专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070213195A1 Illuminating Glass 审中-公开
标题翻译：照明玻璃
公开(公告)号：US20070213195A1
公开(公告)日：2007-09-13
申请号：US11547606
申请日：2005-03-24
申请人： Hajime Hikata , Masaru Ikebe
发明人： Hajime Hikata , Masaru Ikebe
IPC分类号： C03C3/093
CPC分类号： C03C4/085 , C03C3/093 , C03C3/095 , C03C3/097 , C03C3/11 , H01J61/302
摘要： An illuminating glass that is capable of shielding of ultraviolet radiation lying on the large wavelength side, for example, 313 nm, and exhibits high transparency. The illuminating glass is characterized by containing, by mass, 50-78% SiO2, 11-25% B2O3, 0-10% Al2O3, 3-20% Li2O+Na2O+K2O, 0-10% MgO, 0-10% CaO, 0-20% SrO, 0-20% BaO, 0-15% ZnO, 2.6-9% TiO2 and 0.001-5% AS2O3+Sb2O3.
摘要翻译：能够屏蔽位于大波长侧的紫外线照射例如313nm的照明玻璃，显示高透明性。该照明玻璃的特征在于，以质量计含有50-78％的SiO 2，11-25％的B 2 O 3，O- 10％的Al 2 O 3，3〜20％的Li 2 O + Na 2 O + K＆lt; SUB＆gt; > 2O，0-10％MgO，0-10％CaO，0-20％SrO，0-20％BaO，0-15％ZnO，2.6-9％TiO 2 >和0.001-5％AS 2 O 3 + Sb 2 O 3 3。

2. 发明授权

US5643840A Low temperature sealing composition with reduced SiO.sub.2 content but 失效
标题翻译：低温密封组合物的SiO2含量降低
公开(公告)号：US5643840A
公开(公告)日：1997-07-01
申请号：US583134
申请日：1995-12-28
申请人： Hajime Hikata , Yoshitaka Jimura , Kumi Tanaka
发明人： Hajime Hikata , Yoshitaka Jimura , Kumi Tanaka
IPC分类号： C03C3/072 , C03C3/074 , C03C3/253 , C03C8/24 , C03C8/14
CPC分类号： C03C3/072 , C03C3/074 , C03C3/253 , C03C8/24
摘要： A low temperature sealing composition comprising PbO--B.sub.2 O.sub.3 --Bi.sub.2 O.sub.3 glass powder with a reduced amount of SiO.sub.2 content but with an addition of GeO.sub.2 so as to realize a lowered sealing temperature such as 400.degree.-310.degree. C. The glass powder consists essentially of 25-85 wt. % of PbO, 1-11.2 wt. % of B.sub.2 O.sub.3, 5.1-70 wt. % of Bi.sub.2 O.sub.3, 0.1-20 wt. % of GeO.sub.2, 0-5 wt. % of SiO.sub.2, 0-10 wt. % of Fe.sub.2 O.sub.3, 0-10 wt. % of CuO, 0-15 wt. % of ZnO, 0-5 wt. % of TiO.sub.2, and 0-9 wt. % of F.sub.2. The glass powder may be used by mixing with 15-55 vol. % of refractory filler powder of at least one element which is selected from the group consisting of lead titanate based ceramic powder, willemite based ceramic powder, cordierite ceramic powder, zircon based ceramic powder, tin oxide solid solution powder, and alumina powder.
摘要翻译：一种低温密封组合物，其包含具有减少的SiO 2含量但添加GeO 2的PbO-B 2 O 3 -TiO 2玻璃粉末，以实现降低的密封温度，例如400〜-310℃。玻璃粉末基本上由25 -85重量％的PbO，1-11.2wt。 B2O3％，5.1-70wt。％的Bi2O3，0.1-20wt。％的GeO 2，0-5wt。％的SiO 2，0〜10重量％％的Fe2O3，0-10wt。％的CuO，0-15wt。％的ZnO，0-5wt。％的TiO 2和0-9wt。 F2的％。玻璃粉可以与15-55体积的混合使用。选自钛酸铅基陶瓷粉末，硅锌矿型陶瓷粉末，堇青石陶瓷粉末，锆石基陶瓷粉末，氧化锡固溶粉末和氧化铝粉末中的至少一种元素的耐火填料粉末的％。

