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    • 1. 发明授权
    • Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
    • 用于监测电化学沉积溶液中有机添加剂的方法和装置
    • US07435320B2
    • 2008-10-14
    • US10836546
    • 2004-04-30
    • Jianwen HanMackenzie E. KingWeihua WangGlenn TomJay Jung
    • Jianwen HanMackenzie E. KingWeihua WangGlenn TomJay Jung
    • G01N27/403
    • C25D5/18C25D1/00C25D3/38C25D21/12C25D21/14G01N27/42H05K3/188H05K2203/163
    • The present invention relates in general to real-time analysis of electrochemical deposition (ECD) metal plating solutions, for the purpose of reducing plating defects and achieving high quality metal deposition. The present invention provides various new electrochemical analytical cell designs for reducing cross-contamination and increasing analytical signal strength. The present invention also provides improved plating protocols for increasing potential signal strength and reducing the time required for each measurement cycle. Further, the present invention provides new methods and algorithms for simultaneously determining concentrations of suppressor, accelerator, and leveler in a sample ECD solution within three experimental runs. A particularly preferred embodiment of the present invention provides a method for simultaneously determining concentrations of all three organic additives within a single experimental run by using a single analytical cell, while interactions between such additives are properly accounted for.
    • 本发明一般涉及电化学沉积(ECD)金属电镀溶液的实时分析,以减少电镀缺陷并实现高质量的金属沉积。 本发明提供用于减少交叉污染和增加分析信号强度的各种新的电化学分析池设计。 本发明还提供改进的电镀方案,用于增加潜在的信号强度并减少每个测量周期所需的时间。 此外,本发明提供了用于在三个实验运行中同时测定样品ECD溶液中的抑制剂,促进剂和矫味剂的浓度的新方法和算法。 本发明的一个特别优选的实施方案提供了一种通过使用单一分析电池同时测定单个实验运行中所有三种有机添加剂的浓度的方法,同时适当地考虑了这些添加剂之间的相互作用。
    • 3. 发明申请
    • Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
    • 用于监测电化学沉积溶液中有机添加剂的方法和装置
    • US20050241948A1
    • 2005-11-03
    • US10836546
    • 2004-04-30
    • Jianwen HanMacKenzie KingWeihua WangGlenn TomJay Jung
    • Jianwen HanMacKenzie KingWeihua WangGlenn TomJay Jung
    • C25D3/38C25D5/18C25D21/12C25D21/14G01N27/26G01N27/42
    • C25D5/18C25D1/00C25D3/38C25D21/12C25D21/14G01N27/42H05K3/188H05K2203/163
    • The present invention relates in general to real-time analysis of electrochemical deposition (ECD) metal plating solutions, for the purpose of reducing plating defects and achieving high quality metal deposition. The present invention provides various new electrochemical analytical cell designs for reducing cross-contamination and increasing analytical signal strength. The present invention also provides improved plating protocols for increasing potential signal strength and reducing the time required for each measurement cycle. Further, the present invention provides new methods and algorithms for simultaneously determining concentrations of suppressor, accelerator, and leveler in a sample ECD solution within three experimental runs. A particularly preferred embodiment of the present invention provides a method for simultaneously determining concentrations of all three organic additives within a single experimental run by using a single analytical cell, while interactions between such additives are properly accounted for.
    • 本发明一般涉及电化学沉积(ECD)金属电镀溶液的实时分析,以减少电镀缺陷并实现高质量的金属沉积。 本发明提供用于减少交叉污染和增加分析信号强度的各种新的电化学分析池设计。 本发明还提供改进的电镀方案,用于增加潜在的信号强度并减少每个测量周期所需的时间。 此外,本发明提供了用于在三个实验运行中同时测定样品ECD溶液中的抑制剂,促进剂和矫味剂的浓度的新方法和算法。 本发明的一个特别优选的实施方案提供了一种通过使用单一分析电池同时测定单个实验运行中所有三种有机添加剂的浓度的方法,同时适当地考虑了这些添加剂之间的相互作用。