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1. 发明授权

US06623842B2 Surface electrode structure on ceramic multi-layer substrate and process for producing the same 有权
标题翻译：陶瓷多层基板上的表面电极结构及其制造方法
公开(公告)号：US06623842B2
公开(公告)日：2003-09-23
申请号：US09956011
申请日：2001-09-20
申请人： Fumio Uchikoba , Tomoyuki Goi
发明人： Fumio Uchikoba , Tomoyuki Goi
IPC分类号： B32B700
CPC分类号： H05K3/246 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/19105 , H03H3/08 , H05K1/092 , H05K3/4629 , Y10T428/12535 , Y10T428/12889 , Y10T428/12896 , Y10T428/12944 , Y10T428/24917 , H01L2224/05599
摘要： In a surface electrode structure on a ceramic multi-layer substrate having on the surface SAW device mounting surface electrodes for mounting flip chips as surface-acoustic-wave devices by gold-gold bonding and soldered parts mounting surface electrodes. Further, at least the lowermost layer is made of a sintered silver conductor which is partly buried in the ceramic multi-layer substrate, a nickel or a nickel alloy layer being contained as an intermediate layer, and the topmost layer being a gold layer. Thus, a surface electrode structure on a ceramic multi-layer substrate is suitable for both mounting of SAW devices by gold-gold bonding and mounting of other parts by soldering and which enable consistent mounting of individual parts using a ceramic multi-layer substrate to provide higher reliability.
摘要翻译：在陶瓷多层基板上的表面电极结构中，具有表面SAW器件安装面电极，用于通过金 - 金接合安装倒装芯片作为表面声波器件和焊接部件安装表面电极。此外，至少最下层由部分埋置在陶瓷多层基板中的烧结银导体，作为中间层包含镍或镍合金层，最顶层是金层构成。因此，陶瓷多层基板上的表面电极结构适用于通过金 - 金键合安装SAW器件和通过焊接安装其它部件，并且能够使用陶瓷多层基板一致地安装各个部件以提供更高的可靠性。

2. 发明授权

US5594397A Electronic filtering part using a material with microwave absorbing properties 失效
标题翻译：使用具有微波吸收特性的材料的电子滤波部件
公开(公告)号：US5594397A
公开(公告)日：1997-01-14
申请号：US409682
申请日：1995-03-23
申请人： Fumio Uchikoba , Shigeyuki Nakajima , Takashi Ito , Taro Miura , Makoto Kobayashi , Takahide Kurahashi , Yasushi Iijima
发明人： Fumio Uchikoba , Shigeyuki Nakajima , Takashi Ito , Taro Miura , Makoto Kobayashi , Takahide Kurahashi , Yasushi Iijima
IPC分类号： H01P1/20 , H01P1/215 , H01P3/00 , H01P3/08 , H05K1/02 , H05K1/03
CPC分类号： H01P3/006 , H01P1/20 , H01P1/215 , H01P3/081 , H01P3/085 , H05K1/0373 , H05K1/0216 , H05K1/024 , H05K2201/086
摘要： A ground conductor and a signal conductor are provided in an insulating magnetic body respectively. The insulating magnetic body is a compound member that combines ferromagnetic metal particles and an insulating resin. A signal transmission element, a connector or a circuit board with high frequency stopping and low pass characteristics which will ensure reliable absorption of high frequency components in the high frequency range, can be provided.
摘要翻译：接地导体和信号导体分别设置在绝缘磁体中。绝缘磁体是结合强磁性金属粒子和绝缘树脂的复合部件。可以提供具有高频停止和低通特性的信号传输元件，连接器或电路板，其将确保在高频范围内高频部件的可靠吸收。

