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1. 发明授权

US5766065A Apparatus for polishing peripheral portion of wafer 失效
公开(公告)号：US5766065A
公开(公告)日：1998-06-16
申请号：US567162
申请日：1995-12-05
申请人： Fumihiko Hasegawa , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
发明人： Fumihiko Hasegawa , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
IPC分类号： B24B9/00 , B24B9/06 , H01L21/304 , B24B5/00
CPC分类号： B24B9/065
摘要： A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.

2. 发明授权

US5928066A Apparatus for polishing peripheral portion of wafer 失效
标题翻译：用于抛光晶片周边部分的装置
公开(公告)号：US5928066A
公开(公告)日：1999-07-27
申请号：US993989
申请日：1997-12-18
申请人： Fumihiko Hasegawa , Yasuyoshi Kuroda , Toshihiro Tsuchiya , Koichiro Ichikawa , Yasuo Inada
发明人： Fumihiko Hasegawa , Yasuyoshi Kuroda , Toshihiro Tsuchiya , Koichiro Ichikawa , Yasuo Inada
IPC分类号： B24B9/06 , B24D9/06 , B24B5/00
CPC分类号： B24D9/06 , B24B9/065
摘要： A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.
摘要翻译：公开了半导体晶片的外围倒角部分的抛光装置。抛光装置包括：围绕其周边的旋转鼓，其上缠绕有其上的研磨层的带; 用于旋转所述旋转滚筒的第一马达; 晶片保持机构，其包括用于保持晶片的晶片保持部件，用于旋转晶片保持部件的第二电动机，用于支撑晶片保持部件和第二电动机的支撑部件，以及用于改变晶片保持部件的倾斜角度的晶片倾斜部件所述晶片相对于所述旋转鼓通过使所述支撑构件在基本上平行于所述晶片的主表面的第一轴线上往复旋转; 以及移动构件，用于使保持在支撑构件上的晶片与缠绕在旋转鼓上的带接触或分离。

3. 发明授权

US5733181A Apparatus for polishing the notch of a wafer 失效
标题翻译：用于抛光晶片凹口的装置
公开(公告)号：US5733181A
公开(公告)日：1998-03-31
申请号：US329952
申请日：1994-10-27
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
IPC分类号： B24B1/04 , B24B9/00 , B24B9/06 , B24B21/00 , B24B21/22 , H01L21/304 , B24B7/00
CPC分类号： B24B21/002 , B24B9/065
摘要： An apparatus for polishing the notch of a wafer in an effective and efficient way, which comprises: a flexible tape carrying abrasive grains in the working face thereof; an infeed reel for feeding the tape stored thereon: a take-up reel for taking up the tape fed from the infeed reel; a motor for driving to rotate the take-up reel; a means for blowing a fluid to the backside surface to the edge portion of the notch to be in direct contact along the full periphery of the notch; and a means for oscillating the tape sideways.
摘要翻译：一种用于以有效和有效的方式抛光晶片的凹口的装置，其包括：在其工作面中承载磨料颗粒的柔性带; 用于馈送存储在其上的带的进给卷轴;卷取卷轴，用于卷取从进料卷轴进给的带; 用于驱动旋转卷取卷轴的马达; 用于将流体吹送到所述凹口的所述边缘部分的所述后侧表面沿着所述凹口的整个周边直接接触的装置; 以及用于横向摆动带的装置。

4. 发明授权

US5476413A Apparatus for polishing the periphery portion of a wafer 失效
标题翻译：用于抛光晶圆周边部分的装置
公开(公告)号：US5476413A
公开(公告)日：1995-12-19
申请号：US306439
申请日：1994-09-19
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
IPC分类号： B24B9/00 , B24B9/06 , B24B21/00 , B24D9/06 , H01L21/304
CPC分类号： B24B9/065 , B24B21/002 , B24B21/004 , B24D9/06
摘要： An apparatus for polishing the periphery portion of a wafer, by which improvement on the polishing velocity may be effected and besides a more efficient spatial usage of the working layer of an abrasive tape is capable, comprising a tape holding fixed abrasive grains thereon; a feed reel for feeding the tape stored by winding itself; a take-up reel for taking up the tape by winding itself; a rotary drum inside of which both of the reels are equipped in such a manner that they are mountable or demountable, where a portion of the tape in the way from the feed reel to the take-up reel is adaptive to wind the rotary drum around the outer cylindrical surface thereof in close contact in the shape of a helicoid and one of the main faces of the wafer is positioned to be in a plane intersecting the central axis of the rotary drum at an angle.
摘要翻译：抛光晶片周边部分的装置可以进行研磨速度的改善，并且除了可以更有效地利用砂带工作层的空间使用之外，还包括在其上保持固定磨粒的带; 用于馈送通过缠绕自身而存储的带的馈送卷轴; 用于卷绕磁带的卷取卷轴; 其中两个卷盘的两个卷轴被安装成可安装或拆卸的旋转滚筒，其中从进给卷轴到卷取卷轴的带的一部分适于卷绕旋转滚筒其圆柱形表面紧密接触螺旋形状并且晶片的主面之一被定位成与旋转鼓的中心轴线成一定角度的平面。

