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1. 发明授权

US07291547B2 Filter device and method for fabricating filter devices 失效
标题翻译：过滤装置及其制造方法
公开(公告)号：US07291547B2
公开(公告)日：2007-11-06
申请号：US10623068
申请日：2003-07-18
申请人： Hans-Jörg Timme , Robert Aigner , Lüder Elbrecht , Juha Sakari Ellä , Katri Helena Pohjonen , Pasi Tikka
发明人： Hans-Jörg Timme , Robert Aigner , Lüder Elbrecht , Juha Sakari Ellä , Katri Helena Pohjonen , Pasi Tikka
IPC分类号： H01L21/44
CPC分类号： H03H3/02 , H01L2224/11334 , H01L2924/00014 , H03H3/08 , H01L2224/0401
摘要： A filter device and a method for fabricating filter devices can package filters, especially acoustic wave filters, by bonding a carrier (substrate) wafer carrying manufactured filters to another wafer referred to as a capping wafer. A capping wafer/substrate eliminates the need for a conventional package to protect the sensitive filters, which reduces both product size and product costs significantly. Even though additional packaging is possible (i.e. in plastic molded packages, or in glob-top packages), it is not required for the reliability of the filters.
摘要翻译：过滤器装置和用于制造过滤器装置的方法可以通过将携带制造的过滤器的载体（衬底）晶片结合到称为封盖晶片的另一个晶片来封装滤波器，特别是声波滤波器。封盖晶片/基板不需要传统封装来保护敏感滤光片，这显着降低了产品尺寸和产品成本。即使附加的包装是可能的（即，在塑料模制包装中，或在全球顶部包装中），滤网的可靠性不是必需的。

2. 发明授权

US06943647B2 Bulk acoustic wave filter with a roughened substrate bottom surface and method of fabricating same 有权
标题翻译：具有粗糙化基板底面的体声波滤波器及其制造方法
公开(公告)号：US06943647B2
公开(公告)日：2005-09-13
申请号：US10840320
申请日：2004-05-06
申请人： Robert Aigner , Pasi Tikka , Juha Sakari Ella
发明人： Robert Aigner , Pasi Tikka , Juha Sakari Ella
IPC分类号： H03H3/02 , H03H9/02 , H03H9/17 , H03H9/58 , H03H9/09 , H03H9/15 , H03H9/56
CPC分类号： H03H9/175 , H03H3/02 , H03H9/02055 , H03H9/0211 , H03H9/585 , H03H9/589 , Y10T29/42
摘要： A filter device comprises a substrate having a top surface and a bottom surface, and at least one acoustic wave situated on the top surface of the substrate, wherein the bottom surface of the substrate is roughened to reduce the reflection of an acoustic wave back to the acoustic wave filter. The effect achieved by the roughening of the bottom surface of the substrate that an acoustic wave which is generated by the acoustic wave filter and reaches the bottom surface of the substrate, is basically scattered so the acoustic wave that is actually reflected back to the acoustic wave device is reduced which, in turn, improves the performance characteristics of the acoustic wave filter.
摘要翻译：滤波器装置包括具有顶表面和底表面的衬底和位于衬底的顶表面上的至少一个声波，其中衬底的底表面被粗糙化以减小声波的反射回到声波滤波器通过基板的底面的粗糙化，由声波滤波器产生的声波到达基板的底面的声波基本上被散射，使得实际上被反射回声波的声波装置被减少，这进而改善了声波滤波器的性能特性。