3. 发明授权

US06410633B1 Antibacterial glass and resin composite comprising the same 失效
标题翻译：抗菌玻璃和含有它的树脂复合材料
公开(公告)号：US06410633B1
公开(公告)日：2002-06-25
申请号：US09497451
申请日：2000-02-03
申请人： Hajime Hikata , Kazuyoshi Shindo , Toshio Yamanaka
发明人： Hajime Hikata , Kazuyoshi Shindo , Toshio Yamanaka
IPC分类号： C08K338
CPC分类号： C08K3/40 , A46D1/00 , A46D1/006 , C03C3/066 , C03C2204/02 , C08K3/38
摘要： An antibacterial glass is a ZnO—B2O3—SiO2 glass and includes 0-6 wt % Na2O. Typically, the antibacterial glass is used as an antibacterial agent which is filled into a resin.
摘要翻译：抗菌玻璃是ZnO-B2O3-SiO2玻璃，包括0-6wt％的Na2O。通常，将抗菌玻璃用作填充在树脂中的抗菌剂。

4. 发明授权

US5346863A Low temperature sealing composition 失效
标题翻译：低温密封组成
公开(公告)号：US5346863A
公开(公告)日：1994-09-13
申请号：US164136
申请日：1993-12-08
申请人： Hajime Hikata , Kumi Tanaka , Kazuyoshi Shindo
发明人： Hajime Hikata , Kumi Tanaka , Kazuyoshi Shindo
IPC分类号： C03C3/14 , C03C8/24 , C03C8/10
CPC分类号： C03C3/142 , C03C8/24
摘要： A low temperature sealing composition consists essentially of 45.0 to 85.0 wt. % of PbO, 1.0 to 11.0 wt. % of B.sub.2 O.sub.3, 1.0 to 45.0 wt. % of Bi.sub.2 O.sub.3, 0.2 to 10.0 wt. % of Fe.sub.2 O.sub.3, 0 to 15.0 wt. % of ZnO, 0 to 5.0 wt. % of CuO, 0 to 5.0 wt. % of V.sub.2 O.sub.5, 0 to 3.0 wt. % of SnO.sub.2, 0 to 5.0 wt. % of SiO.sub.2 plus Al.sub.2 O.sub.3, 0 to 7.0 wt. % of BaO, 0 to 5.0 wt. % of TiO.sub.2, 0 to 5.0 wt. % of ZrO.sub.2 and 0 to 6.0 wt. % of F.sub.2. The sealing composition has a low sealing temperature of 400.degree.C. or lower and is useful for readily sealing IC packages and display panels without application of load. In order to adjust the thermal coefficient of expansion, the sealing glass composition may be used by mixing with 20 vol. % to 55 vol. % of refractory filler powder of such as lead titanate based ceramics, willemite based ceramics, cordierite ceramics, zircon based ceramics or tin oxide based ceramics.
摘要翻译：低温密封组合物基本上由45.0至85.0重量％％的PbO，1.0〜11.0wt。％的B2O3，1.0〜45.0wt。％的Bi2O3，0.2〜10.0wt。％的Fe 2 O 3，0〜15.0wt。％的ZnO，0〜5.0wt。％的CuO，0〜5.0wt。 V2O5％，0〜3.0wt。％的SnO 2，0〜5.0重量％％的SiO 2加Al 2 O 3，0〜7.0wt。％的BaO，0〜5.0wt。％的TiO 2，0-5.0wt。％的ZrO 2和0〜6.0重量％ F2的％。密封组合物的密封温度低于400℃或更低，并且可用于容易地密封IC封装和显示面板而不施加负载。为了调整热膨胀系数，可以将密封玻璃组合物与20体积份混合使用。％至55体积如钛酸铅基陶瓷，硅铝土系陶瓷，堇青石陶瓷，锆石系陶瓷或氧化锡系陶瓷等耐火填料粉末的比例。

