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1. 发明授权

US07378603B2 Enhanced blind-mated input/output card cassette packaging concept 有权
标题翻译：增强盲插输入/输出卡片盒包装概念
公开(公告)号：US07378603B2
公开(公告)日：2008-05-27
申请号：US11262050
申请日：2005-10-28
申请人： Gary F. Goth , John J. Loparco , Andrew Rybak , John G. Torok
发明人： Gary F. Goth , John J. Loparco , Andrew Rybak , John G. Torok
IPC分类号： H05K9/00
CPC分类号： H05K7/1487
摘要： An improved method and a cassette assembly for protecting electronic components, comprising of a housing that encloses the electronic components disposed over an insulator. The housing also encases a scissor jack component that can move from a first to a second position to enable actuation and unmating of the cassette assembly, such as to a next level of packaging. The housing has an overhang design, having complementary upper openings and lower cable shroud areas for supporting cable connections and for providing heat dissipation relief and EMC containment. Alternate designs provide for other components such as a honey comb screen and an EMC gasket to further enable EMC containment. In addition, other components such as an actuation trap door, a retention feature and card support members or support struts can be added to the design to enable better actuation and provide for an improved structural rigidity.
摘要翻译：一种改进的方法和用于保护电子部件的盒组件，包括外壳，其包围设置在绝缘体上的电子部件。壳体还包括可从第一位置移动到第二位置的剪刀千斤顶部件，以使得盒组件的致动和脱离能够进入下一级包装。壳体具有突出设计，具有互补的上部开口和下部电缆护罩区域，用于支撑电缆连接并提供散热释放和EMC防护。替代设计提供了其他组件，如蜂窝梳屏和EMC垫片，以进一步实现EMC容纳。此外，可以向设计中添加诸如致动捕获门，保持特征和卡支撑构件或支撑支柱的其它部件，以实现更好的致动并提供改进的结构刚性。

2. 发明授权

US06485311B2 Compression connector actuation system 失效
标题翻译：压缩连接器驱动系统
公开(公告)号：US06485311B2
公开(公告)日：2002-11-26
申请号：US09812317
申请日：2001-03-20
申请人： John G. Torok , Gary F. Goth , John J. Loparco , Kent D. Waddell
发明人： John G. Torok , Gary F. Goth , John J. Loparco , Kent D. Waddell
IPC分类号： H01R1200
CPC分类号： H01R13/2421 , H01L2224/16 , H01L2224/45144 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/16152 , H05K3/325 , H01L2924/00 , H01L2224/0401
摘要： An exemplary embodiment of the invention is an actuation system including a printed circuit board having a plurality of interconnects and a compression connector positioned adjacent the printed circuit board and having a plurality of contacts for engaging the interconnects. A processing module is positioned adjacent the compression connector. The processing module has a base and a plurality of terminals for engaging contacts on the compression connector. An actuator includes a fastener that engages the base of the processing module and a biasing member for maintaining a force on the compression connector.
摘要翻译：本发明的示例性实施例是一种致动系统，其包括具有多个互连的印刷电路板和邻近印刷电路板定位并具有用于接合互连件的多个触点的压缩连接器。处理模块位于压缩连接器附近。处理模块具有用于接合压缩连接器上的触点的底座和多个端子。致动器包括紧固件，其接合处理模块的基部和用于在压缩连接器上保持力的偏置构件。

3. 发明申请

US20080067696A1 METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION 失效
标题翻译：防止焊锡腐蚀的方法和装置
公开(公告)号：US20080067696A1
公开(公告)日：2008-03-20
申请号：US11532329
申请日：2006-09-15
申请人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
发明人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
IPC分类号： H01L23/52
CPC分类号： H01L23/26 , H01L23/3672 , H01L25/0655 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/1433 , H01L2924/15311 , H01L2224/0401
摘要： Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.
摘要翻译：公开了一种具有焊料防腐蚀性的多芯片模块，包括通过焊接连接到衬底的一个或多个芯片，该衬底设置在印刷电路板上。多芯片模块还包括一定数量的分子筛干燥剂，以及包含一个或多个芯片，基底和分子筛干燥剂的第一盖，第一盖具有与印刷电路板的密封。

