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1. 发明申请

US20110179642A1 Chip capacitor embedment method 审中-公开
标题翻译：片式电容器嵌入法
公开(公告)号：US20110179642A1
公开(公告)日：2011-07-28
申请号：US13064542
申请日：2011-03-30
申请人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
发明人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
IPC分类号： H05K3/30
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/0236 , H05K1/165 , H05K1/185 , H05K2201/093 , H05K2201/09309 , H05K2201/09509 , H05K2201/09663 , H05K2201/10636 , H05K2201/10643 , Y02P70/611 , Y10T29/4913 , Y10T29/49146
摘要： A method of embedding a chip capacitor in a printed circuit board including a first conductive layer and a dielectric layer placed on the first conductive layer includes removing the dielectric layer to form a cavity exposing the first conductive layer; seating a chip capacitor in the cavity; filling a filled material at a space excluding a space occupied by the chip capacitor in the cavity; forming a via penetrating the filled material and being connected to the chip capacitor; and stacking a conductive material to constitute a second conductive layer in surfaces of the via and the dielectric layer and in an surface of the filled material filled in the cavity.
摘要翻译：将片状电容器嵌入到包括放置在第一导电层上的第一导电层和介电层的印刷电路板中的方法包括去除电介质层以形成露出第一导电层的空腔; 将片状电容器放置在空腔中; 在不包括空腔中的片状电容器占据的空间的空间填充填充材料; 形成穿过填充材料并连接到片式电容器的通孔; 并且在通孔和电介质层的表面和填充在空腔中的填充材料的表面中堆叠导电材料以构成第二导电层。

2. 发明申请

US20090085691A1 Printed circuit board with embedded chip capacitor and chip capacitor embedment method 审中-公开
标题翻译：印刷电路板采用嵌入式芯片电容和片式电容器嵌入法
公开(公告)号：US20090085691A1
公开(公告)日：2009-04-02
申请号：US12007793
申请日：2008-01-15
申请人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
发明人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
IPC分类号： H03H7/00 , H05K3/30
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/0236 , H05K1/165 , H05K1/185 , H05K2201/093 , H05K2201/09309 , H05K2201/09509 , H05K2201/09663 , H05K2201/10636 , H05K2201/10643 , Y02P70/611 , Y10T29/4913 , Y10T29/49146
摘要： A printed circuit board having an embedded chip capacitor is disclosed. According to an embodiment of the present invention, a printed circuit board having an embedded chip capacitor can include a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, placed between the first conductive layer and the second conductive layer and having a second electrode, connected to the second conductive layer; and a via, connecting the first conductive layer to a first electrode of the chip capacitor. With the present invention, a problem mixed signals can be solved in the printed circuit board including an analog circuit and a digital circuit board by using the chip capacitor embedded in the printed circuit board as an electromagnetic bandgap structure. Here, various electrical devices or elements are mounted in the printed circuit board.
摘要翻译：公开了一种具有嵌入式芯片电容器的印刷电路板。根据本发明的实施例，具有嵌入式芯片电容器的印刷电路板可以包括第一导电层; 远离所述第一导电层放置的第二导电层; 芯片电容器，放置在第一导电层和第二导电层之间，并具有连接到第二导电层的第二电极; 以及将所述第一导电层连接到所述芯片电容器的第一电极的通孔。利用本发明，通过使用嵌入在印刷电路板中的片状电容器作为电磁带隙结构，可以在包括模拟电路和数字电路板的印刷电路板中解决问题混合信号。这里，各种电气设备或元件安装在印刷电路板中。

3. 发明授权

US08279616B2 Printed circuit board with embedded chip capacitor 失效
标题翻译：带嵌入式芯片电容器的印刷电路板
公开(公告)号：US08279616B2
公开(公告)日：2012-10-02
申请号：US13064541
申请日：2011-03-30
申请人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
发明人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
IPC分类号： H05K1/18
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/0236 , H05K1/165 , H05K1/185 , H05K2201/093 , H05K2201/09309 , H05K2201/09509 , H05K2201/09663 , H05K2201/10636 , H05K2201/10643 , Y02P70/611 , Y10T29/4913 , Y10T29/49146
摘要： A printed circuit board having an embedded chip capacitor includes a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, having a first electrode connected to the first conductive layer through being seated in a cavity formed between the first conductive layer and the second conductive layer; a filled material, filled in a space excluding a space occupied by the chip capacitor in the cavity; and a via, penetrating the filled material and connecting the second conductive layer to the second electrode of the chip capacitor.
摘要翻译：具有嵌入式芯片电容器的印刷电路板包括：第一导电层; 远离所述第一导电层放置的第二导电层; 芯片电容器，其具有通过位于形成在第一导电层和第二导电层之间的空腔中而连接到第一导电层的第一电极; 填充材料，填充在空腔内不包括由片状电容器占据的空间的空间中; 以及通孔，穿透填充材料并将第二导电层连接到片式电容器的第二电极。

