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    • 1. 发明授权
    • Film deposition apparatus
    • 膜沉积装置
    • US08721790B2
    • 2014-05-13
    • US12963673
    • 2010-12-09
    • Hitoshi KatoManabu HonmaKohichi OritoYasushi TakeuchiHiroyuki Kikuchi
    • Hitoshi KatoManabu HonmaKohichi OritoYasushi TakeuchiHiroyuki Kikuchi
    • C23C16/453C23C16/455C23C16/458H01L21/306C23F1/00C23C16/06C23C16/22
    • C23C16/45551C23C16/4412C23C16/45521C23C16/45578
    • A film deposition apparatus includes a turntable provided in the chamber and having on a first surface a substrate receiving area in which a substrate is placed; first and second reaction gas supplying portions supplying first and second reaction gases to the first surface, respectively; a separation gas supplying portion provided between the first reaction gas supplying portion and the second reaction gas supplying portion and supplying a separation gas that separates the first reaction gas and the second reaction gas; an evacuation port that evacuates the chamber; a space defining member provided for at least one of the first and second reaction gas supplying portions and defining a first space between the at least one of the first and second reaction gas supplying portions and the turntable and a second space so that the separation gas is likely to flow through the second space rather than the first space.
    • 一种成膜装置,包括设置在所述室中并在第一表面上具有放置基板的基板接收区域的转盘; 分别向第一表面供应第一和第二反应气体的第一和第二反应气体供应部分; 分离气体供给部,设置在第一反应气体供给部和第二反应气体供给部之间,供给分离第一反应气体和第二反应气体的分离气体; 疏散室的疏散口; 设置在所述第一反应气体供给部和所述第二反应气体供给部中的至少一个的空间限定部件,在所述第一反应气体供给部和所述第二反应气体供给部中的至少一个与所述转台之间形成第一空间, 可能流经第二空间而不是第一空间。
    • 2. 发明申请
    • FILM DEPOSITION APPARATUS
    • 胶片沉积装置
    • US20110139074A1
    • 2011-06-16
    • US12963673
    • 2010-12-09
    • HITOSHI KATOManabu HonmaKohichi OritoYasushi TakeuchiHiroyuki Kikuchi
    • HITOSHI KATOManabu HonmaKohichi OritoYasushi TakeuchiHiroyuki Kikuchi
    • C23C16/458C23C16/00
    • C23C16/45551C23C16/4412C23C16/45521C23C16/45578
    • A film deposition apparatus includes a turntable provided in the chamber and having on a first surface a substrate receiving area in which a substrate is placed; first and second reaction gas supplying portions supplying first and second reaction gases to the first surface, respectively; a separation gas supplying portion provided between the first reaction gas supplying portion and the second reaction gas supplying portion and supplying a separation gas that separates the first reaction gas and the second reaction gas; an evacuation port that evacuates the chamber; a space defining member provided for at least one of the first and second reaction gas supplying portions and defining a first space between the at least one of the first and second reaction gas supplying portions and the turntable and a second space so that the separation gas is likely to flow through the second space rather than the first space.
    • 一种成膜装置,包括设置在所述室中并在第一表面上具有放置基板的基板接收区域的转盘; 分别向第一表面供应第一和第二反应气体的第一和第二反应气体供应部分; 分离气体供给部,设置在第一反应气体供给部和第二反应气体供给部之间,供给分离第一反应气体和第二反应气体的分离气体; 疏散室的疏散口; 设置在所述第一反应气体供给部和所述第二反应气体供给部中的至少一个的空间限定部件,在所述第一反应气体供给部和所述第二反应气体供给部中的至少一个与所述转台之间形成第一空间, 可能流经第二空间而不是第一空间。
    • 6. 发明申请
    • FILM DEPOSITION APPARATUS
    • 胶片沉积装置
    • US20120222615A1
    • 2012-09-06
    • US13221188
    • 2011-08-30
    • Hitoshi KATOTsuneyuki OkabeManabu HonmaTakeshi KumagaiYasushi Takeuchi
    • Hitoshi KATOTsuneyuki OkabeManabu HonmaTakeshi KumagaiYasushi Takeuchi
    • C23C16/455
    • H01L21/68764C23C16/45551H01L21/68771
    • A film deposition apparatus includes a first turntable including at least ten substrate receiving areas that receive corresponding 300 mm substrates; a first reaction gas supplying portion arranged in a first area inside the chamber to supply a first reaction gas; a second reaction gas supplying portion arranged in a second area away from the first reaction gas supplying portion along the rotation direction of the first turntable to supply a second reaction gas; and a separation area arranged between the first and the second areas. The separation area includes a separation gas supplying portion that supplies a separation gas that separates the first reaction and the second reaction gases, and a ceiling surface having a height so that a pressure in a space between the ceiling surface and the first turntable is higher with the separation gas than pressures in the first and the second areas.