3. 发明授权

US09184483B2 Directional coupler 有权
标题翻译：定向耦合器
公开(公告)号：US09184483B2
公开(公告)日：2015-11-10
申请号：US13883613
申请日：2011-11-21
申请人： Gerhard Zeller , Manfred Stadler , Edgar Schmidhammer , Pasi Tikka
发明人： Gerhard Zeller , Manfred Stadler , Edgar Schmidhammer , Pasi Tikka
IPC分类号： H01P5/18 , H03H7/38
CPC分类号： H01P5/18 , H01P5/185 , H01P5/187
摘要： A directional coupler, comprising a first high-frequency line for feeding a first high-frequency signal, a second high-frequency line for feeding a second high-frequency signal, and a coupling line for outputting signals from the first and the second high-frequency lines, wherein the coupling line comprises resistive segments, each comprising a predetermined impedance. Coupling properties and resistive damping and adapting properties can be integrated in the coupling line. A compact and low-cost construction of the directional coupler is thus made possible.
摘要翻译：定向耦合器，包括用于馈送第一高频信号的第一高频线，用于馈送第二高频信号的第二高频线，以及用于输出来自第一和第二高频信号的信号的耦合线，频率线，其中耦合线包括每个包括预定阻抗的电阻段。耦合性能和电阻阻尼和适应性能可以集成在耦合线路中。因此，定向耦合器的紧凑且低成本的结构成为可能。

4. 发明申请

US20130009841A1 Impedance Matching Circuit Capable of Broadband Operation 有权
标题翻译：阻抗匹配电路能够进行宽带操作
公开(公告)号：US20130009841A1
公开(公告)日：2013-01-10
申请号：US13578801
申请日：2011-02-16
申请人： Edgar Schmidhammer , Pasi Tikka
发明人： Edgar Schmidhammer , Pasi Tikka
IPC分类号： H03H7/38 , H01Q21/00 , H01Q1/50
CPC分类号： H03H7/38 , H03F1/565 , H03F3/24 , H03F2200/111 , H03F2200/387 , H03H7/383 , H03H2007/386 , H04B1/0057 , H04B1/52
摘要： A broadband-operable impedance filter has capacitive elements of variable capacitance in the signal path, an inductive element in a parallel path connected in parallel to the signal path, and inductive elements in the ground path. The impedance filter allows communication in a first frequency band and the reception of HF signals in a second frequency band.
摘要翻译：宽带可操作的阻抗滤波器具有信号路径中可变电容的电容元件，并联于信号路径的并联路径中的电感元件以及接地路径中的电感元件。阻抗滤波器允许在第一频带中的通信和在第二频带中接收HF信号。

5. 发明申请

US20110280147A1 Front-End Module and Method for Testing a Front-End Module 审中-公开
标题翻译：前端模块和前端模块测试方法
公开(公告)号：US20110280147A1
公开(公告)日：2011-11-17
申请号：US13154096
申请日：2011-06-06
申请人： Pasi Tikka , Andreas Przadka , Joerg Schuler
发明人： Pasi Tikka , Andreas Przadka , Joerg Schuler
IPC分类号： H04W24/00 , H04B7/00
CPC分类号： H04B1/0053
摘要： For simpler and more rapid testing of a front-end module, additional linked operating states are provided in the switch and/or its decoder and allow a plurality of paths to be enabled in parallel, in order in this way to test these paths with a smaller number of test routines in a test set, in particular a network analyzer.
摘要翻译：为了对前端模块进行更简单和更快速的测试，在交换机和/或其解码器中提供附加的链接操作状态，并且允许并行启用多个路径，以便以这种方式来测试这些路径测试集中的测试例程数量较少，特别是网络分析仪。