5. 发明授权

US5727990A Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus 失效
标题翻译：用于镜面抛光的晶片倒角部分和镜面抛光装置的方法
公开(公告)号：US5727990A
公开(公告)日：1998-03-17
申请号：US779040
申请日：1997-01-06
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
IPC分类号： H01L21/304 , B24B9/00 , B24B9/06 , B24B1/00 , B24B7/24 , B24B9/14
CPC分类号： B24B9/065
摘要： A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.
摘要翻译：公开了一种有效地对半导体晶片的外围倒角部进行镜面研磨的方法和装置。对晶片的倒角部分的周边侧表面进行镜面抛光，其边缘表面和形成在周边侧表面和每个倾斜表面之间的圆形边缘分别进行。

6. 发明授权

US06332828B1 Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat 失效
标题翻译：具有取向平面的镜面抛光晶圆倒角的方法和装置
公开(公告)号：US06332828B1
公开(公告)日：2001-12-25
申请号：US09613870
申请日：2000-07-11
申请人： Fumihiko Hasegawa , Yasuyoshi Kuroka , Toshihiro Tsuchiya , Koichiro Ichikawa , Yasuo Inada
发明人： Fumihiko Hasegawa , Yasuyoshi Kuroka , Toshihiro Tsuchiya , Koichiro Ichikawa , Yasuo Inada
IPC分类号： B24B906
CPC分类号： B24B49/12 , B24B9/065 , B24B49/02
摘要： A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed Ns has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed Ns according to the detected wafer mirror-like polishing position.
摘要翻译：公开了一种通过在被预定压力的旋转缓冲轮按压的状态下旋转晶片而具有取向平坦的晶片的倒角镜状抛光方法。用相对简单的控制系统可以获得镜面抛光稳定的晶圆倒角。本发明的前提是，晶片旋转速度Ns具有低惯性质量和低转速，因此与按压压力控制和缓冲轮控制相比，可以获得具有高响应特性和高精度的晶片转速控制，并且根据检测晶片反射镜抛光位置的检测装置的检测信号，根据检测到的晶片反射镜抛光位置来控制晶片转速Ns，检测晶片的固有外围部分，拐角和定向平面部分。

7. 发明授权

US6113463A Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat 失效
标题翻译：具有取向平面的镜面抛光晶圆倒角的方法和装置
公开(公告)号：US6113463A
公开(公告)日：2000-09-05
申请号：US623771
申请日：1996-03-29
申请人： Fumihiko Hasegawa , Yasuyoshi Kuroka , Toshihiro Tsuchiya , Koichiro Ichikawa , Yasuo Inada
发明人： Fumihiko Hasegawa , Yasuyoshi Kuroka , Toshihiro Tsuchiya , Koichiro Ichikawa , Yasuo Inada
IPC分类号： B24B9/00 , B24B9/06 , B24B49/02 , B24B49/12 , B34B49/00 , B34B9/02
CPC分类号： B24B49/12 , B24B49/02 , B24B9/065
摘要： A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed N.sub.s has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed N.sub.s according to the detected wafer mirror-like polishing position.
摘要翻译：公开了一种通过在被预定压力的旋转缓冲轮按压的状态下旋转晶片而具有取向平坦的晶片的倒角镜状抛光方法。用相对简单的控制系统可以获得镜面抛光稳定的晶圆倒角。本发明的前提是，晶片旋转速度Ns具有低惯性质量和低转速，因此与按压压力控制和缓冲轮控制相比，可以获得具有高响应特性和高精度的晶片转速控制，并且根据检测晶片反射镜抛光位置的检测装置的检测信号，根据检测到的晶片反射镜抛光位置来控制晶片转速Ns，检测晶片的固有外围部分，拐角和定向平面部分。

