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1. 发明授权

US07563104B2 Printed circuit board having connectors 有权
标题翻译：具有连接器的印刷电路板
公开(公告)号：US07563104B2
公开(公告)日：2009-07-21
申请号：US11896298
申请日：2007-08-30
申请人： Han Kim , Yang Je Lee , Sang Jin Oh , Mi Ja Han
发明人： Han Kim , Yang Je Lee , Sang Jin Oh , Mi Ja Han
IPC分类号： H01R12/00
CPC分类号： H01R13/2407 , H01R12/58 , H05K3/365 , H05K2201/10295
摘要： The Printed Circuit Board (PCB) has connectors which each include a terminal part and a connector pin. The terminal part is formed in one end of the PCB and is provided with a terminal hole. The connector pin is configured such that one end thereof is inserted into the terminal hole, and the remaining end thereof extends to protrude outside the terminal hole and is also bent several times, thus forming a contact part that is elastically deformed, and electrically connected to a pad part provided in a target PCB for connection. Thus, a desirable signal transmission characteristic is guaranteed, so that the reliability of electronic devices using the PCB can be improved and the manufacturing cost can also be reduced.
摘要翻译：印刷电路板（PCB）具有连接器，每个连接器包括端子部分和连接器引脚。端子部分形成在PCB的一端并设有端子孔。连接器销被构造成使得其一端插入端子孔中，并且其剩余端延伸到端子孔外部并且也弯曲多次，从而形成弹性变形的接触部，并且电连接到设置在目标PCB中用于连接的焊盘部分。因此，保证期望的信号传输特性，从而可以提高使用PCB的电子设备的可靠性，并且还可以降低制造成本。

2. 发明申请

US20080057756A1 Printed circuit board having connectors 有权
标题翻译：具有连接器的印刷电路板
公开(公告)号：US20080057756A1
公开(公告)日：2008-03-06
申请号：US11896298
申请日：2007-08-30
申请人： Han Kim , Yang Je Lee , Sang Jin Oh , Mi Ja Han
发明人： Han Kim , Yang Je Lee , Sang Jin Oh , Mi Ja Han
IPC分类号： H01R12/00
CPC分类号： H01R13/2407 , H01R12/58 , H05K3/365 , H05K2201/10295
摘要： Disclosed herein is a Printed Circuit Board (PCB) having connectors. The PCB includes a terminal part and a connector pin. The terminal part is formed in one end of the PCB and is provided with a terminal hole. The connector pin is configured such that one end thereof is inserted into the terminal hole, and the remaining end thereof extends to protrude outside the terminal hole and is also bent several times, thus forming a contact part that is elastically deformed, and electrically connected to a pad part provided in a target PCB for connection. Thus, a desirable signal transmission characteristic is guaranteed, so that the reliability of electronic devices using the PCB can be improved and the manufacturing cost can also be reduced.
摘要翻译：本文公开了具有连接器的印刷电路板（PCB）。 PCB包括端子部分和连接器引脚。端子部分形成在PCB的一端并设有端子孔。连接器销被构造成使得其一端插入端子孔中，并且其剩余端延伸到端子孔外部并且也弯曲多次，从而形成弹性变形的接触部，并且电连接到设置在目标PCB中用于连接的焊盘部分。因此，保证期望的信号传输特性，从而可以提高使用PCB的电子设备的可靠性，并且还可以降低制造成本。

3. 发明授权

US08853560B2 Electromagnetic bandgap structure and printed circuit board 有权
标题翻译：电磁带隙结构和印刷电路板
公开(公告)号：US08853560B2
公开(公告)日：2014-10-07
申请号：US13411005
申请日：2012-03-02
申请人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
发明人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
IPC分类号： H05K1/11 , H05K1/02
CPC分类号： H05K1/0236 , H05K1/0219 , H05K1/0222 , H05K1/115 , H05K2201/09309 , H05K2201/09536 , H05K2201/09618 , H05K2201/09718 , H05K2201/09781 , Y10T29/4913 , Y10T29/49165 , Y10T428/12465
摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.
摘要翻译：公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

