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1. 发明申请

US20070201204A1 Liquid cooling loops for server applications 有权
标题翻译：用于服务器应用的液体冷却回路
公开(公告)号：US20070201204A1
公开(公告)日：2007-08-30
申请号：US11707350
申请日：2007-02-16
申请人： Girish Upadhya , Mark Munch , Norman Chow , Paul Tsao , Douglas Werner , Mark McMaster , Frederic Landry , Ian Spearing , Tim Schrader
发明人： Girish Upadhya , Mark Munch , Norman Chow , Paul Tsao , Douglas Werner , Mark McMaster , Frederic Landry , Ian Spearing , Tim Schrader
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要翻译：液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。每个电子服务器包括一个或多个发热装置。集成到每个电子服务器上是一种基于液体的冷却系统。每个基于液体的冷却系统包括服务器泵和通过流体管线耦合在一起的一个或多个微通道冷板（MCP）。用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。排料板通过热界面材料连接到底盘冷板。在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

2. 发明申请

US20080006396A1 Multi-stage staggered radiator for high performance liquid cooling applications 审中-公开
标题翻译：用于高性能液体冷却应用的多级交错散热器
公开(公告)号：US20080006396A1
公开(公告)日：2008-01-10
申请号：US11823796
申请日：2007-06-27
申请人： Girish Upadhya , Norman Chow , Douglas Werner
发明人： Girish Upadhya , Norman Chow , Douglas Werner
IPC分类号： F28D1/00
CPC分类号： F28F9/262
摘要： A fluid-based cooling system including a multistage staggered radiator is configured to distribute a parallel airflow to each radiator in the multistage radiator. Each radiator is staggered so as to expose a total frontal area of the radiators to the parallel airflow in a minimized vertical space. Air ducts are configured to provide isolated air pathways into and, in some cases, out of each radiator in the multistage radiator.
摘要翻译：包括多级交错散热器的基于流体的冷却系统被配置为将平行气流分配到多级散热器中的每个散热器。每个散热器交错，以便在最小化的垂直空间中将散热器的正面面积暴露于平行气流。空气管道被配置为向多级散热器中的每个散热器提供隔离的空气通路，并且在某些情况下提供每个散热器。

3. 发明申请

US20070201210A1 Liquid cooling loops for server applications 有权
标题翻译：用于服务器应用的液体冷却回路
公开(公告)号：US20070201210A1
公开(公告)日：2007-08-30
申请号：US11707332
申请日：2007-02-16
申请人： Norman Chow , Paul Tsao , Douglas Werner , Mark McMaster , Girish Upadhya , Frederic Landry , Ian Spearing , Tim Schrader
发明人： Norman Chow , Paul Tsao , Douglas Werner , Mark McMaster , Girish Upadhya , Frederic Landry , Ian Spearing , Tim Schrader
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.
摘要翻译：安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。

4. 发明授权

US07599184B2 Liquid cooling loops for server applications 有权
标题翻译：用于服务器应用的液体冷却回路
公开(公告)号：US07599184B2
公开(公告)日：2009-10-06
申请号：US11707350
申请日：2007-02-16
申请人： Girish Upadhya , Mark Munch , Norman Chow , Paul Tsao , Douglas E. Werner , Mark McMaster , Frederic Landry , Ian Spearing , Tim Schrader
发明人： Girish Upadhya , Mark Munch , Norman Chow , Paul Tsao , Douglas E. Werner , Mark McMaster , Frederic Landry , Ian Spearing , Tim Schrader
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要翻译：液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。每个电子服务器包括一个或多个发热装置。集成到每个电子服务器上是一种基于液体的冷却系统。每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。排料板通过热界面材料连接到底盘冷板。在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

5. 发明授权

US07539020B2 Liquid cooling loops for server applications 有权
标题翻译：用于服务器应用的液体冷却回路
公开(公告)号：US07539020B2
公开(公告)日：2009-05-26
申请号：US11707332
申请日：2007-02-16
申请人： Norman Chow , Paul Tsao , Douglas E. Werner , Mark McMaster , Girish Upadhya , Frederic Landry , Ian Spearing , Tim Schrader
发明人： Norman Chow , Paul Tsao , Douglas E. Werner , Mark McMaster , Girish Upadhya , Frederic Landry , Ian Spearing , Tim Schrader
IPC分类号： H05K7/16
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.
摘要翻译：安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。为了确保良好的热接触，在两个热交换器，排料盘和底盘冷板之间施加压力。用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。安装机构包括互锁机构，其防止施加的力传递到电子服务器的其余部分。在不隔离该力的情况下，该力被施加到电子服务器和/或机架机架，可能断开电子服务器和机架之间的电连接，以及向电子服务器和机架机架提供机械应力。安装机构还耦合到电子服务器锁定机构，使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。这是一个故障安全程序，因为不需要单独的过程来接合电子服务器冷却回路。

6. 发明申请

US20090046423A1 Internal access mechanism for a server rack 有权
标题翻译：服务器机架的内部访问机制
公开(公告)号：US20090046423A1
公开(公告)日：2009-02-19
申请号：US12221961
申请日：2008-08-07
申请人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
发明人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.
摘要翻译：电子外壳的后面板包括一个或多个热交换器。后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。可以通过在诸如标准门的铰链上使门打开来提供这种接近。在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。在一些实施例中，每个部分像标准门一样旋转打开。在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