8. 发明授权

US5549502A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5549502A
公开(公告)日：1996-08-27
申请号：US162679
申请日：1993-12-06
申请人： Kohichi Tanaka , Hiromasa Hashimoto , Yasuo Inada , Makoto Nakajima
发明人： Kohichi Tanaka , Hiromasa Hashimoto , Yasuo Inada , Makoto Nakajima
IPC分类号： B24B37/34 , B24B1/00
CPC分类号： B24B37/345
摘要： A grinding method and apparatus having a position aligning mechanism to correctly achieve the centering of each work on a work table and locate an orientation flat part of each work at a predetermined position, and a displacing mechanism for reciprocally slidably displacing a top ring and the work table in order to assure that the center of each work is positionally aligned with the center of each top ring at an original position after completion of the centering of each work on the work table and the locating of the orientation flat part, and subsequently, centering each top ring with the gravitational center of each work so as to cancel a positional offset state prior to holding the work with the top ring to thrust the work against the grinding or polishing surface. The invention also includes a polishing method and apparatus in which both of a top ring and a rotary disc are reciprocally slidably displaced to improve the polishing efficiency of the device.
摘要翻译：一种磨削方法和装置，其具有位置对准机构，以正确地实现每个工件在工作台上的对中并将每个工件的定向平面部分定位在预定位置，以及位移机构，用于可往复地滑动地移动顶环和工件以确保每个工件的中心在完成每个工件在工作台上的定心和定位平面部分的定位之后在原始位置与每个顶环的中心位置对准，然后定心每个顶环具有每个工件的重力中心，以便在用顶环保持工件之前取消位置偏移状态，以将工件推向研磨或抛光表面。本发明还包括抛光方法和装置，其中顶环和旋转盘都可往复滑动地移位，以提高装置的抛光效率。

9. 发明授权

US4664333A Webbing for seatbelt system 失效
标题翻译：安全带系统的安全带
公开(公告)号：US4664333A
公开(公告)日：1987-05-12
申请号：US780296
申请日：1985-09-26
申请人： Yasuo Inada , Koki Sato , Takazo Fujii , Hideo Yokoyama , Shoichi Takahashi , Kiyoshi Mizutani , Takayoshi Kawashima , Akira Nagawa
发明人： Yasuo Inada , Koki Sato , Takazo Fujii , Hideo Yokoyama , Shoichi Takahashi , Kiyoshi Mizutani , Takayoshi Kawashima , Akira Nagawa
IPC分类号： B60R22/12 , D03D1/00 , B60R22/36 , D03D25/00
CPC分类号： B60R22/12 , D03D1/0005 , Y10S242/918
摘要： An occupant restraining webbing employed in a seatbelt system for a vehicle includes warp which has a dry tenacity of 8.8 gr/De or more, a thickness of 1,700 De or less and a twist multiplier of 3,100 to 5,500. Thus, it is possible to reduce the extra amount by which the webbing is undesirably wound off after the rotation of a takeup shaft for winding off the webbing from a webbing retractor has ceased.
摘要翻译：在车辆用安全带系统中使用的乘员约束用织带包括具有8.8g /□或更大的干强度，1700De以下的厚度和3,100-5,500的扭曲乘数的经纱。因此，可以减少在从织带卷收器卷绕的卷绕轴的旋转之后织带不期望地卷起的额外的量。

10. 发明授权

US06361418B1 Abrasive system 失效
标题翻译：磨料系统
公开(公告)号：US06361418B1
公开(公告)日：2002-03-26
申请号：US09547659
申请日：2000-04-12
申请人： Yasuo Inada
发明人： Yasuo Inada
IPC分类号： B24B700
CPC分类号： B24B37/08 , B24B37/345 , B24B49/12
摘要： The abrasive system of the present invention is capable of automatically and efficiently feeding and discharging work pieces. In the abrasive system, an upper abrasive plate and a lower abrasive plate pinch the work pieces, which are provided in through-holes of a carrier and abrade both faces of each work piece. A carrier driving mechanism moves the carrier, along a circular orbit, without spinning, together with the work pieces. Stopping means stops the movement of the carrier at a predetermined position. The feeding-and-discharging means includes: an arm robot having a work holding unit, which is provided to a front end and capable of holding and releasing the work piece; and an image processing unit for recognizing shapes and positions of the through-holes of the carrier and the work pieces.
摘要翻译：本发明的磨料系统能够自动且有效地进给和排出工件。在研磨系统中，上研磨板和下研磨板夹紧工件，其被设置在载体的通孔中并磨损每个工件的两个面。载体驱动机构与工件一起沿着圆形轨道移动载体而不旋转。停止装置停止载体在预定位置的移动。送出装置包括：臂机器人，其具有工件保持单元，该工件保持单元设置在前端并能够保持和释放工件; 以及图像处理单元，用于识别载体和工件的通孔的形状和位置。

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