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1. 发明申请

US20060128042A1 Method for encapsulating at least one organic light-emitting (OLED) device and OLED device 有权
标题翻译：用于封装至少一种有机发光（OLED）器件和OLED器件的方法
公开(公告)号：US20060128042A1
公开(公告)日：2006-06-15
申请号：US11268338
申请日：2005-11-07
申请人： Wolfgang Gramann , Ewald Guenther
发明人： Wolfgang Gramann , Ewald Guenther
IPC分类号： H01L21/00
CPC分类号： H01L51/5259 , H01L51/524 , H01L51/5246 , H01L51/525
摘要： A method for encapsulating at least one organic light-emitting (OLED) device (22) comprising the step of forming a concave region (24) on a plate (6) by applying a negative pressure to a predetermined area of the plate. The plate is attached to a substrate (1) comprising at least one active region (23) such that the concave region (24) of the plate (6) spans over the active region (23). Also disclosed is a OLED device (22), in which at least a part of an encapsulation of the device is formed by applying a negative pressure to a predetermined area of a plate (6) forming a concave region (24) of the plate (6).
摘要翻译：一种用于封装至少一个有机发光（OLED）器件（22）的方法，包括通过向板的预定区域施加负压来在板（6）上形成凹区（24）的步骤。板被附接到包括至少一个有源区（23）的衬底（1），使得板（6）的凹区（24）跨越有源区（23）。还公开了一种OLED器件（22），其中通过向形成板的凹区域（24）的板（6）的预定区域施加负压来形成装置的至少一部分封装（22） 6）。

2. 发明授权

US06946864B2 Method for measuring product parameters of components formed on a wafer and device for performing the method 有权
标题翻译：用于测量在晶片上形成的部件的产品参数的方法和用于执行该方法的装置
公开(公告)号：US06946864B2
公开(公告)日：2005-09-20
申请号：US10078146
申请日：2002-02-19
申请人： Wolfgang Gramann , Raimund Oberschmid , Werner Späth , Wolfgang Teich
发明人： Wolfgang Gramann , Raimund Oberschmid , Werner Späth , Wolfgang Teich
IPC分类号： G01N21/66 , G01R31/28
CPC分类号： G01N21/66
摘要： A measuring arrangement for measuring product parameters of a component in the epitaxial layer (28) of a wafer comprises measuring probe (3) on whose contact side (23) a recess (24) is installed, into which an electrolyte can be poured. The electrolyte produces an electrical connection between a contact body (11), which is charged with a signal from a pulsed-current source, and the surface (22) of the wafer (2). A detector (16) serves for detecting the light which is emitted by the component.
摘要翻译：用于测量晶片的外延层（28）中的部件的产品参数的测量装置包括测量探针（3），其上安装有接触侧（23）的凹部（24），可以将电解液倒入其中。电解液在与脉冲电流源的信号充电的接触体（11）和晶片（2）的表面（22）之间产生电连接。检测器（16）用于检测由该部件发出的光。

3. 发明授权

US06028708A Method for producing a beam splitter molded part and optoelectronic module using the beam splitter molded part 有权
标题翻译：用于制造分束器模制部件的方法和使用分束器模制部件的光电模块
公开(公告)号：US06028708A
公开(公告)日：2000-02-22
申请号：US282040
申请日：1999-03-30
申请人： Wolfgang Gramann , Werner Spath
发明人： Wolfgang Gramann , Werner Spath
IPC分类号： G02B5/04 , G02B6/12 , G02B6/42 , G02B27/14 , G02B27/10
CPC分类号： G02B27/1073 , G02B27/1006 , G02B6/4246 , G02B2006/12114 , G02B6/4214 , Y10S359/90
摘要： A method is provided for producing at least one beam splitter molded part from transparent material in which a beam splitter layer is embedded. Two radiation-transparent wafers, of which one is provided with a beam splitter layer, are interconnected in such a way that the beam splitter layer lies between the two wafers. Subsequently, this wafer assembly is further processed to form individual prism ingots, for example by sawing them through into wafer strips and grinding or polishing lateral surfaces, or by profile sawing. An optoelectronic module for bidirectional optical data transmission uses the beam splitter molded part.
摘要翻译：提供了一种用于从透明材料制造至少一个分束器模制部件的方法，其中分束器层被嵌入其中。两个辐射透明晶片（其中一个设置有分束器层）以使得分束器层位于两个晶片之间的方式互连。随后，该晶片组件被进一步处理以形成单独的棱镜锭，例如通过将它们锯切成晶片条并研磨或抛光侧面，或通过型材锯切。用于双向光学数据传输的光电模块使用分束器模制部件。