4. 发明授权

US08699234B2 EMI noise shield board including electromagnetic bandgap structure 有权
标题翻译： EMI噪声屏蔽板包括电磁带隙结构
公开(公告)号：US08699234B2
公开(公告)日：2014-04-15
申请号：US12984935
申请日：2011-01-05
申请人： Han Kim , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
发明人： Han Kim , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
IPC分类号： H05K1/18
CPC分类号： H05K1/0236 , H01L2224/16227 , H01L2224/16235 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/15313 , H01L2924/16251 , H01L2924/3025 , H05K3/4694
摘要： An EMI noise shield board, in which an EBG structure is inserted, includes a first board portion and a second board portion. The first board portion has an upper surface, on which an electronic part is disposed, and a circuit for transferring a signal and power to the electronic part. The second board portion is located on a lower surface of the first board portion. The electromagnetic bandgap structure is inserted into the second board portion, and has a band stop frequency property such that an EMI noise transferred from the first board portion is shielded from being radiated to the outside of the EMI noise shield board.
摘要翻译：其中插入有EBG结构的EMI噪声屏蔽板包括第一板部分和第二板部分。第一板部分具有设置有电子部件的上表面和用于将信号和电力传送到电子部件的电路。第二板部分位于第一板部分的下表面上。电磁带隙结构被插入到第二板部分中，并且具有阻挡频率特性，使得从第一板部分传送的EMI噪声被屏蔽而不被辐射到EMI噪声屏蔽板的外部。

5. 发明申请

US20110067914A1 Printed circuit board having electromagnetic bandgap structure 失效
标题翻译：具有电磁带隙结构的印刷电路板
公开(公告)号：US20110067914A1
公开(公告)日：2011-03-24
申请号：US12654361
申请日：2009-12-17
申请人： Hyo-Jic Jung , Han Kim , Mi-Ja Han , Kang-Wook Bong , Dae-Hyun Park
发明人： Hyo-Jic Jung , Han Kim , Mi-Ja Han , Kang-Wook Bong , Dae-Hyun Park
IPC分类号： H05K9/00 , H05K1/11
CPC分类号： H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K2201/09309 , H05K2201/09627 , H01L2924/00014
摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.
摘要翻译：公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元，通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板布置第二板。

6. 发明申请

US20090236141A1 Electromagnetic bandgap structure and printed circuit board 失效
标题翻译：电磁带隙结构和印刷电路板
公开(公告)号：US20090236141A1
公开(公告)日：2009-09-24
申请号：US12285133
申请日：2008-09-29
申请人： Han Kim , Mi-Ja Han , Hyo-Jic Jung
发明人： Han Kim , Mi-Ja Han , Hyo-Jic Jung
IPC分类号： H05K1/02
CPC分类号： H01P1/2005 , H01L2224/16 , H01P1/203 , H05K1/0236 , H05K1/0237 , H05K2201/09309 , H05K2201/09518 , H05K2201/096 , H05K2201/09627 , H05K2201/09663 , H05K2201/09681
摘要： According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invetion, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.
摘要翻译：根据本发明的实施例，电磁带隙结构可以包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板。在本发明的电磁带隙结构中，第一缝合通孔可以通过允许第一缝合通孔的一部分通过一个导电板上的平面连接而将一个导电板电连接到另一个导电板，缝合通孔可以通过允许第二缝合通孔的一部分通过一个导电板下面的平坦表面连接而将一个导电板电连接到另一个导电板。

7. 发明申请

US20090145646A1 Electromagnetic bandgap structure and printed circuit board 有权
标题翻译：电磁带隙结构和印刷电路板
公开(公告)号：US20090145646A1
公开(公告)日：2009-06-11
申请号：US12230871
申请日：2008-09-05
申请人： Mi-Ja Han , Dae-Hyun Park , Han Kim
发明人： Mi-Ja Han , Dae-Hyun Park , Han Kim
IPC分类号： H01G4/228 , H05K1/18
CPC分类号： H01P1/20327 , H01L2224/16225 , H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09663 , H05K2201/09681
摘要： According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.
摘要翻译：根据本发明，电路板可以包括电介质层; 多个导电板; 以及缝合通孔，以将两个导电板彼此电连接。这里，缝合通孔可以分别包括通过电介质层的第一通孔和第二通孔，并且具有一个端部与两个导电板中的每一个放置在同一平面上; 连接图案，其每个端部分别连接到第一通孔和第二通孔的另一端部; 和第一延伸图案，其放置在与导电板之一相同的平面上，并且具有一个端部连接到第一通孔的一个端部，并且端部连接到导电板之一。