3. 发明申请

US20070245555A1 Method for Manufacturing a Ceramic Electronic Component 失效
标题翻译：陶瓷电子元件制造方法
公开(公告)号：US20070245555A1
公开(公告)日：2007-10-25
申请号：US11573691
申请日：2005-09-22
申请人： Fumio Uchikoba
发明人： Fumio Uchikoba
IPC分类号： H01K3/22 , H01G7/00
CPC分类号： H05K3/1258 , H01C7/003 , H01C17/065 , H01F41/041 , H01F41/042 , H01F41/046 , H01G4/005 , H01G4/33 , H05K1/092 , H05K3/207 , H05K2203/0264 , H05K2203/0568 , Y10T29/435 , Y10T29/4902 , Y10T29/49128 , Y10T29/49155
摘要： A photo-resist 11 of a dry film 10 is patterned to form opening portions 111 and non-opening portions 112 (see FIG. 1(a)). An electrically conductive paste 21 is applied by a doctor blade 31 (see FIG. 1(b)) and thereafter is dried (see FIG. 1(c)). Then, a release film 12 of the dry film 10 is removed (see FIG. 1(d)) and thereafter the dry film 10 is adhered to a ceramic green sheet 41 (see FIG. 1(e)). The photo-resist 11 is removed from the ceramic green sheet 41 to form an electrically conductive film 42 on the ceramic green sheet 41 (see FIG. 1(e)). The ceramic electronic component is manufactured by sintering the ceramic green sheet 41 having the electrically conductive film 41 formed.
摘要翻译：对干膜10的光致抗蚀剂11进行图案化，形成开口部111和非开口部112（参照图1（a））。通过刮刀31（参照图1（b））涂敷导电膏21，然后干燥（参照图1（c））。然后，除去干膜10的剥离膜12（参照图1（d）），然后将干膜10粘贴在陶瓷生片41上（参照图1（e））。从陶瓷生片41除去光致抗蚀剂11，在陶瓷生片41上形成导电膜42（参照图1（e））。通过烧结形成有导电膜41的陶瓷生片41来制造陶瓷电子部件。

4. 发明授权

US06698084B2 Method for manufacturing radio frequency module components with surface acoustic wave element 失效
标题翻译：用声表面波元件制造射频模块组件的方法
公开(公告)号：US06698084B2
公开(公告)日：2004-03-02
申请号：US09947358
申请日：2001-09-07
申请人： Fumio Uchikoba
发明人： Fumio Uchikoba
IPC分类号： H01Q1700
CPC分类号： H03H3/08 , H01L2224/16 , H01L2224/16225 , H01L2224/45144 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/16195 , H01L2924/19105 , H01L2924/3025 , H03H7/465 , H03H9/0576 , H03H9/725 , H05K1/0306 , H05K3/244 , H05K3/328 , H05K3/341 , Y10T29/49016 , Y10T29/49018 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2924/00 , H01L2224/0401
摘要： A method for manufacturing radio frequency module components with a surface acoustic wave element includes a gold plating step of plating gold at a component bonded portion on a conductive surface of a ceramic multi-layer substrate 40 to have a mounted electrode 43, a surface acoustic wave element mounting step of face down bonding a flip chip 30 as the surface acoustic wave element on the ceramic multi-layer substrate 40 by the gold—gold connection, a side wall formation step of bonding a side wall member 60 surrounding the flip chip 30 onto the ceramic multi-layer substrate 40 by adhesives, a lid formation step of bonding a lid member 61 enclosing an opening of the side wall onto the side wall member by adhesives, after mounting the flip chip 30, and a soldered component mounting step of mounting a soldered component 50 by the use of solder, after the lid formation step.
摘要翻译：一种用于制造具有声表面波元件的射频模块部件的方法包括在陶瓷多层基板40的导电表面上的部件接合部分处镀金的镀金步骤，以具有安装电极43，表面声波元件安装步骤，通过金 - 金连接将作为表面声波元件的倒装芯片30面对下接合在陶瓷多层基板40上;侧壁形成步骤，将包围倒装芯片30的侧壁构件60接合到通过粘合剂的陶瓷多层基板40，在安装倒装芯片30之后，通过粘合剂将封闭侧壁开口的盖构件61接合在侧壁构件上的盖形成步骤，以及安装部件安装步骤在盖形成步骤之后通过使用焊料的焊接部件50。

5. 发明授权

US06628178B2 Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof 有权
标题翻译：射频模块部件，包括声表面波元件及其制造方法
公开(公告)号：US06628178B2
公开(公告)日：2003-09-30
申请号：US09940440
申请日：2001-08-29
申请人： Fumio Uchikoba
发明人： Fumio Uchikoba
IPC分类号： H03H910
CPC分类号： H03H7/465 , H01L24/97 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H03H9/0542 , H05K1/0306 , H05K3/244 , H05K3/328 , H05K3/341 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： The surface acoustic wave elements and the other surface mounting elements are mounted on a ceramic multi-layer substrate. The surface acoustic wave elements may be flip chips face-down-bonded to the gold coated mounting electrodes of the multi-layer ceramic substrate by gold-to-gold bonding. At least the surface acoustic wave elements are covered as sealed airtight with the side walls fixed to the multi-layer ceramic substrate and a cover closing the opening of the side walls.
摘要翻译：表面声波元件和其它表面安装元件安装在陶瓷多层基板上。表面声波元件可以是通过金 - 金键合将倒装芯片面向下键合到多层陶瓷衬底的镀金安装电极。至少表面声波元件被密封地密封，侧壁固定到多层陶瓷基底和盖子封闭侧壁的开口。

