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    • 1. 发明授权
    • Method and system for measuring deep trenches in silicon
    • 测量硅深沟的方法和系统
    • US07369235B1
    • 2008-05-06
    • US11165711
    • 2005-06-24
    • Gary R. JanikJohn Fielden
    • Gary R. JanikJohn Fielden
    • G01J4/00
    • G01J4/04G01B11/0641G01N21/211
    • A spectroscopic ellipsometry system directs a near infra-red (NIR) probe beam at a test sample to allow metrology to be performed on vertical structures within the test sample. Because silicon is relatively transparent to NIR light, structural information can be determined from the polarization effects produced by the test sample, in a manner similar to that used with IR spectroscopic ellipsometry systems. However, unlike IR light, which requires delicate and costly optical and measurement components (e.g., vibration-sensitive Fourier transform sensors), NIR light can be directed and detected using more robust and inexpensive components (e.g., array-based detectors), thereby making a NIR spectroscopic ellipsometry system much more affordable and usable than conventional IR spectroscopic ellipsometry systems.
    • 光谱椭圆测量系统在测试样品上引导近红外(NIR)探针光束,以便在测试样品内的垂直结构上进行测量。 因为硅对于NIR光是相对透明的,所以结构信息可以由与测试样品产生的极化效应以与用于IR光谱椭偏仪系统的方式类似的方式来确定。 然而,与需要精密和昂贵的光学和测量部件(例如,振动傅里叶变换传感器)的IR光不同,可以使用更稳健和便宜的部件(例如,基于阵列的检测器)来引导和检测NIR光,从而使 近红外光谱椭偏仪系统比常规IR光谱椭偏仪系统更加实惠和可用。
    • 2. 发明授权
    • Dynamic measurement control
    • 动态测量控制
    • US07606677B1
    • 2009-10-20
    • US10986269
    • 2004-11-10
    • Gary R. JanikEric BoucheJohn Fielden
    • Gary R. JanikEric BoucheJohn Fielden
    • G06F3/01
    • H01L22/20H01L22/12
    • A metrology recipe includes dynamic instructions that allow a metrology tool to perform a secondary metrology operation on a test wafer when previous measurement data indicates a process issue with that test wafer. The metrology recipe can instruct the metrology tool to perform an efficient default metrology operation on all test wafers, and perform a more in-depth secondary metrology operation on only those wafers that warrant additional scrutiny. In this manner, critical metrology data can be captured with a minimum of effect on metrology throughput. The metrology data used to determine whether or not the secondary metrology operation is to be performed can be generated from default metrology operations within the same tool, or can be generated by measurements taken by a completely different tool. Such “external” metrology data can be received via a communications network, either directly or from a server on the network for processing the metrology data.
    • 计量配方包括动态指令,允许计量工具在测试晶片上执行次级测量操作,以前的测量数据表明该测试晶片的过程问题。 计量配方可以指示计量工具在所有测试晶圆上执行有效的默认计量操作,并对仅需要额外检查的晶圆进行更深入的次级测量操作。 以这种方式,可以以最小的测量吞吐量影响来捕获关键测量数据。 用于确定是否要执行二次测量操作的计量数据可以由同一工具内的默认计量操作生成,也可以通过完全不同的工具进行测量来生成。 这样的“外部”计量学数据可以经由通信网络直接地或从网络上的服务器接收以处理度量数据。
    • 3. 发明授权
    • Electrical measurements on semiconductors using corona and microwave techniques
    • 使用电晕和微波技术对半导体进行电气测量
    • US07521946B1
    • 2009-04-21
    • US11277934
    • 2006-03-29
    • Gary R. Janik
    • Gary R. Janik
    • G01R31/302
    • G01R31/2621G01R31/311
    • A corona-microwave system can generate accurate capacitance-voltage (C-V) and resistance-voltage (R-V) curves, thereby allowing the accurate determination of gate film capacitance, sheet resistance of implanted regions, and mobility of a substrate under a gate. The corona-microwave system can combine a corona deposition system, a Kelvin probe, and a microwave probe. The corona deposition system can deposit a corona charge on a surface of the semiconductor. The Kelvin and microwave probes can be used to make first and second electrical measurements of a layer/region of the semiconductor. The steps of charge deposition and probe measurements can be repeated to generate a curve plotting the first and second electrical measurements. Because the first and second electrical measurements can be accurately made, the extracted information from the curve is also accurate.