7. 发明授权

US07746634B2 Internal access mechanism for a server rack 有权
标题翻译：服务器机架的内部访问机制
公开(公告)号：US07746634B2
公开(公告)日：2010-06-29
申请号：US12221961
申请日：2008-08-07
申请人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
发明人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.
摘要翻译：电子外壳的后面板包括一个或多个热交换器。后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。可以通过在诸如标准门的铰链上使门打开来提供这种接近。在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。在一些实施例中，每个部分像标准门一样旋转打开。在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

8. 发明申请

US20060042785A1 Pumped fluid cooling system and method 审中-公开
标题翻译：泵送流体冷却系统及方法
公开(公告)号：US20060042785A1
公开(公告)日：2006-03-02
申请号：US10927800
申请日：2004-08-27
申请人： Douglas Werner , Kenneth Goodson , Mark Munch , Girish Upadhya
发明人： Douglas Werner , Kenneth Goodson , Mark Munch , Girish Upadhya
IPC分类号： F28F7/00
CPC分类号： F28F9/0263 , F28F3/12 , F28F2260/02
摘要： The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system. The pumped fluid cooling system and method also includes adjusting the chemical composition of the working fluid, specifically adjusting the composition and viscosity as the sensitivity to the fluid heat capacity per unit mas increases.
摘要翻译：本发明是一种泵送流体冷却系统和方法。泵送流体冷却系统和方法包括泵送流体系统的电阻的平流，对流和扩散分量的相对量级。泵送流体冷却系统和方法还包括调整工作流体的化学成分，特别是调整组成和粘度，因为每单位流体热容量的敏感度增加。

9. 发明申请

US20070256825A1 Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect 审中-公开
标题翻译：通过使用具有柔性流体互连的远程驱动室热交换器来安装在个人计算机的子卡/扩展卡上的发热部件的液体冷却的方法
公开(公告)号：US20070256825A1
公开(公告)日：2007-11-08
申请号：US11800303
申请日：2007-05-03
申请人： Bruce Conway , Richard Brewer , Paul Tsao , James Hom , Douglas Werner , Peng Zhou , Girish Upadhya , Madhav Datta , Ali Firouzi , Fredric Landry
发明人： Bruce Conway , Richard Brewer , Paul Tsao , James Hom , Douglas Werner , Peng Zhou , Girish Upadhya , Madhav Datta , Ali Firouzi , Fredric Landry
IPC分类号： G05D23/00 , H01L23/467
CPC分类号： G06F1/20 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A cooling system includes a cooling unit configured to fit within a single drive bay of a personal computer. The cooling unit includes a fluid-to-air heat exchanger, an air mover, a pump, fluid lines, and control circuitry. The cooling system also includes a cooling loop configured to be coupled to one or more heat generating devices. The cooling loop includes the pump and the fluid-to-air heat exchanger from the cooling unit, and at least one heat exchanger coupled together via flexible fluid lines. The heat exchanger is thermally coupled to the heat generating device. The cooling unit is configured to maintain noise below a specified acoustical specification. To meet this acoustical specification, the size, position, and type of the components within the cooling unit are specifically configured.
摘要翻译：冷却系统包括被配置为装配在个人计算机的单个驱动器托架内的冷却单元。冷却单元包括流体对空气热交换器，鼓风机，泵，流体管线和控制电路。冷却系统还包括被配置为联接到一个或多个发热装置的冷却回路。冷却回路包括来自冷却单元的泵和流体对空气热交换器，以及通过柔性流体管线连接在一起的至少一个热交换器。热交换器热耦合到发热装置。冷却单元被配置为将噪声保持在低于规定声学规范的范围内。为了达到这种声学规格，冷却装置内的部件的尺寸，位置和类型被特别地配置。

10. 发明申请

US20070227709A1 Multi device cooling 审中-公开
标题翻译：多器件冷却
公开(公告)号：US20070227709A1
公开(公告)日：2007-10-04
申请号：US11731541
申请日：2007-03-29
申请人： Girish Upadhya , Douglas E. Werner , Mark Munch
发明人： Girish Upadhya , Douglas E. Werner , Mark Munch
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D1/0408 , F28D2021/0028 , F28F3/022 , F28F2270/00 , G06F2200/201 , H05K7/20154
摘要： A micro scale cooling system comprises a first heat exchanger thermally coupled to a first heat source. The cooling system also has a second heat exchanger thermally coupled to a second heat source and a connection between the first heat exchanger and the second heat exchanger. A fluid flows through the first and second cooling plates. The cooling system has a first pump for driving the fluid. The cooling system further includes a first radiator and tubing that interconnects the first heat exchanger, the second heat exchanger, the first pump, and the first radiator. The tubing of some embodiments is designed to minimize fluid loss. Some embodiments optionally include a first fan to reject heat from the first radiator, and/or a volume compensator for counteracting fluid loss over time. In some embodiments, at least one heat exchanger has at least one micro scale structure. Some embodiments include a method of cooling the heat sources for a multi device configuration by using such a cooling system.
摘要翻译：微型冷却系统包括热耦合到第一热源的第一热交换器。冷却系统还具有热耦合到第二热源的第二热交换器和第一热交换器与第二热交换器之间的连接。流体流过第一和第二冷却板。冷却系统具有用于驱动流体的第一泵。冷却系统还包括第一散热器和连接第一热交换器，第二热交换器，第一泵和第一辐射器的管道。一些实施例的管道被设计成使流体损失最小化。一些实施例可选地包括第一风扇以排除来自第一散热器的热量，和/或用于抵消随着时间的流体损失的体积补偿器。在一些实施例中，至少一个热交换器具有至少一个微尺度结构。一些实施例包括通过使用这种冷却系统来冷却多器件配置的热源的方法。

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