    • 一种成膜装置包括:第一转盘,其包括至少十个接收对应的300mm基板的基板接收区域; 第一反应气体供给部,其布置在所述室内的第一区域中,以供应第一反应气体; 第二反应气体供给部,其沿着第一转台的旋转方向配置在远离第一反应气体供给部的第二区域,供给第二反应气体; 以及布置在第一和第二区域之间的分离区域。 分离区域包括供给分离第一反应和第二反应气体的分离气体的分离气体供给部以及具有使顶棚面与第一转台之间的空间内的压力较高的高度的顶面, 分离气体而不是第一和第二区域中的压力。
    • 8. 发明申请
    • FILM DEPOSITION APPARATUS
    • 胶片沉积装置
    • US20100229797A1
    • 2010-09-16
    • US12713317
    • 2010-02-26
    • HITOSHI KATOManabu HonmaHiroyuki Kikuchi
    • HITOSHI KATOManabu HonmaHiroyuki Kikuchi
    • C23C16/00
    • H01L21/68764C23C16/402C23C16/45551C23C16/45578C23C16/45589H01L21/68771
    • A disclosed film deposition apparatus for depositing a film on a substrate by supplying a reaction gas to an upper surface of the substrate in a vacuum chamber includes a susceptor provided in the vacuum chamber, wherein substrate receiving areas are formed along a circle whose center lies in a center portion of the susceptor; a main gas supplying portion provided opposing the susceptor in order to supply the reaction gas to the substrate receiving areas of the susceptor; a compensation gas supplying portion configured to supply the reaction gas to an upper surface of the susceptor in order to compensate for concentration of the reaction gas supplied from the main gas supplying portion along a radius direction of the susceptor; and a rotation mechanism configured to rotate the susceptor relative to the main gas supplying portion and the compensation gas supplying portion around the center portion of the susceptor.
    • 公开的一种用于在真空室中将反应气体提供给基板的上表面的基板上沉积薄膜的薄膜沉积装置包括设置在真空室中的基座,其中基板接收区域沿着中心位于 基座的中心部分; 主气体供给部,其与所述基座相对设置,以将所述反应气体供应到所述基座的所述基板接收区域; 补偿气体供给部,其构造成将反应气体供给到所述基座的上表面,以补偿从所述主气体供给部沿着所述基座的半径方向供给的反应气体的浓度; 以及旋转机构,其构造成使所述基座相对于所述主气体供给部和所述补偿气体供给部围绕所述基座的中心部旋转。
    • 9. 发明申请
    • FILM DEPOSITION APPARATUS, FILM DEPOSITION METHOD, AND COMPUTER READABLE STORAGE MEDIUM
    • 薄膜沉积装置,薄膜​​沉积方法和计算机可读存储介质
    • US20100227059A1
    • 2010-09-09
    • US12713225
    • 2010-02-26
    • Hitoshi KatoManabu HonmaHiroyuki Kikuchi
    • Hitoshi KatoManabu HonmaHiroyuki Kikuchi
    • C23C16/458C23C16/00C23C16/52
    • C23C16/45551
    • A film is deposited to a predetermined thickness on a wafer by allowing the wafer placed on a susceptor to alternately move through plural process areas where corresponding plural reaction gases are supplied from corresponding plural reaction gas supplying portions and a separation area where a separation gas is supplied from a separation gas supplying portion in order to separate the plural reaction gases. Such movement is achieved by rotating the susceptor relative to the plural reaction gas supplying portions and the separation gas supplying portion, or rotating the plural reaction gas supplying portions and the separation gas supplying portion relative to the susceptor. Then, when the film is deposited in the above manner to a predetermined thickness, the film deposition is temporarily stopped; the wafer is rotated around its center; and the film is deposited to another predetermined thickness in the same manner.
    • 通过允许放置在基座上的晶片交替地移动通过从相应的多个反应气体供应部分供应相应的多个反应气体的多个处理区域和分离气体供应的分离区域,将薄膜沉积到晶片上的预定厚度 从分离气体供给部分分离多个反应气体。 通过使基座相对于多个反应气体供给部和分离气体供给部旋转,或者使多个反应气体供给部和分离气体供给部相对于基座旋转而实现。 然后,当以上述方式将膜沉积到预定厚度时,膜沉积暂时停止; 晶片绕其中心旋转; 并且以相同的方式将膜沉积到另一预定厚度。