4. 发明申请

US20080067651A1 METHOD AND APPARATUS FOR PREVENTION OF SOLDER CORROSION UTILIZING FORCED AIR 审中-公开
标题翻译：防止使用强制空气的焊接腐蚀的方法和装置
公开(公告)号：US20080067651A1
公开(公告)日：2008-03-20
申请号：US11532396
申请日：2006-09-15
申请人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
发明人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
IPC分类号： H01L21/00
CPC分类号： H01L23/562 , H01L23/041 , H01L23/053 , H01L24/16 , H01L24/32 , H01L25/0655 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16152 , H01L2224/0401
摘要： Disclosed is a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate situated on a printed circuit board. The multi-chip module also includes a molecular sieve desiccant chamber containing a quantity of molecular sieve desiccant and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board. The molecular sieve desiccant chamber is connected to the first cover via a first fluid pathway and a second fluid pathway.
摘要翻译：公开了一种具有焊料防腐蚀的多芯片模块，包括通过焊接连接到基板的一个或多个芯片，位于印刷电路板上的基板。多芯片模块还包括含有一定数量的分子筛干燥剂的分子筛干燥剂室和含有一个或多个碎片的第一盖子，基底和分子筛干燥剂，第一盖子具有印刷电路的密封板。分子筛干燥剂室经由第一流体路径和第二流体路径连接到第一盖。

5. 发明授权

US07651890B2 Method and apparatus for prevention of solder corrosion 失效
标题翻译：防止焊料腐蚀的方法和装置
公开(公告)号：US07651890B2
公开(公告)日：2010-01-26
申请号：US11532329
申请日：2006-09-15
申请人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
发明人： Gary F. Goth , William P. Kostenko , John J. Loparco , Prabjit Singh , John G. Torok
IPC分类号： H01L23/26
CPC分类号： H01L23/26 , H01L23/3672 , H01L25/0655 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/1433 , H01L2924/15311 , H01L2224/0401
摘要： Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.
摘要翻译：公开了一种具有焊料防腐蚀性的多芯片模块，包括通过焊接连接到衬底的一个或多个芯片，该衬底设置在印刷电路板上。多芯片模块还包括一定数量的分子筛干燥剂，以及包含一个或多个芯片，基底和分子筛干燥剂的第一盖，第一盖具有与印刷电路板的密封。

6. 发明授权

US07119433B2 Packaging for enhanced thermal and structural performance of electronic chip modules 有权
标题翻译：用于增强电子芯片模块的热和结构性能的封装
公开(公告)号：US07119433B2
公开(公告)日：2006-10-10
申请号：US10869524
申请日：2004-06-16
申请人： John S. Corbin, Jr. , Gary F. Goth , Dales M. Kent , William P. Kostenko , Roger R. Schmidt , John G. Torok
发明人： John S. Corbin, Jr. , Gary F. Goth , Dales M. Kent , William P. Kostenko , Roger R. Schmidt , John G. Torok
IPC分类号： H01L23/34 , H01L23/12
CPC分类号： H01L23/367 , H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： In an integrated circuit packaging structure, such as in a SCM, DCM, or MCM, a method and apparatus for increasing heat spreader size and thus thermal performance is disclosed. The packaging structure includes a first substrate; an electronic device operably coupled to a top surface defining the first substrate; a heat spreader having a first surface operably coupled to a top surface defining the electronic device and an opposite second surface in thermal communication with a second substrate; and a frame defining an opening therethrough. The frame is further defined by an inwardly extending ledge configured to allow the heat spreader to extend at least to a peripheral edge defining a perimeter of the first substrate. In an exemplary embodiment, the second substrate includes one of a heat sink, cooling plate, thermal spreader, heat pipe, thermal hat, package lid, or other cooling member.
摘要翻译：在诸如在SCM，DCM或MCM中的集成电路封装结构中，公开了一种用于增加散热器尺寸并因此提高散热性能的方法和装置。包装结构包括第一基板; 电子设备，其可操作地耦合到限定所述第一基板的顶表面; 散热器具有可操作地耦合到限定电子设备的顶表面的第一表面和与第二基板热连通的相对的第二表面; 以及限定穿过其中的开口的框架。框架进一步由向内延伸的凸缘限定，该凸缘构造成允许散热器至少延伸至限定第一基板的周边的周边边缘。在示例性实施例中，第二基板包括散热器，冷却板，散热器，热管，散热帽，封装盖或其它冷却构件中的一个。