5. 发明授权

US07470999B2 Glass for semiconductor encapsulation and outer tube for semiconductor encapsulation, and semiconductor electronic parts 有权
标题翻译：用于半导体封装的玻璃和用于半导体封装的外管，以及半导体电子部件
公开(公告)号：US07470999B2
公开(公告)日：2008-12-30
申请号：US11663953
申请日：2005-09-29
申请人： Kazuya Saito , Hajime Hikata
发明人： Kazuya Saito , Hajime Hikata
IPC分类号： H01L23/29
CPC分类号： C03C3/097 , C03C3/087 , C03C3/091 , H01C1/028 , H01C7/008 , H01L23/291 , H01L24/01 , H01L2924/09701 , H01L2924/12041 , H01L2924/00
摘要： An object of the invention is to provide glass for semiconductor encapsulation and an outer tube for semiconductor encapsulation which are friendly to environment and allow semiconductor electronic parts to have a heat resistance of 700° C. or higher as normal maximum temperature, and semiconductor electronic parts. The glass for semiconductor encapsulation according to the invention contains essentially no lead and the temperature at which viscosity reaches 1010 dPa·s is 700° C. or higher. According to such a constitution, since the glass contains essentially no lead, no harmful ingredients are discharged in the production of the outer tube for semiconductor encapsulation and in the production of the semiconductor electronic parts and thus the glass is friendly to environment. Moreover, since the temperature at which viscosity reaches 1010 dPa·s is 700° C. or higher, semiconductor electronic parts such as a bead thermistor using the same has a heat resistance of 700° C. or higher as normal maximum temperature.
摘要翻译：本发明的目的是提供半导体封装用玻璃和半导体封装用外管，其对于环境友好，使半导体电子部件的耐热性为正常最高温度为700℃以上，半导体电子部件。根据本发明的半导体封装用玻璃基本上不含铅，粘度达到1010dPa.s的温度为700℃以上。根据这样的结构，由于玻璃基本上不含铅，所以在半导体封装用外管的制造和半导体电子部件的制造中不会排出有害成分，因此玻璃对环境友好。此外，由于粘度达到1010dPa.s的温度为700℃以上，所以使用这样的半导体电子部件如使用该温度的珠粒热敏电阻的耐热性为正常的最高温度为700℃以上。

6. 发明申请

US20080128923A1 Glass for Semiconductor Encapsulation and Outer Tube for Semiconductor Encapsulation, and Semiconductor Electronic Parts 有权
标题翻译：用于半导体封装的半导体封装和外管用玻璃，以及半导体电子部件
公开(公告)号：US20080128923A1
公开(公告)日：2008-06-05
申请号：US11663953
申请日：2005-09-29
申请人： Kazuya Saito , Hajime Hikata
发明人： Kazuya Saito , Hajime Hikata
IPC分类号： H01L23/29 , C03C3/00 , C03C3/083 , C03C3/087 , C03C3/097 , C03C3/091
CPC分类号： C03C3/097 , C03C3/087 , C03C3/091 , H01C1/028 , H01C7/008 , H01L23/291 , H01L24/01 , H01L2924/09701 , H01L2924/12041 , H01L2924/00
摘要： An object of the invention is to provide glass for semiconductor encapsulation and an outer tube for semiconductor encapsulation which are friendly to environment and allow semiconductor electronic parts to have a heat resistance of 700° C. or higher as normal maximum temperature, and semiconductor electronic parts. The glass for semiconductor encapsulation according to the invention contains essentially no lead and the temperature at which viscosity reaches 1010 dPa·s is 700° C. or higher. According to such a constitution, since the glass contains essentially no lead, no harmful ingredients are discharged in the production of the outer tube for semiconductor encapsulation and in the production of the semiconductor electronic parts and thus the glass is friendly to environment. Moreover, since the temperature at which viscosity reaches 1010 dPa·s is 700° C. or higher, semiconductor electronic parts such as a bead thermistor using the same has a heat resistance of 700° C. or higher as normal maximum temperature.
摘要翻译：本发明的目的是提供半导体封装用玻璃和半导体封装用外管，其对于环境友好，使半导体电子部件的耐热性为正常最高温度为700℃以上，半导体电子部件。根据本发明的用于半导体封装的玻璃基本上不含铅，粘度达到10℃的温度为700℃以上。根据这样的结构，由于玻璃基本上不含铅，所以在半导体封装用外管的制造和半导体电子部件的制造中不会排出有害成分，因此玻璃对环境友好。此外，由于粘度达到10Pa·dPa.s的温度为700℃以上，所以使用这样的半导体电子部件，例如使用其的珠粒热敏电阻的耐热性为700℃，高于正常最高温度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式