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1. 发明授权

US08054629B2 Microfins for cooling an ultramobile device 有权
标题翻译：用于冷却超移动装置的微烯烃
公开(公告)号：US08054629B2
公开(公告)日：2011-11-08
申请号：US12286708
申请日：2008-09-30
申请人： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
发明人： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H05K7/20418 , H01L23/3677 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
摘要翻译：本发明公开了一种用连接到围绕超移动装置的外壳的外壁的微结构冷却超移动装置的方法。

2. 发明申请

US20100079955A1 Microfins for cooling an ultramobile device 有权
标题翻译：用于冷却超移动装置的微烯烃
公开(公告)号：US20100079955A1
公开(公告)日：2010-04-01
申请号：US12286708
申请日：2008-09-30
申请人： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
发明人： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/20418 , H01L23/3677 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
摘要翻译：本发明公开了一种用连接到围绕超移动装置的外壳的外壁的微结构冷却超移动装置的方法。

3. 发明申请

US20080158812A1 Method and system to cool memory 有权
公开(公告)号：US20080158812A1
公开(公告)日：2008-07-03
申请号：US11646065
申请日：2006-12-27
申请人： Hakan Erturk , Gregory M. Chrysler , Ioan Sauciuc
发明人： Hakan Erturk , Gregory M. Chrysler , Ioan Sauciuc
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： A method, apparatus, and system related to thermal management. The method includes reducing a temperature of a stream of air upstream of at least one memory module by a heat absorption component of a refrigeration device, moving the stream of air into contact with at least one surface of the at least one memory module and transferring heat provided by the at least one memory module and a heat rejection component of the refrigeration device to a location downstream of the at least one memory module.

4. 发明申请

US20050280996A1 Heat dissipating device with enhanced boiling/condensation structure 有权
标题翻译：具有较高沸点/冷凝结构的散热装置
公开(公告)号：US20050280996A1
公开(公告)日：2005-12-22
申请号：US10870201
申请日：2004-06-16
申请人： Hakan Erturk , Ioan Sauciuc
发明人： Hakan Erturk , Ioan Sauciuc
IPC分类号： F28D15/02 , F28D15/04 , F28F13/18 , H01L23/427 , H05K7/20
CPC分类号： F28D15/046 , F28D15/043 , F28F13/187 , F28F2245/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.
摘要翻译：散热装置所述散热装置包括放置在产生热量的装置上的接收板，与所述接收板连接的蒸发器，与所述蒸发器流体连通的冷凝器柱以及从所述冷凝器延伸的一组冷凝器延伸表面。蒸发器包括调制多孔层并储存液体。冷凝器柱包括非润湿表面。冷凝器延伸表面有助于散热。

5. 发明授权

US06917522B1 Apparatus and method for cooling integrated circuit devices 有权
标题翻译：用于冷却集成电路器件的装置和方法
公开(公告)号：US06917522B1
公开(公告)日：2005-07-12
申请号：US10747978
申请日：2003-12-29
申请人： Hakan Erturk , Ioan Sauciuc , Edgar J. Unrein
发明人： Hakan Erturk , Ioan Sauciuc , Edgar J. Unrein
IPC分类号： H01L23/427 , H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Some embodiments of a method and apparatus for cooling integrated circuit devices are described. In one embodiment, the apparatus includes a thermosiphon having an evaporator portion coupled to a first surface of a heat source and a condenser portion coupled to the evaporator portion distal from the first surface of the heat source. A remote heat exchanger is coupled to the condenser of the thermosiphon. In addition, one or more thermoelectric elements are coupled between the heat exchanger and the condenser of the thermosiphon. In one embodiment, the remote heat exchanger, the thermoelectric elements and the condenser portion of the thermosiphon are located outside a chassis of a one rack unit (1U) server computer.
摘要翻译：描述用于冷却集成电路器件的方法和装置的一些实施例。在一个实施例中，该装置包括具有联接到热源的第一表面的蒸发器部分和耦合到远离热源的第一表面的蒸发器部分的冷凝器部分的热虹吸管。远程热交换器耦合到热虹吸管的冷凝器。此外，一个或多个热电元件连接在热交换器和热虹吸管的冷凝器之间。在一个实施例中，热虹吸管的远程热交换器，热电元件和冷凝器部分位于一个机架单元（1U）服务器计算机的机架外部。

