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    • 10. 发明授权
    • Semiconductor component including an edge termination having a trench and method for producing
    • 包括具有沟槽的边缘终端和用于制造的方法的半导体部件
    • US08093676B2
    • 2012-01-10
    • US12166531
    • 2008-07-02
    • Gerhard Schmidt
    • Gerhard Schmidt
    • H01L23/58
    • H01L21/26586H01L23/3178H01L29/0638H01L29/0661H01L29/0692H01L29/41766H01L29/66136H01L29/6634H01L29/66727H01L29/7396H01L29/7811H01L29/8613H01L2924/0002H01L2924/13055H01L2924/13091H01L2924/00
    • A semiconductor component includes a semiconductor body having a first side, a second side, an edge delimiting the semiconductor body in a lateral direction, an inner region and an edge region. A first semiconductor zone of a first conduction type is arranged in the inner region and in the edge region. A second semiconductor zone of a second conduction type is arranged in the inner region and adjacent to the first semiconductor zone. A trench is arranged in the edge region and has first and second sidewalls and a bottom, and extends into the semiconductor body. A doped first sidewall zone of the second conduction type is adjacent to the first sidewall of the trench. A doped second sidewall zone of the second conduction type is adjacent to the second sidewall of the trench. A doped bottom zone of the second conduction type is adjacent to the bottom of the trench. Doping concentrations of the sidewall zones are lower than a doping concentration of the bottom zone.
    • 半导体部件包括半导体本体,其具有第一侧,第二侧,在横向方向上限定半导体本体的边缘,内部区域和边缘区域。 第一导电类型的第一半导体区域布置在内部区域和边缘区域中。 第二导电类型的第二半导体区域布置在内部区域中且与第一半导体区域相邻。 沟槽设置在边缘区域中并且具有第一和第二侧壁和底部,并延伸到半导体本体中。 第二导电类型的掺杂的第一侧壁区域与沟槽的第一侧壁相邻。 第二导电类型的掺杂第二侧壁区域与沟槽的第二侧壁相邻。 第二导电类型的掺杂底部区域与沟槽的底部相邻。 侧壁区域的掺杂浓度低于底部区域的掺杂浓度。