7. 发明授权

US07874862B2 Connector actuation mechanism 失效
标题翻译：连接器致动机构
公开(公告)号：US07874862B2
公开(公告)日：2011-01-25
申请号：US12781033
申请日：2010-05-17
申请人： Dennis R. Barringer , William L. Brodsky , Francesco Chiarella , John J. Loparco , Michael F. Scanlon , John G. Torok
发明人： Dennis R. Barringer , William L. Brodsky , Francesco Chiarella , John J. Loparco , Michael F. Scanlon , John G. Torok
IPC分类号： H01R13/62
CPC分类号： H05K7/1407
摘要： A mechanism for electrically connecting a first electronic component to a second electronic component includes an actuating member disposed in the first electronic component including a first connector half and an actuation screw having a head and a threaded end. The actuation screw is located in the first electronic component wherein rotation of the actuation screw urges the actuating member in a direction substantially perpendicular to an axis of the actuation screw thereby engaging the first connector half to a second connector half disposed in the second electronic component.
摘要翻译：用于将第一电子部件电连接到第二电子部件的机构包括设置在第一电子部件中的致动部件，其包括第一连接器半部和具有头部和螺纹端部的致动螺钉。致动螺钉位于第一电子部件中，其中致动螺杆的旋转沿着基本上垂直于致动螺钉的轴线的方向推动致动构件，从而将第一连接器半部接合到设置在第二电子部件中的第二连接器半体。

8. 发明申请

US20090215303A1 CONNECTOR ACTUATION MECHANISM 失效
标题翻译：连接器启动机构
公开(公告)号：US20090215303A1
公开(公告)日：2009-08-27
申请号：US12035595
申请日：2008-02-22
申请人： Dennis R. Barringer , William L. Brodsky , Francesco Chiarella , John J. Loparco , Michael F. Scanlon , John G. Torok
发明人： Dennis R. Barringer , William L. Brodsky , Francesco Chiarella , John J. Loparco , Michael F. Scanlon , John G. Torok
IPC分类号： H01R13/621 , H01R12/00
CPC分类号： H05K7/1407
摘要： A mechanism for electrically connecting a first electronic component to a second electronic component. The mechanism includes an actuating member disposed in the first electronic component including a first connector half and an actuation screw having a head and a threaded end. The actuation screw is located in the first electronic component wherein rotation of the actuation screw urges the actuating member in a direction substantially perpendicular to an axis of the actuation screw thereby engaging the first connector half to a second connector half disposed in the second electronic component. A method for electrically connecting a first electronic component to a second electronic component includes rotating an actuation screw disposed in the first electronic component and in operable communication with an actuating member disposed in the first electronic component, the actuating member including a first connector half. The actuating member is urged in a direction substantially perpendicular to an axis of the actuation screw by the rotation of the actuation screw and the first connector half is engaged to a second connector half disposed in the second electronic component.
摘要翻译：一种用于将第一电子部件电连接到第二电子部件的机构。该机构包括设置在第一电子部件中的致动部件，其包括第一连接器半部和具有头部和螺纹端部的致动螺钉。致动螺钉位于第一电子部件中，其中致动螺杆的旋转沿着基本上垂直于致动螺钉的轴线的方向推动致动构件，从而将第一连接器半部接合到设置在第二电子部件中的第二连接器半体。用于将第一电子部件电连接到第二电子部件的方法包括旋转设置在第一电子部件中的致动螺钉，并且与设置在第一电子部件中的致动部件可操作地连通，致动部件包括第一连接器半部。致动构件通过致动螺钉的旋转而沿着基本上垂直于致动螺钉的轴线的方向被推动，并且第一连接器半部被接合到设置在第二电子部件中的第二连接器半体上。