6. 发明授权

US07173508B2 Inductor device 有权
标题翻译：电感器件
公开(公告)号：US07173508B2
公开(公告)日：2007-02-06
申请号：US10862402
申请日：2004-06-08
申请人： Toshiyuki Anbo , Fumio Uchikoba
发明人： Toshiyuki Anbo , Fumio Uchikoba
IPC分类号： H01F7/06
CPC分类号： H01F41/043 , H01F17/0013 , Y10T29/4902 , Y10T29/49069 , Y10T29/49073 , Y10T29/49078
摘要： An inductor device including a device body having a plurality of insulating layers; a plurality of conductive coil pattern units formed inside the device body between insulating layers along a single planar direction, coil pattern units adjoining each other in the single plane being centro-symmetric patterns with respect to a center point of a boundary line between unit sections containing coil pattern units; and connection portions connecting upper and lower coil pattern units separated by the insulating layers to form a coil. It is possible to obtain an inductor device able to suppress the stack deviation without complicating the production process even if the device is made small in size.
摘要翻译：一种电感器件，包括具有多个绝缘层的器件主体; 沿着单个平面方向在绝缘层之间在器件本体内部形成的多个导电线圈图案单元，在单个平面中彼此相邻的线圈图案单元相对于包含以下的单元部分之间的边界线的中心点的中心对称图案线圈图案单位; 以及连接部，其连接由绝缘层分隔开的上下线圈图案单元，以形成线圈。即使设备尺寸小，也可以获得能够抑制堆叠偏移而不会使生产过程复杂化的电感器件。

7. 发明授权

US06489875B1 Multi-layer ferrite chip inductor array and manufacturing method thereof 有权
标题翻译：多层铁氧体芯片电感阵列及其制造方法
公开(公告)号：US06489875B1
公开(公告)日：2002-12-03
申请号：US09611212
申请日：2000-07-06
申请人： Fumio Uchikoba , Tomoyuki Tatemori
发明人： Fumio Uchikoba , Tomoyuki Tatemori
IPC分类号： H01F500
CPC分类号： H01F41/041 , H01F17/0013 , Y10T29/4902 , Y10T29/49069 , Y10T29/49128 , Y10T29/49155
摘要： A multi-layer ferrite chip inductor array, wherein an element main body 11 is composed by laminating a ferrite layer and a conductor layer in such a manner that the laminated face thereof is vertical with an element mounting surface 15, a plurality of coil shaped internal conductors are furnished within the element main body 11, the coiling direction of said coil shaped internal conductor being parallel with the element mounting surface, and the ferrite sheets formed with through-holes are printed with a plurality of coil shaped internal conductors and conductor patterns with the electrically conductive material, and the ferrite sheets are laminated such that the laminated face thereof is vertical with the element mounting surface. This realization of the invention depends on the production method having the process enabling to obtain the laminated body where the plurality of coil shaped internal conductors are formed, the coiling direction of said conductors being parallel with said element mounting surface.
摘要翻译：一种多层铁氧体芯片电感器阵列，其中元件主体11通过层叠铁氧体层和导体层而构成，使得其层叠面与元件安装表面15垂直，多个线圈形内部导体配置在元件主体11内，所述线圈状内部导体的卷绕方向与元件安装面平行，并且形成有通孔的铁氧体片被印刷有多个线圈形内部导体和导体图案，导电材料和铁氧体片层叠，使得其层叠面与元件安装面垂直。本发明的这种实现取决于具有能够获得形成有多个线圈状内部导体的层叠体的处理的制造方法，所述导体的卷绕方向与所述元件安装面平行。

