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    • 9. 发明申请
    • METHOD FOR SMUT REMOVAL DURING STRIPPING OF COATING
    • 涂层剥离过程中的微量去除方法
    • US20150000696A1
    • 2015-01-01
    • US13932394
    • 2013-07-01
    • GENERAL ELECTRIC COMPANY
    • John David WARD, JR.Liming ZHANG
    • C23G1/02F01D25/00
    • C23G1/02C23F1/20C23F1/28C23F1/44C23G1/20F01D5/005
    • Stripping a metallic bond coat from an article using a wet chemical process. An article removed from service and having a metallic bond coat applied over a surface of its metallic substrate is provided. The metallic bond coat is used to improve the adhesion of a TBC to the article, so grit blasting to first remove any TBC applied over the bond coat and which still remains on the article initially may be required. The bond coated article is then immersed in an acid solution of HCl/H3PO4 at a predetermined temperature for a predetermined amount of time, the HCl/H3PO4 solution reacting with the bond coat applied over the metallic substrate to form a smut on the surface. The article is then removed from the HCl/H3PO4 solution and quickly immersed in a solution of NaOH for a predetermined amount of time to at least partially desmut the surface.
    • 使用湿化学工艺从制品上剥离金属粘结涂层。 提供了从其使用中去除并且在其金属基底的表面上施加金属粘结涂层的物品。 金属粘合涂层用于改善TBC与制品的粘合性,因此可能需要喷砂以首先去除施加在粘结涂层上并且仍然保留在制品上的任何TBC。 然后将粘合涂层制品在预定温度下浸入HCl / H 3 PO 4的酸性溶液中预定的时间,HCl / H 3 PO 4溶液与施加在金属基材上的粘合涂层反应,以在表面上形成黑斑。 然后将物品从HCl / H 3 PO 4溶液中取出并迅速浸入NaOH溶液中预定的时间以至少部分地去除表面。