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1. 发明授权

US06699055B2 Electrical connector with terminal insertion guide mechanisms 失效
标题翻译：带端子插入引导机构的电气连接器
公开(公告)号：US06699055B2
公开(公告)日：2004-03-02
申请号：US10286051
申请日：2002-11-01
申请人： Fu Jin Peng , Nick Lin , Ren-Chih Li , Jian Zhang
发明人： Fu Jin Peng , Nick Lin , Ren-Chih Li , Jian Zhang
IPC分类号： H01R450
CPC分类号： H01R12/82
摘要： An electrical connector (1) includes: an insulative base (10) having a top surface (104), a bottom surface (103), and a plurality of passageways (101); a cover (12) slidably mounted on the base; a plurality of conductive terminals (16) received in the passageways; and an actuating device (14). Each passageway is bounded by two opposite first walls (1018), two opposite second walls (1019), and a bottom wall (1013). Each first wall defines a through slot (1011), and one of the second walls forms a slanted guiding portion (1012) spanning from the top surface to adjacent the bottom wall. The bottom wall forms a chamfer portion (1014). The guiding portion and the chamfer portion cooperate to protect the corresponding terminal and the base from damage when the terminal is inserted into the passageway.
摘要翻译：电连接器（1）包括：具有顶表面（104），底表面（103）和多个通道（101）的绝缘基座（10）; 可滑动地安装在基座上的盖子（12）容纳在通道中的多个导电端子（16）; 和致动装置（14）。每个通道由两个相对的第一壁（1018），两个相对的第二壁（1019）和底壁（1013）限定。每个第一壁限定通孔（1011），并且第二壁中的一个形成从顶表面邻近底壁的倾斜的引导部分（1012）。底壁形成倒角部分（1014）。当端子插入通道时，引导部分和倒角部分协作以保护相应的端子和基座免受损坏。

2. 发明申请

US20050042897A1 Electrical connector 审中-公开
标题翻译：电连接器
公开(公告)号：US20050042897A1
公开(公告)日：2005-02-24
申请号：US10925286
申请日：2004-08-23
申请人： Jian Zhang , Nick Lin
发明人： Jian Zhang , Nick Lin
IPC分类号： H01R12/16 , H01R13/24 , H01R12/00
CPC分类号： H01R12/88
摘要： A land grid array connector (1) for electrically connecting a CPU package (3) to a printed circuit board comprises a housing (2) and a number of contacts (23) received in passageways (22) of the housing. The housing has a floor (20) and sidewalls (24,26). The floor and the sidewalls cooperatively define a receiving space for accommodating the package. Block member (269) is formed on inner side of the sidewalls of the housing for protecting inner surface of the sidewalls of the housing from scraping damage during insertion of the package into the housing and during extraction of the package from the housing. Reliable electrical connection between the package and contacts of the land grid array connector is secured.
摘要翻译：用于将CPU封装（3）电连接到印刷电路板的焊盘格栅阵列连接器（1）包括壳体（2）和容纳在壳体的通道（22）中的多个触点（23）。壳体具有底板（20）和侧壁（24,26）。地板和侧壁协同地限定用于容纳包装的容纳空间。块体构件（269）形成在壳体的侧壁的内侧，用于在将包装插入壳体期间以及在从壳体提取包装件期间保护壳体的侧壁的内表面免受刮擦损坏。封装和焊盘栅格阵列连接器的触点之间的可靠电连接得到保证。