6. 发明授权

US07265979B2 Cooling integrated circuits using a cold plate with two phase thin film evaporation 有权
标题翻译：冷却集成电路采用冷板两相薄膜蒸发
公开(公告)号：US07265979B2
公开(公告)日：2007-09-04
申请号：US10876399
申请日：2004-06-24
申请人： Hakan Erturk , Ioan Sauciuc
发明人： Hakan Erturk , Ioan Sauciuc
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： H01L23/427 , H01L2924/0002 , H05K7/20363 , H01L2924/00
摘要： A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in contact with the integrated circuit. Cooling liquid passes through the cold plate where it starts boiling inside of the microchannels. The wall allows gas bubbles to pass through while preventing the passage of liquid. As a result, the gas bubbles may be removed from the liquid flow by upward buoyancy. The removal of the gas bubbles improves the operation of the cold plate in some embodiments.
摘要翻译：一种用于冷却半导体电子器件的微通道冷板，其可包括与冷却通道中的液体接触的半透壁。冷板又可能与集成电路接触。冷却液通过冷板，开始在微通道内部沸腾。该壁允许气泡通过，同时防止液体通过。结果，气泡可以通过向上的浮力从液体流中去除。在一些实施例中，去除气泡改善了冷板的操作。

7. 发明授权

US08482922B2 Microfins for cooling an ultramobile device 有权
标题翻译：用于冷却超移动装置的微烯烃
公开(公告)号：US08482922B2
公开(公告)日：2013-07-09
申请号：US13189389
申请日：2011-07-22
申请人： Zhihua Li , Cheng-Chieh Hsieh , Jack Hu , Hakan Erturk , George Chen
发明人： Zhihua Li , Cheng-Chieh Hsieh , Jack Hu , Hakan Erturk , George Chen
IPC分类号： H05K7/20 , B21D53/02
CPC分类号： H05K7/20418 , H01L23/3677 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
摘要翻译：本发明公开了一种用连接到围绕超移动装置的外壳的外壁的微结构冷却超移动装置的方法。

8. 发明申请

US20100047092A1 Piezoelectric fan, method of cooling a microelectronic device using same, and system containing same 审中-公开
标题翻译：压电风扇，使用其的微电子器件的冷却方法以及包含该微电子器件的系统
公开(公告)号：US20100047092A1
公开(公告)日：2010-02-25
申请号：US12589408
申请日：2009-10-22
申请人： Hakan Erturk , Ioan Sauciuc
发明人： Hakan Erturk , Ioan Sauciuc
IPC分类号： F04B17/00 , H02N2/00 , H02N2/06
CPC分类号： F04D33/00
摘要： A piezoelectric fan comprises a blade (110, 210, 310, 410, 510, 610), a piezoelectric actuator patch (120, 220, 320, 420, 520 ,620, 811) adjacent to the blade, and a piezoelectric sensor patch (130, 230, 330, 430, 530, 630, 812) adjacent to one of the piezoelectric actuator patch and the blade. The piezoelectric sensor patch measures a voltage proportional to a deflection of the piezoelectric actuator patch and a deflection of a tip of the blade and uses that voltage to generate an input signal to an active feedback controller (840) that in turn ensures that the oscillation amplitude of the blade satisfies certain cooling specifications.
摘要翻译：压电风扇包括叶片（110,210,310,410,510,610），与叶片相邻的压电致动器贴片（120,220,320,420,520,620,811）和压电传感器贴片（ 130,230,330,430,530,630,812），与所述压电致动器补片和所述刀片之一相邻。压电传感器贴片测量与压电致动器贴片的偏转成比例的电压和刀片的尖端的偏转，并且使用该电压来产生到主动反馈控制器（840）的输入信号，从而确保振荡幅度的叶片满足一定的冷却规格。

9. 发明授权

US07457116B2 Method and system to cool memory 有权
标题翻译：方法和系统来冷却内存
公开(公告)号：US07457116B2
公开(公告)日：2008-11-25
申请号：US11646065
申请日：2006-12-27
申请人： Hakan Erturk , Gregory M. Chrysler , Ioan Sauciuc
发明人： Hakan Erturk , Gregory M. Chrysler , Ioan Sauciuc
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： G06F1/20 , G06F2200/201
摘要： A method, apparatus, and system related to thermal management. The method includes reducing a temperature of a stream of air upstream of at least one memory module by a heat absorption component of a refrigeration device, moving the stream of air into contact with at least one surface of the at least one memory module and transferring heat provided by the at least one memory module and a heat rejection component of the refrigeration device to a location downstream of the at least one memory module.
摘要翻译：与热管理相关的方法，设备和系统。该方法包括通过制冷装置的吸热部件降低至少一个存储器模块上游的空气流的温度，使空气流与至少一个存储器模块的至少一个表面接触并传递热量由所述至少一个存储器模块提供，以及所述制冷装置的散热部件到所述至少一个存储器模块的下游位置。

10. 发明授权

US07327572B2 Heat dissipating device with enhanced boiling/condensation structure 有权
公开(公告)号：US07327572B2
公开(公告)日：2008-02-05
申请号：US11582626
申请日：2006-10-17
申请人： Hakan Erturk , Ioan Sauciuc
发明人： Hakan Erturk , Ioan Sauciuc
IPC分类号： H05K7/20 , F28D15/00 , H01L23/34
CPC分类号： F28D15/046 , F28D15/043 , F28F13/187 , F28F2245/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.

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