4. 发明申请

US20110180312A1 Printed circuit board with embedded chip capacitor 失效
标题翻译：带嵌入式芯片电容器的印刷电路板
公开(公告)号：US20110180312A1
公开(公告)日：2011-07-28
申请号：US13064541
申请日：2011-03-30
申请人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
发明人： Han Kim , Je-Gwang Yoo , Mi-Ja Han , Dae-Hyun Park
IPC分类号： H05K1/18
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/0236 , H05K1/165 , H05K1/185 , H05K2201/093 , H05K2201/09309 , H05K2201/09509 , H05K2201/09663 , H05K2201/10636 , H05K2201/10643 , Y02P70/611 , Y10T29/4913 , Y10T29/49146
摘要： A printed circuit board having an embedded chip capacitor includes a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, having a first electrode connected to the first conductive layer through being seated in a cavity formed between the first conductive layer and the second conductive layer; a filled material, filled in a space excluding a space occupied by the chip capacitor in the cavity; and a via, penetrating the filled material and connecting the second conductive layer to the second electrode of the chip capacitor.
摘要翻译：具有嵌入式芯片电容器的印刷电路板包括：第一导电层; 远离所述第一导电层放置的第二导电层; 芯片电容器，其具有通过位于形成在第一导电层和第二导电层之间的空腔中而连接到第一导电层的第一电极; 填充材料，填充在空腔内不包括由片状电容器占据的空间的空间中; 以及通孔，穿透填充材料并将第二导电层连接到片式电容器的第二电极。

5. 发明授权

US08853560B2 Electromagnetic bandgap structure and printed circuit board 有权
标题翻译：电磁带隙结构和印刷电路板
公开(公告)号：US08853560B2
公开(公告)日：2014-10-07
申请号：US13411005
申请日：2012-03-02
申请人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
发明人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
IPC分类号： H05K1/11 , H05K1/02
CPC分类号： H05K1/0236 , H05K1/0219 , H05K1/0222 , H05K1/115 , H05K2201/09309 , H05K2201/09536 , H05K2201/09618 , H05K2201/09718 , H05K2201/09781 , Y10T29/4913 , Y10T29/49165 , Y10T428/12465
摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.
摘要翻译：公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

6. 发明授权

US08699234B2 EMI noise shield board including electromagnetic bandgap structure 有权
标题翻译： EMI噪声屏蔽板包括电磁带隙结构
公开(公告)号：US08699234B2
公开(公告)日：2014-04-15
申请号：US12984935
申请日：2011-01-05
申请人： Han Kim , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
发明人： Han Kim , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
IPC分类号： H05K1/18
CPC分类号： H05K1/0236 , H01L2224/16227 , H01L2224/16235 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/15313 , H01L2924/16251 , H01L2924/3025 , H05K3/4694
摘要： An EMI noise shield board, in which an EBG structure is inserted, includes a first board portion and a second board portion. The first board portion has an upper surface, on which an electronic part is disposed, and a circuit for transferring a signal and power to the electronic part. The second board portion is located on a lower surface of the first board portion. The electromagnetic bandgap structure is inserted into the second board portion, and has a band stop frequency property such that an EMI noise transferred from the first board portion is shielded from being radiated to the outside of the EMI noise shield board.
摘要翻译：其中插入有EBG结构的EMI噪声屏蔽板包括第一板部分和第二板部分。第一板部分具有设置有电子部件的上表面和用于将信号和电力传送到电子部件的电路。第二板部分位于第一板部分的下表面上。电磁带隙结构被插入到第二板部分中，并且具有阻挡频率特性，使得从第一板部分传送的EMI噪声被屏蔽而不被辐射到EMI噪声屏蔽板的外部。