9. 发明授权

US07505251B2 Actuation mechanism for mating electronic card interconnect systems 有权
标题翻译：配电电子卡互连系统的启动机制
公开(公告)号：US07505251B2
公开(公告)日：2009-03-17
申请号：US11262047
申请日：2005-10-28
申请人： Shawn M. Canfield , John J. Loparco , Emanuele F. Lopergolo , Budy D. Notohardjono , Michael T. Peets , John G. Torok
发明人： Shawn M. Canfield , John J. Loparco , Emanuele F. Lopergolo , Budy D. Notohardjono , Michael T. Peets , John G. Torok
IPC分类号： G06F1/16
CPC分类号： H05K5/0217
摘要： An actuation assembly and method is provided for mating electronic unto a computer rack comprising a main housing engageably securable to a slide assembly. The slide assembly is capable of being secured to a side of the computer rack and having sliding features such that the slide assembly and the main housing when engaged can be telescoped out or returned to a closed position. The main housing having a vertical wedge for securing said assembly to said rack more securely and a drive wedge for moving the vertical wedge such that it can telescope into and out of said rack with said slide mechanism via a lead screw.
摘要翻译：提供了一种用于将电子装配到计算机机架的致动组件和方法，所述计算机机架包括可接合地固定到滑动组件的主壳体。滑动组件能够被固定到计算机机架的一侧并且具有滑动特征，使得当接合时滑动组件和主壳体可以伸缩或返回到关闭位置。主壳体具有用于将所述组件更牢固地固定到所述机架上的垂直楔块，以及用于移动垂直楔块的驱动楔块，使得其可以通过导螺杆用所述滑动机构望远镜进入和离开所述齿条。

10. 发明申请

US20090211083A1 Method and Assembly For Extracting And Installing Dual In-Line Memory Module Cardlets 有权
标题翻译：用于提取和安装双列直插式内存模块卡夹的方法和装配
公开(公告)号：US20090211083A1
公开(公告)日：2009-08-27
申请号：US12036664
申请日：2008-02-25
申请人： Paul F. Bodenweber , John J. Loparco , Thong N. Nguyen , Thomas Ramundo , John G. Torok
发明人： Paul F. Bodenweber , John J. Loparco , Thong N. Nguyen , Thomas Ramundo , John G. Torok
IPC分类号： B23P19/00
CPC分类号： H05K13/0447 , G06F1/185 , Y10T29/53165 , Y10T29/53174 , Y10T29/53257 , Y10T29/53261 , Y10T29/53283
摘要： A method and a tool assembly for engaging and disengaging a cardlet housing electronic components from a computer environment. The cardlet, in a preferred embodiment is a dual in-line memory module (DIMM) cardlet. The tool comprises a carrier having a handle on one end and a plurality of retention features and engaging members on an opposing side. The carrier release mechanism is secured to the carrier and the engaging members such that activating the carrier release mechanism moves the engaging members from a first to a second position such that engagement and disengagement of the carrier and said cardlet housing electronic components can be achieved. In addition, a removable latch release member is also secured to the carrier, the release member having a durable tip for engaging and disengaging latches on the computer cardlet without damaging the cardlet or its surrounding sensitive components.
摘要翻译：一种用于接合和分离将电子部件与计算机环境容纳在一起的卡具的方法和工具组件。在优选实施例中，小卡是双列直插存储器模块（DIMM）卡。该工具包括在一端具有把手的托架和在相对侧上的多个保持特征和接合构件。承载件释放机构被固定到托架和接合构件，使得致动托架释放机构将接合构件从第一位置移动到第二位置，使得可以实现承载件和所述卡包壳体电子部件的接合和分离。此外，可拆卸的闩锁释放构件也固定到托架上，释放构件具有耐用的尖端，用于接合和分离计算机卡片上的闩锁，而不会损坏卡扣或其周围的敏感部件。

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