    • 电晕微波系统可以产生精确的电容电压(C-V)和电阻电压(R-V)曲线,从而允许精确确定栅极膜电容,注入区域的薄层电阻和栅极下的衬底的迁移率。 电晕微波系统可以组合电晕沉积系统,开尔文探针和微波探头。 电晕沉积系统可以在半导体的表面上沉积电晕电荷。 开尔文和微波探头可用于对半导体层/区域进行第一次和第二次电气测量。 可以重复电荷沉积和探针测量的步骤以产生绘制第一和第二电测量的曲线。 由于可以准确地进行第一和第二电测量,所以从曲线提取的信息也是准确的。
    • 4. 发明授权
    • Scatterometry metrology using inelastic scattering
    • 散射测量使用非弹性散射
    • US07433056B1
    • 2008-10-07
    • US11182171
    • 2005-07-15
    • Gary R. Janik
    • Gary R. Janik
    • G01B11/24G01B11/30G01B11/14G01J3/44G01J3/42G01J3/427G01J3/28
    • G01B11/0616G01N21/65G01N2021/653
    • A system for characterizing material properties in miniature semiconductor structures performs a scatterometry analysis on inelastically scattered light. The system can include a narrowband probe beam generator and a detector. A single wavelength probe beam from the narrowband probe beam generator produces scattered light from a measurement pattern on a test sample. The scattered light is measured by the detector, and the measurement data (e.g., Raman spectrum) is used in a scatterometry analysis to determine material properties for the measurement pattern. The detector can measure either incoherent inelastically scattered light (e.g., using a spectrometer) or coherent inelastically scattered light (e.g., using an array detector). If the measurement pattern dimensions are substantially similar to actual device dimensions, the material property distributions determined for the measurement pattern can be applied to the actual devices on the test sample.
    • 用于表征微型半导体结构中的材料性质的系统对非弹性散射光进行散射分析。 该系统可以包括窄带探测光束发生器和检测器。 来自窄带探测光束发生器的单个波长探测光束从测试样品上的测量图形产生散射光。 通过检测器测量散射光,并且在散射分析中使用测量数据(例如,拉曼光谱)来确定测量图案的材料特性。 检测器可以测量非相干非弹性散射光(例如,使用光谱仪)或相干非弹性散射光(例如,使用阵列检测器)。 如果测量图形尺寸基本上类似于实际的装置尺寸,则可以将测量图案确定的材料特性分布应用于测试样品上的实际装置。
    • 5. 发明授权
    • X-ray imaging for patterned film measurement
    • 用于图案膜测量的X射线成像
    • US07166838B1
    • 2007-01-23
    • US11135974
    • 2005-05-23
    • Gary R. Janik
    • Gary R. Janik
    • G01N23/201
    • G01N23/04
    • An x-ray metrology system includes an e-beam generator to cause a test sample to emit x-rays, x-ray optics for focusing the x-rays, and an x-ray imager to generate an image of the test sample from the focused x-rays. Because the x-ray imager provides a direct representation of the x-ray emission characteristics of the test sample, the resolution of a measurement taken using such a sensor is limited only by the resolution of the sensor (and any focusing optics), rather than by the amount of e-beam spread in the thin film. The x-ray imaging can be performed for object planes at the test sample that are not parallel to the test sample, thereby allowing vertical dimension data to be accurately generated by the x-ray imaging system.
