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    • 1. 发明授权
    • Device and method for producing baked, thin-walled molded articles
    • 用于生产烘烤的薄壁模塑制品的装置和方法
    • US5955129A
    • 1999-09-21
    • US859283
    • 1997-04-19
    • Franz Haas, Sr.Franz Haas, Jr.Johann HaasErich Koletnik
    • Franz Haas, Sr.Franz Haas, Jr.Johann HaasErich Koletnik
    • A21B5/02A47J37/01A21B1/46A21C11/00
    • A21B5/023A21B5/026
    • Disclosed are devices and processes for producing baked thin-walled shaped articles from baking or pouring mixtures which expand during the baking process. The bottom half (18) of a baking mold (16) for producing thin-walled shaped articles is accommodated in the bottom tongs section (13) of a pair of baking tongs (7) and the top half (17) of the baking mold is accommodated in the top tongs section (15) of the tongs (7). The mold halves (17, 18) and tongs sections (13, 15) are provided with stop surfaces (68c, 64d) and sealing surfaces (17a, 18a, 21a, 22a) and are in mutual contact when the baking mold (16) is closed. At least one clamp device (30, 31) is provided to press the mold halves (17, 18, 21, 22) of the closed baking mold (16) together; said clamp device forces at least the two mold halves (17, 18) of the closed baking mold (16) together with a predetermined clamping force during clamping and eliminates at least the play between them. The upper tongs section (15) of the baking tongs (7) can be guided via a lateral guide strut (14) in the lower tongs section (13). With baking tongs which have two-part dies in the lower tongs section, mechanisms can be provided between the baking tongs in the tongs chain in the baking oven to open or close the dies when passing a deviation in the chain.
    • PCT No.PCT / AT95 / 00220 Sec。 371日期1997年04月19日 102(e)日期1997年4月19日PCT提交1995年11月16日PCT公布。 第WO96 / 14750号公报 日期1996年5月23日被公开是用于生产烘烤的薄壁形状制品的装置和方法,其烘烤或浇注混合物在烘烤过程中膨胀。 用于制造薄壁形状制品的烘烤模具(16)的下半部(18)容纳在一对烤钳(7)的底钳部分(13)和烘烤模具的上半部(17) 被容纳在钳子(7)的顶部钳部分(15)中。 模具半部(17,18)和钳部分(13,15)设有止动表面(68c,64d)和密封表面(17a,18a,21a,22a),并且当烘烤模具(16) 关闭了。 提供至少一个夹紧装置(30,31)以将封闭的烘烤模具(16)的半模(17,18,21,22)挤压在一起; 所述夹紧装置在夹紧期间至少将封闭的烘烤模具(16)的两个半模(17,18)与预定的夹紧力一起施加,并且至少消除它们之间的间隙。 烘烤钳(7)的上钳部(15)可以通过下钳部(13)中的侧向引导支柱(14)引导。 在下钳部分具有两部分模具的烘烤钳中,可以在烘烤炉中的钳链中的烘烤钳之间设置机构,以在通过链中的偏差时打开或关闭模具。
    • 2. 发明授权
    • Device for deflecting filled wafer slices arranged in juxtaposed rows
and advanced in the direction of said rows
    • 用于偏转以并排排列并沿所述行的方向前进的填充的晶片切片的装置
    • US4625856A
    • 1986-12-02
    • US700535
    • 1985-02-11
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • A21C9/08A21C15/02B65G47/26
    • B65G47/26A21C15/02A21C9/08
    • The spacing between laterally closely juxtaposed, parallel, rectilinear rows of wafers filled with a sticky composition is increased by advancing the rows of wafers on a supporting surface in a first direction to entrance portions of guiding passages extending at a second direction angularly diverging from the first direction at a bend. The entrance portions are staggered in the direction of advancement. A rotary disc is associated with the entrance portion of each guiding passage and has an upper portion protruding through a slot in the supporting surface and constituting a guiding face facing the guiding passage, and a shaft is arranged below the supporting surface and rotatably supports the rotary disc. An oiling and/or cleaning device is associated with each rotary disc below the supporting surface for oiling and/or cleaning the guiding face of the rotary disc.
