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    • 5. 发明申请
    • OPTOELECTRONIC COMPONENT AND METHOD FOR OPERATING AN OPTOELECTRONIC COMPONENT
    • 光电元件和操作光电元件的方法
    • US20140048680A1
    • 2014-02-20
    • US14007098
    • 2012-03-19
    • Markus Wicke
    • Markus Wicke
    • H01L31/153
    • H01L31/153H01L25/0753H01L25/167H01L2224/49171H01L2924/0002H01L2924/00
    • An optoelectronic component includes a carrier on which at least one first light-emitting semiconductor chip and one first light-absorbing semiconductor chip connected antiparallel to the at least one first light-emitting semiconductor chip, at least one second light-emitting semiconductor chip and one second light-absorbing semiconductor chip connected antiparallel to the at least one second light-emitting semiconductor chip, wherein the semiconductor chips are arranged on the carrier such that light from each light-emitting semiconductor chip falls on at least one of the light-absorbing semiconductor chips not connected to the respective light-emitting semiconductor chip, and the light-absorbing semiconductor chips are formed as protection diodes.
    • 光电子部件包括载体,至少一个与至少一个第一发光半导体芯片反平行连接的第一发光半导体芯片和一个第一光吸收半导体芯片,至少一个第二发光半导体芯片和一个第二发光半导体芯片 与所述至少一个第二发光半导体芯片反平行连接的第二光吸收半导体芯片,其中,所述半导体芯片布置在所述载体上,使得来自每个发光半导体芯片的光落在至少一个所述光吸收半导体 未连接到各个发光半导体芯片的芯片,并且形成光吸收半导体芯片作为保护二极管。
    • 7. 发明授权
    • Optoelectronic component and method for operating an optoelectronic component
    • 用于操作光电子元件的光电元件和方法
    • US09293629B2
    • 2016-03-22
    • US14007098
    • 2012-03-19
    • Markus Wicke
    • Markus Wicke
    • H01L31/153H01L25/16H01L25/075
    • H01L31/153H01L25/0753H01L25/167H01L2224/49171H01L2924/0002H01L2924/00
    • An optoelectronic component includes a carrier on which at least one first light-emitting semiconductor chip and one first light-absorbing semiconductor chip connected antiparallel to the at least one first light-emitting semiconductor chip, at least one second light-emitting semiconductor chip and one second light-absorbing semiconductor chip connected antiparallel to the at least one second light-emitting semiconductor chip, wherein the semiconductor chips are arranged on the carrier such that light from each light-emitting semiconductor chip falls on at least one of the light-absorbing semiconductor chips not connected to the respective light-emitting semiconductor chip, and the light-absorbing semiconductor chips are formed as protection diodes.
    • 光电子部件包括载体,至少一个与至少一个第一发光半导体芯片反平行连接的第一发光半导体芯片和一个第一光吸收半导体芯片,至少一个第二发光半导体芯片和一个第二发光半导体芯片 与所述至少一个第二发光半导体芯片反平行连接的第二光吸收半导体芯片,其中,所述半导体芯片布置在所述载体上,使得来自每个发光半导体芯片的光落在至少一个所述光吸收半导体 未连接到各个发光半导体芯片的芯片,并且形成光吸收半导体芯片作为保护二极管。