8. 发明授权

US06404318B1 Multilayer inductor and production method thereof 失效
标题翻译：多层电感及其制作方法
公开(公告)号：US06404318B1
公开(公告)日：2002-06-11
申请号：US09632213
申请日：2000-08-03
申请人： Fumio Uchikoba , Noriyuki Kojima
发明人： Fumio Uchikoba , Noriyuki Kojima
IPC分类号： H01F500
CPC分类号： H01F27/027 , Y10T29/49002 , Y10T29/4902 , Y10T29/49146 , Y10T29/49163
摘要： In the multilayer inductor, the substrate thereof is composed of a constituent belonging to spinel ferrite, and is furnished with internal conductors of a main constituent being silver at the interior of the substrate. The internal conductors are drawn outside of the substrate, and the drawn portions are provided with external electrodes. The internal conductors contain manganese and bismuth, and the manganese and bismuth contents at an interface between the internal conductors and the substrate are more than those of other ranges. MnO2 of 0.02 to 0.1 wt % and Bi2O3 of 0.5 to 1.2 wt % are added to a paste of the main constituent being silver to be used to the internal conductors, and the paste is baked together with spinel ferrite material.
摘要翻译：在多层电感器中，其基板由属于尖晶石型铁氧体的构成构成，并且在基板的内部配备有主要成分为银的内部导体。内部导体被拉出到基板的外部，并且拉出部分设置有外部电极。内部导体含有锰和铋，内部导体和基板之间的界面处的锰和铋含量大于其他范围。将0.02〜0.1重量％的MnO 2和0.5〜1.2重量％的Bi 2 O 3添加到用于内部导体的主要成分为银的糊料中，并将该糊料与尖晶石铁氧体材料一起烘烤。

9. 发明授权

US06345434B1 Process of manufacturing an inductor device with stacked coil pattern units 失效
标题翻译：制造具有堆叠线圈图案单元的电感器件的工艺
公开(公告)号：US06345434B1
公开(公告)日：2002-02-12
申请号：US09346697
申请日：1999-07-02
申请人： Toshiyuki Anbo , Fumio Uchikoba
发明人： Toshiyuki Anbo , Fumio Uchikoba
IPC分类号： H01F706
CPC分类号： H01F41/043 , H01F17/0013 , Y10T29/4902 , Y10T29/49069 , Y10T29/49073 , Y10T29/49078
摘要： A process for the production of an inductor device comprising the steps of forming a green sheet to form an insulating layer; forming a plurality of conductive coil pattern units on the surface of the green sheet in order that a plurality of unit sections each including a single coil pattern unit are arranged on the surface of the green sheet and each two coil pattern units adjoining in the substantially perpendicular direction to the longitudinal direction of the unit sections are arranged centro-symmetrically with respect to a center point of a boundary line of adjoining unit sections; stacking a plurality of green sheets formed with the plurality of coil pattern units arranged in centro-symmetry and connecting the upper and lower coil pattern units separated by the green sheets to form a coil shape; and sintering the stacked green sheets. It is possible to obtain an inductor device able to suppress the stack deviation without complicating the production process even if the device is made small in size.
摘要翻译：一种用于生产电感器件的方法，包括以下步骤：形成生片以形成绝缘层; 在生片的表面上形成多个导电线圈图案单元，以便在生片的表面上布置包括单个线圈图案单元的多个单位部分，并且每个两个线圈图案单元基本垂直地邻接单元部分的纵向方向相对于相邻单元部分的边界线的中心点中心对称布置; 堆叠形成有多个以中心对称布置的线圈图案单元的多个生片，并连接由生片隔开的上下线圈图案单元以形成线圈形状; 并烧结堆叠的生片。即使设备尺寸小，也可以获得能够抑制堆叠偏移而不会使生产过程复杂化的电感器件。

10. 发明授权

US06249206B1 Laminated ferrite chip inductor array 有权
公开(公告)号：US06249206B1
公开(公告)日：2001-06-19
申请号：US09460420
申请日：1999-12-14
申请人： Fumio Uchikoba , Toshiyuki Anbo
发明人： Fumio Uchikoba , Toshiyuki Anbo
IPC分类号： H01F500
CPC分类号： H01F17/0013 , Y10T29/4902 , Y10T29/49069 , Y10T29/49078 , Y10T29/49155
摘要： A laminated ferrite chip inductor array wherein the array is composed in that multiple layers of ferrite sheets printed with U-shaped patterns of internal conductors are piled in such a manner that the U-shaped patterns of the internal conductors on adjacent sheets are opposed one another, and a plurality of channels composed by sintering the piled layers of coil-shaped structure of the internal conductive printed patterns made electrically communicating via through holes pierced in the ferrite sheets are held in ferrite porcelains, characterized in that the internal conductive pattern shapes of the adjacent chip inductors are turned 180 degree one another.

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