4. 发明授权

US5875205A Optoelectronic component and method for the manufacture thereof 失效
标题翻译：光电子元件及其制造方法
公开(公告)号：US5875205A
公开(公告)日：1999-02-23
申请号：US799494
申请日：1997-02-12
申请人： Werner Spaeth , Wolfgang Gramann , Hans-Ludwig Althaus , Ralf Dietrich
发明人： Werner Spaeth , Wolfgang Gramann , Hans-Ludwig Althaus , Ralf Dietrich
IPC分类号： H01L33/00 , H01S5/00 , H01S5/02 , H01S5/022 , H01S5/18 , H01S3/19
CPC分类号： H01S5/02284 , H01S5/02292 , H01S5/0201 , H01S5/02248 , H01S5/0683
摘要： In an optoelectronic component having a laser chip as a light transmitter and a lens coupling optics for defined emission of radiation generated in the laser chip, the lens coupling optics is arranged immediately in front of the laser chip and is adjusted and fixed in stable fashion in a simple way. The component is rationally manufactured in a wafer union. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers, and that are inclined at an angle of 45.degree. relative to the resonator faces. Thus the radiation generated in the laser chip is directed nearly perpendicularly upward to the surface of the common carrier and the lens coupling optics is arranged on at least the one carrier part such that the radiation generated in the laser chip impinges this lens optics nearly perpendicularly.
摘要翻译：在具有作为光发射器的激光芯片和用于在激光芯片中产生的辐射的定义发射的透镜耦合光学器件的光电子部件中，透镜耦合光学器件被立即布置在激光器芯片的前面，并且以稳定的方式被调整和固定一个简单的方法。该组件在晶片联合中合理制造。激光芯片布置在两个载体部件之间的公共载体上，其相对于激光芯片的谐振器面的侧表面设置有镜层，并且相对于谐振器面倾斜45度。因此，在激光芯片中产生的辐射几乎垂直地向上引导到公共载体的表面，并且透镜耦合光学器件被布置在至少一个载体部分上，使得在激光器芯片中产生的辐射几乎垂直地撞击该透镜光学器件。

5. 发明授权

US07223952B2 Optical sensing head and method for fabricating the sensing head 有权
标题翻译：光学感测头及其制造方法
公开(公告)号：US07223952B2
公开(公告)日：2007-05-29
申请号：US10667717
申请日：2003-09-22
申请人： Ulrich Steegmüller , Wolfgang Gramann , Frank Singer , Jürgen Dachs , Mathias Kämpf
发明人： Ulrich Steegmüller , Wolfgang Gramann , Frank Singer , Jürgen Dachs , Mathias Kämpf
IPC分类号： G01B7/00
CPC分类号： G11B7/1263 , G02B6/4214 , G11B7/123 , G11B7/22
摘要： An optical sensing head, which is for reading out an optical data memory, has a substrate with a main surface. An edge-emitting laser component is configured on the main surface of the substrate and has irradiation axis oriented essentially parallel to the first main plane. A deflection device is arranged on the main surface of the substrate and deflects the laser radiation in a direction that is essentially perpendicular to the main surface. At least one signal detector is provided for sensing the laser radiation that is reflected by the optical data memory. An optical element guides the deflected laser radiation to the optical data memory and guides reflected laser radiation to the signal detector. The optical element is connected to the substrate by at least one supporting element. The invention also includes a method for fabricating such a sensing head.
摘要翻译：用于读出光学数据存储器的光学检测头具有具有主表面的基板。边缘发射激光器部件被构造在基板的主表面上，并具有基本上平行于第一主平面定向的照射轴。偏转装置设置在基板的主表面上，并使激光辐射沿基本垂直于主表面的方向偏转。提供至少一个信号检测器用于感测由光学数据存储器反射的激光辐射。光学元件将偏转的激光辐射引导到光学数据存储器并将反射的激光辐射引导到信号检测器。光学元件通过至少一个支撑元件连接到基板。本发明还包括一种用于制造这种感测头的方法。

6. 发明授权

US06781209B1 Optoelectronic component with thermally conductive auxiliary carrier 有权
标题翻译：带导热辅助载体的光电元件
公开(公告)号：US06781209B1
公开(公告)日：2004-08-24
申请号：US10048113
申请日：2002-05-06
申请人： Hans-Ludwig Althaus , Gerhard Kuhn , Wolfgang Gramann
发明人： Hans-Ludwig Althaus , Gerhard Kuhn , Wolfgang Gramann
IPC分类号： H01L310232
CPC分类号： H01L33/58 , G02B6/4204 , H01L25/167 , H01L31/0203 , H01L31/02325 , H01L33/642 , H01L2224/48463 , H01L2224/49107 , H01S5/02288 , H01S5/02296 , H01S5/0264 , H01S5/183
摘要： The invention relates to an optoelectronic component with a light emitting or light receiving element (1) and a system carrier (9) supporting the element (1). The element (1) emits or receives light on a light transmitting surface (1a), an auxiliary carrier (2) made of heat conductive material and transparent at least in some areas or at least translucent being provided. Said auxiliary carrier (2) is connected to the system carrier (9) and is thermally coupled to the element (1). The invention also relates to a method for the production of such an optoelectronic component.
摘要翻译：本发明涉及具有发光或光接收元件（1）和支撑元件（1）的系统载体（9）的光电子元件。元件（1）在透光表面（1a）上发射或接收光，由导热材料制成的辅助载体（2）至少在一些区域中至少是透明的或至少是半透明的。所述辅助载体（2）连接到所述系统载体（9）并且热耦合到所述元件（1）。本发明还涉及一种用于制造这种光电子部件的方法。

