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    • 1. 发明授权
    • Apparatus and method for cooling integrated circuit devices
    • 用于冷却集成电路器件的装置和方法
    • US06917522B1
    • 2005-07-12
    • US10747978
    • 2003-12-29
    • Hakan ErturkIoan SauciucEdgar J. Unrein
    • Hakan ErturkIoan SauciucEdgar J. Unrein
    • H01L23/427H05K7/20
    • H01L23/427H01L2924/0002H01L2924/00
    • Some embodiments of a method and apparatus for cooling integrated circuit devices are described. In one embodiment, the apparatus includes a thermosiphon having an evaporator portion coupled to a first surface of a heat source and a condenser portion coupled to the evaporator portion distal from the first surface of the heat source. A remote heat exchanger is coupled to the condenser of the thermosiphon. In addition, one or more thermoelectric elements are coupled between the heat exchanger and the condenser of the thermosiphon. In one embodiment, the remote heat exchanger, the thermoelectric elements and the condenser portion of the thermosiphon are located outside a chassis of a one rack unit (1U) server computer.
    • 描述用于冷却集成电路器件的方法和装置的一些实施例。 在一个实施例中,该装置包括具有联接到热源的第一表面的蒸发器部分和耦合到远离热源的第一表面的蒸发器部分的冷凝器部分的热虹吸管。 远程热交换器耦合到热虹吸管的冷凝器。 此外,一个或多个热电元件连接在热交换器和热虹吸管的冷凝器之间。 在一个实施例中,热虹吸管的远程热交换器,热电元件和冷凝器部分位于一个机架单元(1U)服务器计算机的机架外部。
    • 2. 发明授权
    • Heatsink assembly
    • 散热器组装
    • US06885557B2
    • 2005-04-26
    • US10422707
    • 2003-04-24
    • Edgar J. Unrein
    • Edgar J. Unrein
    • H01L23/40H05K7/20
    • H01L23/4006H01L2924/0002H01L2924/3011Y10T24/44026H01L2924/00
    • A system assembly for the retention of heatsinks, in particular, high-mass heatsinks, is disclosed. The system assembly includes a backplate with standoffs extending transverse to a system board, for securing a heatsink to the system board. The standoffs effectively distribute the mass of the heatsink away from the system board, the processor, and socket, minimizing damage to these components. A TIM spring disposed within the backplate provides upward pressure to the system assembly to uniformly spread a thermal interface material between the processor and the heatsink, thereby facilitating effective heat transfer.
    • 公开了用于保持散热器,特别是高质量散热器的系统组件。 系统组件包括具有横向于系统板延伸的支座的背板,用于将散热器固定到系统板。 对接有效地将散热器的质量远离系统板,处理器和插座,最大限度地减少对这些组件的损坏。 设置在背板内的TIM弹簧向系统组件提供向上的压力,以在处理器和散热器之间均匀地散布热界面材料,从而有助于有效的热传递。
    • 5. 发明授权
    • Method and apparatus for providing managed modular sub-environments in a personal computer
    • 用于在个人计算机中提供管理的模块化子环境的方法和装置
    • US06490157B2
    • 2002-12-03
    • US09388848
    • 1999-09-01
    • Edgar J. Unrein
    • Edgar J. Unrein
    • G05F120
    • G06F1/16G06F1/18G06F1/20
    • A managed modular sub-environment for a computer system. In one embodiment, a plurality of modular managed sub-environments are included within an outer enclosure of a computer system. In one embodiment, the modular managed sub-environments have a managed thermal environment and a managed electromagnetic interference (EMI) environment. The computer system components enclosed within each sub-environment are less likely to be affected by the EMI or thermal energy from another neighboring sub-environment. Each of the plurality of modular managed sub-environments are coupled to a computer system backplane including a common bus, which distributes communications and power among the plurality of modular managed sub-environments.
    • 用于计算机系统的托管模块化子环境。 在一个实施例中,多个模块化管理子环境包括在计算机系统的外壳内。 在一个实施例中,模块化的受管理子环境具有被管理的热环境和被管理的电磁干扰(EMI)环境。 封闭在每个子环境内的计算机系统组件不太可能受到来自另一个相邻子环境的EMI或热能的影响。 多个模块化管理子环境中的每一个被耦合到包括公共总线的计算机系统背板,公共总线在多个模块化管理的子环境之间分配通信和电力。
    • 8. 发明授权
    • Partitioned computer platform
    • 分区电脑平台
    • US06597569B1
    • 2003-07-22
    • US09607538
    • 2000-06-29
    • Edgar J. Unrein
    • Edgar J. Unrein
    • G06F120
    • G06F1/20G06F1/181G06F1/183
    • A computer platform according to this invention includes a plurality of electronic components. A platform housing is divided into isolated thermal partitions, including a core partition and a non-core partition. One or more of the electronic components are located within each of the core and non-core partitions. These partitions provide an isolated thermal environment allowing for independent control of the thermal characteristics, including a temperature, of that environment. The computer platform can also include a remote cooling partition having a cooling system for cooling a processor of the platform. A modular computer platform can also be provided in which the core, non-core, and remote cooling partitions are readily attachable and detachable from each other.
    • 根据本发明的计算机平台包括多个电子部件。 平台壳体分为隔离的热隔离物,包括核心隔板和非核心隔板。 一个或多个电子部件位于每个核心和非核心分区内。 这些隔板提供隔离的热环境,可独立控制该环境的热特性,包括温度。 计算机平台还可以包括具有用于冷却平台的处理器的冷却系统的远程冷却分区。 还可以提供一种模块化的计算机平台,其中核心,非核心和远程冷却隔板彼此容易地附接和拆卸。
    • 9. 发明授权
    • Processor arrangement and thermal interface
    • 处理器布置和热接口
    • US06437979B1
    • 2002-08-20
    • US09607183
    • 2000-06-29
    • Edgar J. Unrein
    • Edgar J. Unrein
    • H05K720
    • G06F1/20G06F1/181G06F1/183
    • A computer platform according to this invention includes a housing. A CPU board is located within the housing and a power pod assembly is located adjacent a first side of the CPU board. A CPU socket is located on a second side of the CPU board, opposite the first side of the CPU board. A processor is mounted within the CPU socket and arranged in electrical communication with the power pod. A cooling device located adjacent the processor on the second side of the CPU board, and is configured to cool the processor. A processor arrangement for a computer platform is also provided which includes a CPU board having a processor mounted on the CPU board. A biasing mechanism supplies a biasing force against the processor to maintain it in thermal communication with a cooling device.
    • 根据本发明的计算机平台包括壳体。 CPU板位于壳体内,并且电源盒组件位于CPU板的第一侧附近。 CPU插槽位于CPU板的第二侧,与CPU板的第一侧相对。 处理器安装在CPU插座内并且布置成与电源盒电连通。 位于CPU板的第二侧处的处理器附近的冷却装置,并且被配置为冷却处理器。 还提供了一种用于计算机平台的处理器装置,其包括具有安装在CPU板上的处理器的CPU板。 偏压机构向处理器提供偏压力以保持其与冷却装置热连通。