3. 发明授权

US07101210B2 LGA socket 失效
标题翻译： LGA插座
公开(公告)号：US07101210B2
公开(公告)日：2006-09-05
申请号：US11288730
申请日：2005-11-28
申请人： Nick Lin , Jian Zhang , Yu-Chen Chen
发明人： Nick Lin , Jian Zhang , Yu-Chen Chen
IPC分类号： H01R13/62
CPC分类号： H05K7/12 , H05K7/1061
摘要： Disclosed is a LGA socket connector including an insulative housing (2), a stiffener (3), a clip (4), and a lever (5) defining thereof a driving portion (50) and a locking portion (52) linked thereto. The stiffener is configured to grasp a periphery of the housing. The clip and the locking portion of the lever are essentially pivotally moved about longitudinal ends of the housing respectively, but with the driving portion disposed adjacent one transverse side of the housing. At least one of the clip and the stiffener is provided with a recessed region (300) adjacent said transverse side of the housing, thereby preventing the whole connector from becoming inclined when the connector is horizontally locked and placed on the printed circuit board.
摘要翻译：公开了一种LGA插座连接器，其包括绝缘壳体（2），加强件（3），夹子（4）和限定有驱动部分（50）的杠杆（5）和与其连接的锁定部分（52）。加强件构造成抓住壳体的周边。杠杆的夹子和锁定部分分别基本上围绕壳体的纵向端部枢转地移动，但是驱动部分邻近壳体的一个横向侧面设置。夹子和加强件中的至少一个设置有与壳体的所述横向侧相邻的凹陷区域（300），从而当连接器水平地锁定并放置在印刷电路板上时，防止整个连接器变得倾斜。

4. 发明申请

US20060116012A1 LGA socket 失效
公开(公告)号：US20060116012A1
公开(公告)日：2006-06-01
申请号：US11288730
申请日：2005-11-28
申请人： Nick Lin , Jian Zhang , Yu-Chen Chen
发明人： Nick Lin , Jian Zhang , Yu-Chen Chen
IPC分类号： H01R13/44
CPC分类号： H05K7/12 , H05K7/1061
摘要： Disclosed is a LGA socket connector including an insulative housing (2), a stiffener (3), a clip (4), and a lever (5) defining thereof a driving portion (50) and a locking portion (52) linked thereto. The stiffener is configured to grasp a periphery of the housing. The clip and the locking portion of the lever are essentially pivotally moved about longitudinal ends of the housing respectively, but with the driving portion disposed adjacent one transverse side of the housing. At least one of the clip and the stiffener is provided with a recessed region (300) adjacent said transverse side of the housing, thereby preventing the whole connector from becoming inclined when the connector is horizontally locked and placed on the printed circuit board.

5. 发明申请

US20050059288A1 Electrical connector with loading plate 审中-公开
标题翻译：带连接板的电气连接器
公开(公告)号：US20050059288A1
公开(公告)日：2005-03-17
申请号：US10940283
申请日：2004-09-13
申请人： Nick Lin , Jian Zhang , Huayin Huang
发明人： Nick Lin , Jian Zhang , Huayin Huang
IPC分类号： H01R12/16 , H01R13/62 , H01R4/50 , H01R13/625
CPC分类号： H01R12/88
摘要： An electrical connector (1) for interconnecting an LGA chip (60) with a PCB includes an dielectric housing (10) defining a number of terminal passageways (16) with a plurality of electrical contacts (12) accommodated therein, a metal reinforcement (20) enclosing the housing (10) partly, a loading plate (40) pivotally mounted to an end of the reinforcement (20), and an actuator member (30) attached to an opposite end of the reinforcement (20) for engaging with the loading plate (40). The loading plate (40) defines a pair of pressing portions (43) to press the chip (60) against the connector (1). The pressing portion (43) defines some flexible materials (431) on the bottom surface (430) toward the housing (10) for protecting the chip (60) from being scraped by the loading plate (40).
摘要翻译：用于将LGA芯片（60）与PCB互连的电连接器（1）包括限定多个容纳在其中的多个电触头（12）的端子通道（16）的电介质外壳（10），金属加强件）部分地封装所述壳体（10），可枢转地安装到所述加强件（20）的端部的装载板（40）和附接到所述加强件（20）的相对端的致动器构件（30），用于与所述加载板（40）。装载板（40）限定一对按压部分（43）以将芯片（60）压靠在连接器（1）上。按压部分（43）在底表面（430）上朝向壳体（10）限定一些柔性材料（431），用于保护芯片（60）免受装载板（40）的刮擦。

