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1. 发明授权

US4804810A Apparatus and method for tape bonding 失效
标题翻译：胶带粘接装置及方法
公开(公告)号：US4804810A
公开(公告)日：1989-02-14
申请号：US170564
申请日：1988-03-14
申请人： Fred Drummond , James W. Clark
发明人： Fred Drummond , James W. Clark
IPC分类号： H01L21/00 , B23K1/12
CPC分类号： H01L21/67132
摘要： A bonding apparatus for eutectically bonding tape leads to semiconductors and other substrates includes four separate bonding rails for applying heat. The bonding rails have a preselected distribution of mass along their length in order to compensate for uneven heating characteristics which are normally observed in linear heating elements. Usually, four such heat elements are orthogonally arranged at the bottom ends of four electric power buses. By attaching the heating elements to adjacent power buses, and coupling diagonally opposed pairs of the power buses to the positive and negative polarity of a current source, substantially uniform heating of all four elements may be achieved. The ability to provide uniform heating is critical for properly forming eutectic bonds.
摘要翻译：用于将带状引线连接到半导体和其它基板的接合装置包括用于施加热量的四个单独的接合导轨。接合导轨沿其长度具有预选的质量分布，以便补偿通常在线性加热元件中观察到的不均匀的加热特性。通常，四个电力总线的底端四个这样的热元件正交地布置。通过将加热元件附接到相邻的电力总线，并且将对角相对的电力总线对耦合到电流源的正极和负极，可以实现所有四个元件的基本均匀的加热。提供均匀加热的能力对于正确形成共晶键是至关重要的。

2. 发明授权

US06173490B1 Method for forming a panel of packaged integrated circuits 失效
标题翻译：用于形成封装集成电路板的方法
公开(公告)号：US06173490B1
公开(公告)日：2001-01-16
申请号：US08915352
申请日：1997-08-20
申请人： Shaw Wei Lee , Hem P. Takiar , Fred Drummond
发明人： Shaw Wei Lee , Hem P. Takiar , Fred Drummond
IPC分类号： H05K330
CPC分类号： H01L21/561 , B29C39/10 , B29C39/24 , H01L21/565 , H01L23/544 , H01L24/16 , H01L24/48 , H01L24/97 , H01L2223/54406 , H01L2223/54433 , H01L2223/54453 , H01L2223/54486 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/1517 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , Y10T29/49146 , Y10T29/49158 , H01L2224/81 , H01L2224/85 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A method and an apparatus for forming a panel of packaged integrated circuits is disclosed. A substrate panel having an array of integrated circuits mounted thereon is placed in a mold having a molding chamber. The molding chamber has a multiplicity of adjacent package recesses flowably interconnected by way of a plurality of molding compound flowgates. Each package recess is suitable for receiving at least one associated integrated circuits. A molding compound is passed into the molding chamber by way of a mold gate such that at least some of the molding compound passes through a plurality of different package recesses by way of their associated flowgates. In one embodiment, the mold includes a mold body having a molding chamber with a plurality of ridges that define the multiplicity of package recesses within the molding chamber. The multiplicity of package recesses are flowably interconnected through flowgates formed by the ridges.
摘要翻译：公开了一种用于形成封装集成电路板的方法和装置。将具有安装在其上的集成电路阵列的基板面板放置在具有模制室的模具中。模制室具有多个相邻的包装凹部，其可通过多个模塑复合流动臂可流动地相互连接。每个封装凹槽适于接收至少一个相关联的集成电路。模塑料通过模具浇口进入模制室，使得至少一些模塑料通过其相关的流动浇口穿过多个不同的包装凹槽。在一个实施例中，模具包括具有模制室的模具主体，模制室具有限定模制室内的多个封装凹槽的多个脊。包装凹槽的多个可通过由脊形成的流动闸流动地相互连接。

3. 发明授权

US07102209B1 Substrate for use in semiconductor manufacturing and method of making same 有权
标题翻译：用于半导体制造的基板及其制造方法
公开(公告)号：US07102209B1
公开(公告)日：2006-09-05
申请号：US10650325
申请日：2003-08-27
申请人： Jaime Bayan , Ashok S. Prabhu , Fred Drummond
发明人： Jaime Bayan , Ashok S. Prabhu , Fred Drummond
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/49548 , H01L23/49861 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2224/32245 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A lead-frame based substrate panel for use in semiconductor packaging is described. The substrate panel includes a lead-frame panel having at least one array of device areas. Each device area has a plurality of contacts. The lead-frame panel is filled with a dielectric material to form a relatively rigid substrate panel that can be used for packaging integrated circuits. The top surface of the dielectric material is typically substantially coplanar with the top surface of the lead-frame panel, and the bottom surface of the dielectric material is typically substantially coplanar with the bottom surface of the lead-frame panel.
摘要翻译：描述了用于半导体封装的基于引线框架的基板面板。衬底面板包括具有至少一个器件区域阵列的引线框架面板。每个设备区域具有多个触点。引线框板填充有电介质材料以形成可用于封装集成电路的相对刚性的基板。电介质材料的顶表面通常与引线框架板的顶表面基本上共面，并且电介质材料的底表面通常与引线框架板的底表面基本上共面。

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