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    • 2. 发明授权
    • Nonvolatile semiconductor memory device and manufacturing method thereof
    • 非易失性半导体存储器件及其制造方法
    • US09070621B2
    • 2015-06-30
    • US14076261
    • 2013-11-10
    • Hitachi, Ltd.
    • Yoshitaka SasagoMasaharu KinoshitaMitsuharu TaiTakashi Kobayashi
    • H01L27/24H01L27/102
    • H01L27/2481H01L27/1021H01L27/2409H01L27/2436H01L27/2472
    • In a nonvolatile semiconductor memory device, there is provided a technique which promotes microfabrication by reducing a thickness of the device as suppressing an OFF current of a polysilicon diode which is a selective element. A polysilicon layer to which an impurity is doped at low concentration and which becomes an electric-field relaxation layer of the polysilicon diode which is a selective element of a resistance variable memory is formed so as to be divided into two or more layers such as polysilicon layers. In this manner, it is suppressed to form the crystal grain boundaries thoroughly penetrating between an n-type polysilicon layer and a p-type polysilicon layer in the electric-field relaxation layer, and therefore, it is prevented to generate a leakage current flowing through the crystal grain boundaries in application of a reverse-bias voltage without increasing a height of the polysilicon diode.
    • 在非易失性半导体存储器件中,提供了一种通过减小作为选择元件的多晶硅二极管的截止电流来减小器件厚度来促进微细加工的技术。 形成以低浓度掺杂有杂质并作为电阻可变存储器的选择元件的多晶硅二极管的电场弛豫层的多晶硅层,以被分成两层或多层,例如多晶硅 层。 以这种方式抑制电场弛豫层中的n型多晶硅层和p型多晶硅层之间的晶粒边界完全透过,从而防止产生流过的漏电流 在不增加多晶硅二极管的高度的情况下施加反偏压的晶界。