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    • 3. 发明授权
    • Method of treating industrial waste waters
    • 处理工业废水的方法
    • US06582605B2
    • 2003-06-24
    • US09894527
    • 2001-06-27
    • Gerald A. KrulikJosh H. Golden
    • Gerald A. KrulikJosh H. Golden
    • C02F154
    • C02F1/70C02F1/5236C02F1/54C02F2101/30C02F2209/06Y10S210/908
    • A method of treating industrial wastewaters is provided. Specifically, the wastewater includes one or more organic contaminant materials and is pre-treated prior to filtering by the following steps The pH of the wastewater is adjusted to a pH in the range of about 2 to 6, and a combination of iron salts and peroxide are added to the wastewater and allowed to react for a period of at least about three minutes. Next, the pH of the wastewater is adjusted upwards to a value of at least 7 and precipitating or flocculating agents are added to form an insoluble contaminant bearing compound. The compound is then filtered from the wastewater thereby removing the contaminant materials from the wastewater. This invention is particularly suited for use with single pass flow-through filters, and most particularly suitable for high flow rate single pass flow-through filters. The method of the present invention results in minimization of filter clogging and maintenance of high filtration flow rates, with reduced need for cleaning cycles using lengthy treatment by acid based or detergent mixtures.
    • 提供了一种处理工业废水的方法。 具体地,废水包括一种或多种有机污染物质,并且在通过以下步骤过滤之前进行预处理。将废水的pH调节至约2至6范围内的pH,以及铁盐和过氧化物的组合 被添加到废水中并允许反应至少约三分钟。 接下来,将废水的pH调节至至少7的值,并加入沉淀或絮凝剂以形成不溶性污染物带有化合物。 然后将化合物从废水中过滤,从而从废水中除去污染物质。 本发明特别适用于单通流通过滤器,特别适用于高流速单通流通滤器。 本发明的方法导致过滤器堵塞和维持高过滤流速的最小化,减少了通过使用酸性或洗涤剂混合物进行长时间处理的清洁循环的需要。
    • 5. 发明授权
    • Recycle process for regeneration of ammoniacal copper etchant
    • 氨铜腐蚀剂再生回收工艺
    • US5556553A
    • 1996-09-17
    • US447752
    • 1995-05-23
    • Gerald A. KrulikNenad V. MandichRajwant Singh
    • Gerald A. KrulikNenad V. MandichRajwant Singh
    • C23F1/46B44C1/22C23F1/00
    • C23F1/46
    • A process for control of recycle of ammoniacal copper etchant which uses metallic aluminum to remove copper without substantially adding undesirable byproducts, by controlling the temperature and mixture rate of the removal process. The very rapid reaction can be controlled by using a diluent of copper-free etchant, heating to process temperature, then adding spent, copper containing etchant at a controlled rate while actively cooling the system to control the temperature. The copper concentration can be monitored by colorimetry while maintaining the pH above pH 8. The separated metallic copper and aluminum hydroxide sludge are easily filtered from the etchant. The purified etchant is now suitable for chemical adjustment and reuse.
    • 用于控制氨铜腐蚀剂的再循环的方法,其通过控制除去过程的温度和混合速率,其使用金属铝去除铜而基本上不加入不需要的副产物。 可以通过使用无铜蚀刻剂的稀释剂,加热至加工温度,然后以有控制的速率加入废铜的蚀刻剂,同时主动冷却系统以控制温度,来控制非常快的反应。 可以通过比色法监测铜浓度,同时保持pH高于pH8。分离的金属铜和氢氧化铝污泥容易从蚀刻剂中过滤。 纯化的蚀刻剂现在适用于化学调整和再利用。
    • 6. 发明授权
    • Solder and tin stripper composition
    • 锡和锡剥离剂组合物
    • US5512201A
    • 1996-04-30
    • US388444
    • 1995-02-13
    • Rajwant SinghNenad MandichGerald A. Krulik
    • Rajwant SinghNenad MandichGerald A. Krulik
    • C23F1/44C23D1/00
    • C23F1/44
    • A metal dissolving liquid and method for stripping tin and solder coatings, including the underlying tin-copper alloy, from the copper substrate of a printed circuit board. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin, a source of ferric ions in an amount sufficient to dissolve tin-copper alloy, a source of halide ions in an amount sufficient to solubilize tin, an effective amount of methylsulfonic acid as promoter for complete stripping, and a source of an organic, water soluble amine. The combination of ingredients will substantially eliminate sludge formation, reduce attack on the copper substrate and provide a bright copper finish after solder removal. A liquid further including organic triazoles including benzotriazole in amounts not more than about 5% by weight and sulfamic ions in amounts not more than about 2.5% by weight.
    • 一种金属溶解液以及从印刷电路板的铜基底上剥离锡和焊料涂层(包括下面的锡 - 铜合金)的方法。 该液体包括硝酸水溶液,其量足以溶解锡和锡,铁离子源的量足以溶解锡 - 铜合金,卤素源的量足以溶解锡,有效 甲基磺酸的量作为完全汽提的促进剂,以及有机水溶性胺的来源。 成分的组合将基本上消除污泥形成,减少对铜基材的侵蚀并且在去除焊料后提供亮的铜表面。 进一步包括含量不超过约5重量%的有机三唑(包括苯并三唑)和不超过约2.5重量%的氨基磺酸根离子的液体。