8. 发明申请

US20090071709A1 Electromagnetic bandgap structure and printed circuit board including multi-via 有权
标题翻译：电磁带隙结构和印刷电路板，包括多通孔
公开(公告)号：US20090071709A1
公开(公告)日：2009-03-19
申请号：US12076650
申请日：2008-03-20
申请人： Mi-Ja Han , Han Kim , Ja-Bo Koo
发明人： Mi-Ja Han , Han Kim , Ja-Bo Koo
IPC分类号： H05K1/02
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09663
摘要： An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate.
摘要翻译：公开了一种电磁带隙结构和用于传送具有预定频带的信号的印刷电路板。特别地，电磁带隙结构包括第一金属层和第二金属层; 金属板，放置在第一金属层和第二金属层之间; 穿过第一金属层的多通孔，穿过与外部金属层相同的平面，并朝着第一金属层转动以连接金属板和第一金属层; 以及电介质层，层叠在所述第一金属层和所述金属板之间，所述金属板与所述第二金属层之间以及所述第一金属层与所述外部金属层之间。通过本发明，可以在不增加金属板的尺寸的情况下降低带隙频率。

9. 发明授权

US08314341B2 Printed circuit board having electromagnetic bandgap structure 有权
标题翻译：具有电磁带隙结构的印刷电路板
公开(公告)号：US08314341B2
公开(公告)日：2012-11-20
申请号：US12654370
申请日：2009-12-17
申请人： Han Kim , Mi-Ja Han , Kang-Wook Bong , Hyo-Jic Jung
发明人： Han Kim , Mi-Ja Han , Kang-Wook Bong , Hyo-Jic Jung
IPC分类号： H05K9/00
CPC分类号： H05K1/0236 , H05K2201/09309 , H05K2201/09627
摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a planar surface that is different from that of the second conductive plate, a connection pattern arranged on a planar surface that is different from that of the second conductive plate, a first stitching via unit configured to connect the first conductive plate to one end of the connection pattern through the planar surface where the second conductive plate is arranged, and a second stitching via unit configured to connect the third conductive plate to the other end of the connection pattern through the planar surface where the second conductive plate is arranged.
摘要翻译：公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。电磁带隙结构可以包括第一导电板，布置在与第一导电板的平面不同的平面上的第二导电板，布置在与第二导电板不同的平面上的第三导电板布置在与第二导电板的平面不同的平面上的连接图案，第一缝合通孔单元，被配置为通过布置第二导电板的平坦表面将第一导电板连接到连接图案的一端以及第二缝合通孔单元，其被配置为通过布置有第二导电板的平坦表面将第三导电板连接到连接图案的另一端。

10. 发明申请

US20110179642A1 Chip capacitor embedment method 审中-公开
标题翻译：片式电容器嵌入法
公开(公告)号：US20110179642A1
公开(公告)日：2011-07-28
申请号：US13064542
申请日：2011-03-30
申请人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
发明人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
IPC分类号： H05K3/30
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/0236 , H05K1/165 , H05K1/185 , H05K2201/093 , H05K2201/09309 , H05K2201/09509 , H05K2201/09663 , H05K2201/10636 , H05K2201/10643 , Y02P70/611 , Y10T29/4913 , Y10T29/49146
摘要： A method of embedding a chip capacitor in a printed circuit board including a first conductive layer and a dielectric layer placed on the first conductive layer includes removing the dielectric layer to form a cavity exposing the first conductive layer; seating a chip capacitor in the cavity; filling a filled material at a space excluding a space occupied by the chip capacitor in the cavity; forming a via penetrating the filled material and being connected to the chip capacitor; and stacking a conductive material to constitute a second conductive layer in surfaces of the via and the dielectric layer and in an surface of the filled material filled in the cavity.
摘要翻译：将片状电容器嵌入到包括放置在第一导电层上的第一导电层和介电层的印刷电路板中的方法包括去除电介质层以形成露出第一导电层的空腔; 将片状电容器放置在空腔中; 在不包括空腔中的片状电容器占据的空间的空间填充填充材料; 形成穿过填充材料并连接到片式电容器的通孔; 并且在通孔和电介质层的表面和填充在空腔中的填充材料的表面中堆叠导电材料以构成第二导电层。

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