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1. 发明授权

US5643840A Low temperature sealing composition with reduced SiO.sub.2 content but 失效
标题翻译：低温密封组合物的SiO2含量降低
公开(公告)号：US5643840A
公开(公告)日：1997-07-01
申请号：US583134
申请日：1995-12-28
申请人： Hajime Hikata , Yoshitaka Jimura , Kumi Tanaka
发明人： Hajime Hikata , Yoshitaka Jimura , Kumi Tanaka
IPC分类号： C03C3/072 , C03C3/074 , C03C3/253 , C03C8/24 , C03C8/14
CPC分类号： C03C3/072 , C03C3/074 , C03C3/253 , C03C8/24
摘要： A low temperature sealing composition comprising PbO--B.sub.2 O.sub.3 --Bi.sub.2 O.sub.3 glass powder with a reduced amount of SiO.sub.2 content but with an addition of GeO.sub.2 so as to realize a lowered sealing temperature such as 400.degree.-310.degree. C. The glass powder consists essentially of 25-85 wt. % of PbO, 1-11.2 wt. % of B.sub.2 O.sub.3, 5.1-70 wt. % of Bi.sub.2 O.sub.3, 0.1-20 wt. % of GeO.sub.2, 0-5 wt. % of SiO.sub.2, 0-10 wt. % of Fe.sub.2 O.sub.3, 0-10 wt. % of CuO, 0-15 wt. % of ZnO, 0-5 wt. % of TiO.sub.2, and 0-9 wt. % of F.sub.2. The glass powder may be used by mixing with 15-55 vol. % of refractory filler powder of at least one element which is selected from the group consisting of lead titanate based ceramic powder, willemite based ceramic powder, cordierite ceramic powder, zircon based ceramic powder, tin oxide solid solution powder, and alumina powder.
摘要翻译：一种低温密封组合物，其包含具有减少的SiO 2含量但添加GeO 2的PbO-B 2 O 3 -TiO 2玻璃粉末，以实现降低的密封温度，例如400〜-310℃。玻璃粉末基本上由25 -85重量％的PbO，1-11.2wt。 B2O3％，5.1-70wt。％的Bi2O3，0.1-20wt。％的GeO 2，0-5wt。％的SiO 2，0〜10重量％％的Fe2O3，0-10wt。％的CuO，0-15wt。％的ZnO，0-5wt。％的TiO 2和0-9wt。 F2的％。玻璃粉可以与15-55体积的混合使用。选自钛酸铅基陶瓷粉末，硅锌矿型陶瓷粉末，堇青石陶瓷粉末，锆石基陶瓷粉末，氧化锡固溶粉末和氧化铝粉末中的至少一种元素的耐火填料粉末的％。

2. 发明申请

US20050123478A1 Agent for measurement of singlet oxygen 审中-公开
标题翻译：单线态氧测量剂
公开(公告)号：US20050123478A1
公开(公告)日：2005-06-09
申请号：US11035979
申请日：2005-01-18
申请人： Tetsuo Nagano , Yasuteru Urano , Kumi Tanaka
发明人： Tetsuo Nagano , Yasuteru Urano , Kumi Tanaka
IPC分类号： C07D311/82 , C07D493/08 , C07D493/10 , C07D493/22 , G01N33/00 , C07D493/14
CPC分类号： C07D493/08 , C07D311/82 , C07D493/10 , Y10T436/20
摘要： Compounds useful as agents for measurement of singlet oxygen, which are represented by the following general formula (I): wherein R1, R2, R3, R4, R5, and R6 independently represent a hydrogen atom, a halogen atom, a C1-6 alkyl group, or a C1-6alkoxyl group, R7 and R8 independently represent a C1-4alkyl group, and R9 represents a hydrogen atom, a C1-12 alkanoyl group, or acetoxymethyl group, or salts thereof.
摘要翻译：用作测量单线态氧的试剂的化合物，其由以下通式（I）表示：其中R 1，R 2，R 3， R 4，R 5，R 5和R 6独立地表示氢原子，卤素原子，C 1〜 C 6烷基或C 1-6烷氧基，R 7和R 8独立地表示C 1 -C 6烷基， 1-4个烷基，R 9表示氢原子，C 1-12烷酰基或乙酰氧基甲基，或其盐。

3. 发明授权

US5346863A Low temperature sealing composition 失效
标题翻译：低温密封组成
公开(公告)号：US5346863A
公开(公告)日：1994-09-13
申请号：US164136
申请日：1993-12-08
申请人： Hajime Hikata , Kumi Tanaka , Kazuyoshi Shindo
发明人： Hajime Hikata , Kumi Tanaka , Kazuyoshi Shindo
IPC分类号： C03C3/14 , C03C8/24 , C03C8/10
CPC分类号： C03C3/142 , C03C8/24
摘要： A low temperature sealing composition consists essentially of 45.0 to 85.0 wt. % of PbO, 1.0 to 11.0 wt. % of B.sub.2 O.sub.3, 1.0 to 45.0 wt. % of Bi.sub.2 O.sub.3, 0.2 to 10.0 wt. % of Fe.sub.2 O.sub.3, 0 to 15.0 wt. % of ZnO, 0 to 5.0 wt. % of CuO, 0 to 5.0 wt. % of V.sub.2 O.sub.5, 0 to 3.0 wt. % of SnO.sub.2, 0 to 5.0 wt. % of SiO.sub.2 plus Al.sub.2 O.sub.3, 0 to 7.0 wt. % of BaO, 0 to 5.0 wt. % of TiO.sub.2, 0 to 5.0 wt. % of ZrO.sub.2 and 0 to 6.0 wt. % of F.sub.2. The sealing composition has a low sealing temperature of 400.degree.C. or lower and is useful for readily sealing IC packages and display panels without application of load. In order to adjust the thermal coefficient of expansion, the sealing glass composition may be used by mixing with 20 vol. % to 55 vol. % of refractory filler powder of such as lead titanate based ceramics, willemite based ceramics, cordierite ceramics, zircon based ceramics or tin oxide based ceramics.
摘要翻译：低温密封组合物基本上由45.0至85.0重量％％的PbO，1.0〜11.0wt。％的B2O3，1.0〜45.0wt。％的Bi2O3，0.2〜10.0wt。％的Fe 2 O 3，0〜15.0wt。％的ZnO，0〜5.0wt。％的CuO，0〜5.0wt。 V2O5％，0〜3.0wt。％的SnO 2，0〜5.0重量％％的SiO 2加Al 2 O 3，0〜7.0wt。％的BaO，0〜5.0wt。％的TiO 2，0-5.0wt。％的ZrO 2和0〜6.0重量％ F2的％。密封组合物的密封温度低于400℃或更低，并且可用于容易地密封IC封装和显示面板而不施加负载。为了调整热膨胀系数，可以将密封玻璃组合物与20体积份混合使用。％至55体积如钛酸铅基陶瓷，硅铝土系陶瓷，堇青石陶瓷，锆石系陶瓷或氧化锡系陶瓷等耐火填料粉末的比例。

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