7. 再颁专利

USRE38280E1 Optoelectronic module for bidirectional optical data transmission 有权
标题翻译：用于双向光数据传输的光电模块
公开(公告)号：USRE38280E1
公开(公告)日：2003-10-21
申请号：US09785346
申请日：2001-02-16
申请人： Hans-Ludwig Althaus , Wolfgang Gramann , Wolfgang Reill , Werner Spath
发明人： Hans-Ludwig Althaus , Wolfgang Gramann , Wolfgang Reill , Werner Spath
IPC分类号： G02B2714
CPC分类号： H04B10/40 , G02B6/4246
摘要： An optoelectric module for bidirectional optical data transmission has a molded element provided as a beam splitter, which consists essentially of a material that is transparent for the emitted radiation and the received radiation, and in which a beam splitter is embedded. A transmitting component, a receiving component and a radiation focusing device are advantageously directly connected to the molded element.

8. 发明授权

US06271049B1 Method for producing an optoelectronic component 失效
标题翻译：光电子元件的制造方法
公开(公告)号：US06271049B1
公开(公告)日：2001-08-07
申请号：US09395303
申请日：1999-09-13
申请人： Franz Auracher , Wolfgang Gramann
发明人： Franz Auracher , Wolfgang Gramann
IPC分类号： H01L2100
CPC分类号： G02B6/422 , G02B6/4214 , G02B6/4238 , G02B6/424 , G02B6/4244 , G02B6/4259 , G02B6/4273 , G02B6/4286 , H01S5/02248 , H01S5/02284 , H01S5/02292 , H01S5/0683
摘要： In a method for producing an optoelectronic component, a laser chip is secured to a semiconductor wafer that is provided with metal structures. Thereafter, for each laser chip, one lens-coupling optical element that deflects the beam path of the laser chip is positioned on the semiconductor wafer. The laser chip is driven, and the space between the laser chip and the lens-coupling optical element is varied and set such that a predetermined beam condition with respect to the location of the optical image plane is met.
摘要翻译：在制造光电子部件的方法中，将激光芯片固定到设置有金属结构的半导体晶片。此后，对于每个激光器芯片，偏转激光芯片的光束路径的一个透镜耦合光学元件位于半导体晶片上。激光芯片被驱动，激光芯片和透镜耦合光学元件之间的空间被改变和设置，使得相对于光学像平面的位置满足预定的光束状态。

9. 发明授权

US07329560B2 Method for encapsulating at least one organic light-emitting (OLED) device and OLED device 有权
标题翻译：用于封装至少一种有机发光（OLED）器件和OLED器件的方法
公开(公告)号：US07329560B2
公开(公告)日：2008-02-12
申请号：US11268338
申请日：2005-11-07
申请人： Wolfgang Gramann , Ewald Karl Michael Guenther
发明人： Wolfgang Gramann , Ewald Karl Michael Guenther
IPC分类号： H01L51/56
CPC分类号： H01L51/5259 , H01L51/524 , H01L51/5246 , H01L51/525
摘要： A method for encapsulating at least one organic light-emitting (OLED) device is disclosed. The method includes the step of forming a concave region on a plate by applying a negative pressure to a predetermined area of the plate. The plate is attached to a substrate including at least one active region such that the concave region of the plate spans over the active region.
摘要翻译：公开了一种封装至少一种有机发光（OLED）器件的方法。该方法包括通过向板的预定区域施加负压来在板上形成凹区的步骤。板被附接到包括至少一个有源区域的基板，使得板的凹形区域跨越有源区域。

10. 发明授权

US07262437B2 Radiation source and method for producing a lens mould 有权
标题翻译：用于制造镜片模具的辐射源和方法
公开(公告)号：US07262437B2
公开(公告)日：2007-08-28
申请号：US10343819
申请日：2001-07-30
申请人： Georg Bogner , Wolfgang Gramann , Patrick Kromotis , Werner Marchl , Werner Späth , Günter Waitl
发明人： Georg Bogner , Wolfgang Gramann , Patrick Kromotis , Werner Marchl , Werner Späth , Günter Waitl
IPC分类号： H01L33/00
CPC分类号： G02B3/0031 , B29D11/00278 , B29D11/00365 , F21V5/04 , F21Y2115/10 , G02B3/0056 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01019 , H01L2924/12041 , H01L2924/1815 , H01L2924/19041 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A radiation source has a field of semiconductor chips, which are disposed below a field of micro-lenses (8) disposed in a hexagonal lattice structure. The radiation source is distinguished by high radiation output and radiation density.
摘要翻译：辐射源具有设置在六边形格子结构中的微透镜（8）的场下方的半导体芯片的场。辐射源的特征在于高辐射输出和辐射密度。

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