6. 外观设计

USD980356S1 Automatic ball launcher 有权
公开(公告)号：USD980356S1
公开(公告)日：2023-03-07
申请号：US29844017
申请日：2022-06-25
申请人： Jian Zhang
设计人： Jian Zhang

7. 发明授权

US11524401B1 Learning skills from video demonstrations 有权
公开(公告)号：US11524401B1
公开(公告)日：2022-12-13
申请号：US16829277
申请日：2020-03-25
申请人： Jian Zhang , Mario J. Srouji , Ruslan Salakhutdinov
发明人： Jian Zhang , Mario J. Srouji , Ruslan Salakhutdinov
IPC分类号： G05B19/04 , B25J9/16 , G06T7/20 , G06N20/00 , G06N5/04 , G05B13/02
摘要： A method includes determining motion imitation information for causing a system to imitate a physical task using a first machine learning model that is trained using motion information that represents a performance of the physical task, determining a predicted correction based on the motion information and a current state from the system using a second machine learning model that is trained using the motion information, determining an action to be performed by the system based on the motion imitation information and the predicted correction; and controlling motion of the system in accordance with the action.

8. 发明申请

US20220005720A1 Fluxless gang die bonding arrangement 有权
公开(公告)号：US20220005720A1
公开(公告)日：2022-01-06
申请号：US16873779
申请日：2020-07-02
申请人： Jian Zhang
发明人： Jian Zhang
IPC分类号： H01L21/68 , H01L21/67 , H01L21/687 , H01L21/683 , H01L23/00
摘要： The present invention comprises an arrangement and process for the fluxless manufacture of an integrated circuit component, comprising the steps of loading a solder ball and chip arrangement, solder ball side up or down, onto a first or a second donor chuck respectively; monitoring the solder ball and chip arrangement by a computer-controlled camera; removing the solder ball and chip arrangement from the donor chuck by a computer-controlled gripper mechanism; moving the solder ball and chip arrangement via the gripper mechanism onto a computer-controlled gang carrier, the monitored by a second computer controlled camera; flipping the gang carrier about a horizontal axis so as to arrange the solder ball and chip arrangement into an inverted, solder ball side down orientation over a receiver chuck substrate, monitored and positionally controlled by a third computer-controlled camera; and compressing the solder ball side down solder ball and chip arrangement onto the receiver chuck substrate by a computer-controlled compression rod so as to bond the solder ball side down solder ball and chip arrangement onto the receiver chuck substrate so as to form an integrated circuit assembly.

9. 发明授权

US10879102B2 Flux-free solder ball mount arrangement 有权
公开(公告)号：US10879102B2
公开(公告)日：2020-12-29
申请号：US15998298
申请日：2018-08-01
申请人： Jian Zhang
发明人： Jian Zhang
IPC分类号： H01L21/48 , H01L21/68 , G06T7/00 , H01L21/687 , H01L21/683 , H01L21/67 , H01L23/00 , G06T7/33
CPC分类号： H01L21/681 , G06T7/001 , G06T7/33 , H01L21/67253 , H01L21/67259 , H01L21/67288 , H01L21/682 , H01L21/6838 , H01L21/68707 , H01L24/11 , H01L24/17 , G06T2207/30148 , H01L2224/11005 , H01L2224/11013 , H01L2224/11334
摘要： A system for the flux free processing of a plurality of solder balls on a wafer, comprising: an articulable vacuum support chuck for maintaining support of a plurality of solder balls on a wafer being processed. An articulable flux-free binder applicator arranged in binder depositing relationship with the wafer within the treatment chamber. An articulable fluid dispenser is arranged in a binder-applied minimization-treatment with respect to the flux free binder applied to the wafer within the treatment chamber.

10. 外观设计

USD818726S1 Swing 有权
公开(公告)号：USD818726S1
公开(公告)日：2018-05-29
申请号：US29599093
申请日：2017-03-31
申请人： Jian Zhang
设计人： Jian Zhang

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