7. 发明申请

US20110067914A1 Printed circuit board having electromagnetic bandgap structure 失效
标题翻译：具有电磁带隙结构的印刷电路板
公开(公告)号：US20110067914A1
公开(公告)日：2011-03-24
申请号：US12654361
申请日：2009-12-17
申请人： Hyo-Jic Jung , Han Kim , Mi-Ja Han , Kang-Wook Bong , Dae-Hyun Park
发明人： Hyo-Jic Jung , Han Kim , Mi-Ja Han , Kang-Wook Bong , Dae-Hyun Park
IPC分类号： H05K9/00 , H05K1/11
CPC分类号： H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K2201/09309 , H05K2201/09627 , H01L2924/00014
摘要： Disclosed is a printed circuit board into which an electromagnetic bandgap structure for blocking a noise is inserted. The electromagnetic bandgap structure can include a first conductor and a second conductor arranged on different planar surfaces, a third conductor arranged on a same planar surface that is different from a planar surface where the second conductor is arranged, and a first stitching via unit configured to connect the first conductor to the third connector through the planar surface where the second conductor is arranged and being electrically separated from the second conductor. The first conductor can include a first plate, a second plate spaced from the first plate, and a second stitching unit configured to electrically connect the first plate to the second plate through a planar surface that is different from a planar surface where the first plate and the second plate are arranged.
摘要翻译：公开了一种印刷电路板，其中插入用于阻挡噪声的电磁带隙结构。电磁带隙结构可以包括布置在不同平面上的第一导体和第二导体，布置在与布置第二导体的平面不同的相同平面上的第三导体，以及第一缝合通孔单元，通过布置第二导体的平面表面将第一导体连接到第三连接器，并与第二导体电分离。第一导体可以包括第一板，与第一板间隔开的第二板，以及第二缝合单元，其被配置为通过与第一板和第二板的平坦表面不同的平面表面将第一板电连接到第二板布置第二板。

8. 发明申请

US20090145646A1 Electromagnetic bandgap structure and printed circuit board 有权
标题翻译：电磁带隙结构和印刷电路板
公开(公告)号：US20090145646A1
公开(公告)日：2009-06-11
申请号：US12230871
申请日：2008-09-05
申请人： Mi-Ja Han , Dae-Hyun Park , Han Kim
发明人： Mi-Ja Han , Dae-Hyun Park , Han Kim
IPC分类号： H01G4/228 , H05K1/18
CPC分类号： H01P1/20327 , H01L2224/16225 , H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09663 , H05K2201/09681
摘要： According to the present invention, the board can include a dielectric layer; a plurality of conductive plates; and a stitching via, to electrically connect two of the conductive plates to each other. Here, the stitching via can include a first via and a second via, respectively, passing through the dielectric layer and having one end part being placed on a same planar surface as each of the two conductive plates; a connection pattern, having each end part being connected to the other end part of the first via and the second via, respectively; and a first extension pattern, placed on the same planar surface as one of the conductive plates and having one end part being connected to the one end part of the first via and the end part being connected to one of the conductive plates.
摘要翻译：根据本发明，电路板可以包括电介质层; 多个导电板; 以及缝合通孔，以将两个导电板彼此电连接。这里，缝合通孔可以分别包括通过电介质层的第一通孔和第二通孔，并且具有一个端部与两个导电板中的每一个放置在同一平面上; 连接图案，其每个端部分别连接到第一通孔和第二通孔的另一端部; 和第一延伸图案，其放置在与导电板之一相同的平面上，并且具有一个端部连接到第一通孔的一个端部，并且端部连接到导电板之一。

9. 发明授权

US07965521B2 Electromagnetic bandgap structure and printed circuit board 失效
标题翻译：电磁带隙结构和印刷电路板
公开(公告)号：US07965521B2
公开(公告)日：2011-06-21
申请号：US12010558
申请日：2008-01-25
申请人： Mi-Ja Han , Han Kim , Dae-Hyun Park , Jae-Joon Lee
发明人： Mi-Ja Han , Han Kim , Dae-Hyun Park , Jae-Joon Lee
IPC分类号： H05K9/00
CPC分类号： H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09663 , H05K2201/0969
摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.
摘要翻译：公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。根据本发明的实施例，电磁带隙结构可以包括第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，将所述第一金属层连接到所述金属板; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 和第二金属层，堆叠在第二介电层中。这里，可以在金属板上形成孔。利用本发明，与具有相同尺寸的其他结构相比，电磁带隙结构可以在相同频带内更低噪声水平。

10. 发明申请

US20080266026A1 Electromagnetic bandgap structure and printed circuit board 失效
标题翻译：电磁带隙结构和印刷电路板
公开(公告)号：US20080266026A1
公开(公告)日：2008-10-30
申请号：US12010558
申请日：2008-01-25
申请人： Mi-Ja Han , Han Kim , Dae-Hyun Park , Jae-Joon Lee
发明人： Mi-Ja Han , Han Kim , Dae-Hyun Park , Jae-Joon Lee
IPC分类号： H03H7/00
CPC分类号： H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09663 , H05K2201/0969
摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.
摘要翻译：公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。根据本发明的实施例，电磁带隙结构可以包括第一金属层; 第一介电层，堆叠在第一金属层中; 金属板，堆叠在第一介电层中; 通孔，将所述第一金属层连接到所述金属板; 第二电介质层，堆叠在所述金属板和所述第一介电层中; 和第二金属层，堆叠在第二介电层中。这里，可以在金属板上形成孔。利用本发明，与具有相同尺寸的其他结构相比，电磁带隙结构可以在相同频带内更低噪声水平。

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