-frequency signal transmitting optical module which can easily realize a high-frequency signal transmission by use of a semiconductor optical device to which a highly versatile metal can package has been applied. In the high-frequency signal transmitting optical module, after fixing, to a rear surface of a stem of the metal can package, fixing portions of the linear outer leads by laser welding, the end portions of the outer leads are bent. By this, the outer leads can be easily attached to the semiconductor optical device. On both sides of the respective lead pins of the semiconductor optical device, since the outer leads extending along these are attached to the rear surface of the stem, ground regions are continuously provided on both sides of the respective lead pins by the stem and respective outer leads, whereby TEM wave transmission lines are formed. Accordingly, high-frequency signals can be transmitted to the semiconductor optical device.
摘要翻译：高频信号发送光模块技术领域本发明涉及一种高频信号发送光模块，其可以通过使用已经应用了高通用金属罐封装的半导体光学器件来容易地实现高频信号传输。在高频信号发送光学模块中，在通过激光焊接固定到金属罐的杆的后表面之后，通过激光焊接固定线状外部引线的一部分，使外部引线的端部弯曲。由此，能够容易地将外部引线安装在半导体光学元件上。在半导体光学器件的各个引脚的两侧上，由于沿着这些引线延伸的外引线附着到杆的后表面，接地区域通过杆和相应的外部连续地设置在各个引脚的两侧引线，由此形成TEM波传输线。因此，高频信号可以传输到半导体光学器件。

10. 发明授权

US06880985B2 Optical module 失效
标题翻译：光模块
公开(公告)号：US06880985B2
公开(公告)日：2005-04-19
申请号：US10459702
申请日：2003-06-12
申请人： Yasuji Hoshino , Yoshihisa Warashina , Shogo Iyama , Hajime Takeyama
发明人： Yasuji Hoshino , Yoshihisa Warashina , Shogo Iyama , Hajime Takeyama
IPC分类号： G02B6/42 , H01L31/0232 , H01L33/58 , G02B6/36
CPC分类号： G02B6/4204 , G02B6/4292
摘要： In optical module 10, light emitted from laser diode (hereinafter referred to as “LD”) 42 is collimated into parallel light beam by ball lens 44 and then travels through ball lens 26 to be focused on core 104 of optical fiber 100. Since the light passing between ball lenses 44 and 26 is the parallel light beam as described above, allowance is enlarged for axial misalignment between the optical axes of ball lens 44 and ball lens 26. This enables the light from LD 42 to be focused on core 102 of optical fiber 100 even if there occurs axial misalignment between the optical axes of optical fiber 100 and LD 42 due to a factor resulting from fitting of ferrule 102 into sleeve 14 or the like. Accordingly, there is no need for alignment in a work of mounting optoelectronic device 28, i.e., LD 42 in housing 12.
摘要翻译：在光学模块10中，由激光二极管（以下称为“LD”）42发射的光被球透镜44准直成平行光束，然后穿过球透镜26聚焦在光纤100的核心104上。由于在球透镜44和26之间通过的光是如上所述的平行光束，球面透镜44和球透镜26的光轴之间的轴向偏移的容限被扩大了。这使得来自LD 42的光能够聚焦在即使光纤100和LD42的光轴之间出现轴向未对准，由于将套圈102装配到套筒14等中的因素，光纤100也是如此。因此，在安装光电子器件28（即，壳体12中的LD 42）的工作中不需要对准。

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