6. 发明授权

US07961066B2 Bulk acoustic wave resonator filter 有权
标题翻译：体声波谐振滤波器
公开(公告)号：US07961066B2
公开(公告)日：2011-06-14
申请号：US12095085
申请日：2006-12-04
申请人： Habbo Heinze , Pasi Tikka , Edgar Schmidhammer
发明人： Habbo Heinze , Pasi Tikka , Edgar Schmidhammer
IPC分类号： H03H9/54
CPC分类号： H03H9/02007 , H03H9/0095 , H03H9/02102 , H03H9/02118 , H03H9/175 , H03H9/589 , H03H9/605 , H03H2003/0414
摘要： The invention relates to a filter operating with bulk acoustic waves, comprising at least one first resonator and at least one second resonator. In the at least one first and second resonator, a longitudinal acoustic mode is capable of propagation, for which normal dispersion is adjusted in the first resonator and abnormal dispersion in the second resonator by selection of the material and the relative layer thicknesses. In particular, the power compatibility of the filter at the higher frequency edge of its passband can be improved.
摘要翻译：本发明涉及一种使用体声波工作的滤波器，包括至少一个第一谐振器和至少一个第二谐振器。在至少一个第一和第二谐振器中，纵向声学模式能够传播，通过选择材料和相对层厚度，第一谐振器中的正常色散被调节并且在第二谐振器中异常色散。特别地，可以提高滤波器在其通带的较高频率边缘的功率兼容性。

7. 发明授权

US07616079B2 Bulk acoustic wave resonator and circuit comprising same 有权
标题翻译：体声波谐振器和包括其的电路
公开(公告)号：US07616079B2
公开(公告)日：2009-11-10
申请号：US10530507
申请日：2003-09-18
申请人： Pasi Tikka , Ralph Stömmer , Edgar Schmidhammer , Michael Unterberger
发明人： Pasi Tikka , Ralph Stömmer , Edgar Schmidhammer , Michael Unterberger
IPC分类号： H03H9/205 , H03H9/54
CPC分类号： H03H9/583
摘要： The invention relates to a resonator operating with bulk acoustic waves (BAW resonator, BAW=Bulk Acoustic Wave) and band-pass filters constructed of such resonators. To increase the edge steepness of the transmission band of a BAW band-pass filter, the invention proposes reducing the effective coupling of a BAW resonator by using the connection in parallel of a BAW resonator and a capacitor instead of only one resonator. In addition, to increase the edge steepness of the transmission band, the use of a connection of coupled BAW resonators in the serial branch of a filter circuit with another resonator or resonator stack in the parallel branch of the filter circuit is proposed, the additional resonator or resonator stack being connected to the center electrode of the resonator stack specified initially.
摘要翻译：本发明涉及一种使用体声波（BAW谐振器，BAW =体声波）和由这种谐振器构成的带通滤波器的谐振器。为了增加BAW带通滤波器的传输频带的边缘陡度，本发明通过使用与BAW谐振器和电容器并联的连接而不是只有一个谐振器来降低BAW谐振器的有效耦合。此外，为了增加传输频带的边缘陡度，提出了在滤波器电路的并联支路中使用与滤波器电路的串行分支中的另一谐振器或谐振器堆叠的耦合的BAW谐振器的连接，附加谐振器或谐振器堆叠连接到最初指定的谐振器叠层的中心电极。

8. 发明申请

US20050167854A1 Method for improving heat dissipation in encapsulated electronic components 有权
标题翻译：改善封装电子部件散热的方法
公开(公告)号：US20050167854A1
公开(公告)日：2005-08-04
申请号：US10769460
申请日：2004-01-30
申请人： Pasi Tikka , Edgar Schmidhammer , Habbo Heinze , Reiner Welzer , Herbert Zidek , Ansgar Schaufele , Juha Ella
发明人： Pasi Tikka , Edgar Schmidhammer , Habbo Heinze , Reiner Welzer , Herbert Zidek , Ansgar Schaufele , Juha Ella
IPC分类号： H01L21/60 , H01L23/28 , H01L23/31 , H01L23/36 , H03H9/10
CPC分类号： H03H9/1078 , H01L23/3135 , H01L24/81 , H01L24/97 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/81801 , H01L2224/97 , H01L2924/01029 , H01L2924/01055 , H01L2924/01057 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/3011 , H03H9/02102 , H03H9/1085 , H03H2003/025 , H01L2224/81 , H01L2924/00
摘要： A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.
摘要翻译：一种用于改善封装的电子封装中的散热的方法，通常称为芯片尺寸的SAW封装。该封装包括在芯片上制造的一个或多个声波部件，其设置在由导电凸块分开的非导电载体上。包装的顶部由层压板和气密密封层覆盖。可以通过去除层压体的一部分，然后在包装上沉积一层导热材料，并且通过提供穿过载体的一个或多个导热路径来改善散热。

