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    • 2. 发明授权
    • Methods of forming high density semiconductor devices using recursive spacer technique
    • 使用递归间隔技术形成高密度半导体器件的方法
    • US08143156B2
    • 2012-03-27
    • US11765866
    • 2007-06-20
    • George MatamisJames KaiTakashi OrimotoNima Mokhlesi
    • George MatamisJames KaiTakashi OrimotoNima Mokhlesi
    • H01L21/4763
    • H01L27/115H01L27/11519H01L27/11521
    • High density semiconductor devices and methods of fabricating the same are disclosed. Spacer fabrication techniques are utilized to form circuit elements having reduced feature sizes, which may be smaller than the smallest lithographically resolvable element size of the process being used. A first set of spacers may be processed to provide planar and parallel sidewalls. A second set of spacers may be formed on planar and parallel sidewalls of the first set of spacers. The second set of spacers serve as a mask to form one or more circuit elements in a layer beneath the second set of spacers. The steps according to embodiments of the invention allow a recursive spacer technique to be used which results in robust, evenly spaced, spacers to be formed and used as masks for the circuit elements.
    • 公开了高密度半导体器件及其制造方法。 利用间隔器制造技术来形成具有减小的特征尺寸的电路元件,其可以小于所使用的工艺的最小可光刻解析的元件尺寸。 可以处理第一组间隔件以提供平面和平行的侧壁。 可以在第一组间隔件的平面和平行的侧壁上形成第二组间隔件。 第二组间隔件用作掩模以在第二组间隔物下方的层中形成一个或多个电路元件。 根据本发明的实施例的步骤允许使用递归间隔物技术,其产生要形成的坚固的,均匀间隔的间隔物并用作电路元件的掩模。