    • x射线测量系统包括电子束发生器,以使测试样品发射x射线,用于聚焦x射线的x射线光学元件和x射线成像仪,以从 聚焦x射线。 由于x射线成像仪提供了测试样品的x射线发射特性的直接表示,所以使用这种传感器进行测量的分辨率仅受传感器(和任何聚焦光学器件)的分辨率的限制,而不是 通过电子束在薄膜中的传播量。 可以对与测试样品不平行的测试样品的物体平面执行x射线成像,从而允许由x射线成像系统精确地产生垂直尺寸数据。
    • 8. 发明授权
    • Film measurement with interleaved laser cleaning
    • 电影测量与交错激光清洗
    • US07110113B1
    • 2006-09-19
    • US10616064
    • 2003-07-08
    • Gary R. JanikDan G. Georgesco
    • Gary R. JanikDan G. Georgesco
    • G01J4/00B08B7/00
    • G01N21/8422B08B7/0042G01N21/211G01N21/55G01N2021/213G01N2021/8438
    • A system for analyzing a thin film simultaneously applies a pulsed cleaning beam and a measurement beam to an analysis location on a test sample to enhance measurement accuracy. The pulsed cleaning beam prevents contaminant regrowth on the analysis location during the actual measurement. To minimize the effects of thermal transients from the pulsed cleaning beam on measurement data, cleaning pulses can be timed to fall between data samples. Alternatively, data sampling can be blocked during each cleaning operation (i.e., each cleaning pulse and subsequent cooldown period) or data levels can be clamped at measurement levels from just before the start of the cleaning operation for the duration of the cleaning operation. Alternatively, data samples taken during each cleaning operation can be discarded or replaced with data samples from just before the cleaning operation using post-processing techniques.
    • 用于分析薄膜的系统同时将脉冲清洁光束和测量光束施加到测试样品上的分析位置,以提高测量精度。 脉冲清洁光束可防止在实际测量过程中分析位置的污染物再生长。 为了最小化来自脉冲清洁光束的热瞬变对测量数据的影响,清洁脉冲可以定时地落在数据样本之间。 或者,在清洁操作期间,可以在每次清洁操作期间(即,每个清洁脉冲和随后的冷却期间)阻止数据采样,或者可以在清洁操作开始之前的测量水平将数据水平钳位。 或者,可以在使用后处理技术的清洁操作之前的数据样本中丢弃或替换在每个清洁操作期间采集的数据样本。
    • 10. 发明授权
    • X-ray metrology using a transmissive x-ray optical element
    • 使用透射X射线光学元件的X射线测量
    • US07072442B1
    • 2006-07-04
    • US10300107
    • 2002-11-20
    • Gary R. Janik
    • Gary R. Janik
    • G21K1/06
    • G21K1/06
    • An x-ray metrology system includes one or more transmissive x-ray optical elements, such as zone plates or compound refractive x-ray lenses, to shape the x-ray beams used in the measurement operations. Each transmissive x-ray optical element can focus or collimate a source x-ray beam onto a test sample. Another transmissive x-ray optical element can be used to focus reflected or scattered x-rays onto a detector to enhance the resolving capabilities of the system. The compact geometry of transmissive x-ray optical element allows for more flexible placement and positioning than would be feasible with conventional curved crystal reflectors. For example, multiple x-ray beams can be focused onto a test sample using a transmissive x-ray optical element array. Robust zone plates can be efficiently produced using a damascene process.
    • X射线测量系统包括一个或多个透射X射线光学元件,例如区域板或复合折射X射线透镜,以对在测量操作中使用的x射线束进行整形。 每个透射x射线光学元件可以将源X射线束聚焦或准直到测试样本上。 另一个透射型X射线光学元件可用于将反射或散射的X射线聚焦到检测器上,以增强系统的分辨能力。 透射式X射线光学元件的紧凑几何形状允许比常规弯曲晶体反射器可行的更灵活的放置和定位。 例如,可以使用透射x射线光学元件阵列将多个X射线束聚焦到测试样品上。 可以使用镶嵌工艺有效地生产坚固的板材板。