9. 发明授权

US06456173B1 Method and system for wafer-level tuning of bulk acoustic wave resonators and filters 失效
标题翻译：用于体声波谐振器和滤波器的晶片级调谐的方法和系统
公开(公告)号：US06456173B1
公开(公告)日：2002-09-24
申请号：US09784634
申请日：2001-02-15
申请人： Juha Ellä , Pasi Tikka , Jyrki Kaitila
发明人： Juha Ellä , Pasi Tikka , Jyrki Kaitila
IPC分类号： H03H915
CPC分类号： H03H3/04 , H03H2003/0428 , H03H2003/0435 , H03H2003/0478 , Y10T29/42
摘要： A method and system for tuning a bulk acoustic wave device at the wafer level by adjusting the device thickness. In particular, the device thickness has a non-uniformity profile across the device surface. A mask with an aperture is placed over the device surface and a particle beam is applied over the mask to allow part of the particle beam to make contact with the device surface at a localized area beneath the aperture. The particles that pass through the aperture are deposited on the device surface to add material on the device surface, thereby increasing the surface thickness to correct for thickness non-uniformity. Alternatively, the particles that pass through the aperture remove part of the device surface in an etching process, thereby reducing the surface thickness. Prior to thickness adjustment, a frequency measurement device or thickness measurement device is used to map the device surface for obtaining the non-uniformity profile.
摘要翻译：一种通过调节器件厚度来调整晶片级的体声波器件的方法和系统。特别地，器件厚度在器件表面上具有不均匀性。具有孔径的掩模放置在器件表面上，并且将粒子束施加在掩模上以允许部分粒子束在孔下方的局部区域处与器件表面接触。通过孔的颗粒沉积在器件表面上以在器件表面上添加材料，从而增加表面厚度以校正厚度不均匀性。或者，通过孔的颗粒在蚀刻工艺中去除部件的表面，从而降低表面厚度。在厚度调整之前，使用频率测量装置或厚度测量装置来映射装置表面以获得不均匀性。

10. 发明授权

US09100109B2 Apparatus for wirelessly transmitting information, communication terminal for wirelessly transmitting information and impedance matching method 有权
标题翻译：用于无线发送信息的装置，用于无线发送信息的通信终端和阻抗匹配方法
公开(公告)号：US09100109B2
公开(公告)日：2015-08-04
申请号：US13877435
申请日：2011-08-29
申请人： Edgar Schmidhammer , Pasi Tikka
发明人： Edgar Schmidhammer , Pasi Tikka
IPC分类号： H04B1/44 , H04B1/46 , H04B15/00 , H03H7/40 , H03H7/38
CPC分类号： H04B15/00 , H03H7/40 , H03H2007/386
摘要： An apparatus for wirelessly transmitting information includes a transmitting/receiving unit and an antenna unit. An electrical signal path is between the transmitting/receiving unit and the antenna unit. A front-end module contains at least one duplexer and is electrically connected into the signal path between the transmitting/receiving unit and the antenna unit. A detector unit is used for detecting signals proportional to radio-frequency signals propagating in the signal path. The detector unit is electrically coupled to the signal path between the transmitting/receiving unit and the front-end module.
摘要翻译：用于无线发送信息的装置包括发送/接收单元和天线单元。电信号路径在发射/接收单元和天线单元之间。前端模块包含至少一个双工器，并且电连接到发射/接收单元和天线单元之间的信号路径中。检测器单元用于检测与在信号路径中传播的射频信号成比例的信号。检测器单元电耦合到发射/接收单元和前端模块之间的信号路径。

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