    • 通过将第一方向上的支撑表面上的晶片排推进到在第一方向的第二方向上延伸的引导通道的入口部分,该第二方向与第一方向成角度地分开,从而增加了侧向紧密并置的平行的直线列的填充有粘性组合物的晶片之间的间隔 弯道方向 入口部分在前进方向上交错。 旋转盘与每个引导通道的入口部分相关联,并且具有通过支撑表面中的狭槽突出的上部并且构成面向引导通道的引导面,并且轴被布置在支撑表面下方并可旋转地支撑旋转体 光盘。 上油和/或清洁装置与支撑表面下方的每个旋转盘相关联,用于上油和/或清洁旋转盘的引导面。
    • 3. 发明授权
    • Process and apparatus for producing filled wafer blocks
    • 用于生产填充晶片块的工艺和设备
    • US4567049A
    • 1986-01-28
    • US682470
    • 1984-12-17
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • A21C15/02A21D13/00A23G3/00
    • A21C15/02
    • In a process in which cover sheets and/or coated wafer sheets are joined to form filled wafer blocks, each coated wafer sheet and, if desired, each cover sheet is moved in a stacking location from a lower position to an overlying upper position, the coated upper surface of each coated wafer sheet is joined to the underside of the cover sheet which is in the upper position and which, if desired, has previously been raised to the upper position, or to the underside of the coated wafer sheet which has previously been raised to the upper position, and each complete wafer block consisting of at least two sheets is moved from said upper position out of said stacking location. To increase the production rate, it is proposed that the successive coated wafer sheets for each wafer block or successive coated wafer sheets and cover sheets disposed between successive coated wafer sheets are successively and continuously fed one by one to the lower position in the stacking location, and at least part of the movement of each of said sheets to said lower position is performed while the next preceding sheet is being raised. It is also proposed to carry out the process by means of two helical conveyors, which have parallel axes of rotation, which are inclined from a normal on the plane of conveyance of the wafer sheet feeder and each of which has a lower convolution, an upper convolution, and an inclined step joining said upper and lower convolutions.
    • 在覆盖片和/或涂覆的晶片片接合以形成填充的晶片块的过程中,每个涂覆的晶片片,并且如果需要,每个覆盖片在堆叠位置从较低位置移动到上部上部位置, 每个涂覆的晶片片的涂覆的上表面被连接到处于上部位置的覆盖片的下侧,并且如果需要,其预先已经被升高到先前已经被涂覆的晶片片的上部位置或下侧 被升高到上部位置,并且由至少两个片材组成的每个完整的晶片块从所述上部位置移出所述堆叠位置。 为了提高生产率,提出将各晶片块的连续涂覆的晶片片或连续涂覆的晶片片和设置在连续涂覆的晶片之间的覆盖片连续并连续地一个一个地供给到堆叠位置的下部位置, 并且在下一个前一页被提升的同时执行每个所述纸张到所述下部位置的运动的至少一部分。 还提出通过具有平行的旋转轴线的两个螺旋输送机进行该过程,所述螺旋输送机从晶片供纸器的输送平面上的法线倾斜,并且每个螺旋输送机具有较低的卷积,上部 卷积,以及连接所述上下卷圈的倾斜台阶。
    • 4. 发明授权
    • Process for continuously making an endless wafer laminate of uniform
width, consisting of individual wafer sheet layers and intervening
cream layers
    • 用于连续制造均匀宽度的无限晶片层压板的方法,由单独的晶片片层和中间的奶油层组成
    • US4518617A
    • 1985-05-21
    • US432931
    • 1982-09-29
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • A21C15/00A21C15/02A23G3/20A21D6/00G01N33/02
    • A23G3/2023A21C15/002A21C15/02
    • Process and apparatus for continuously making an endless wafer laminate which has a uniform width and consists of individual wafer sheet layers and intervening cream layers. In order to increase the production rate of such wafer laminate while maintaining a high quality, the invention teaches that each edge of the wafer sheets for the lowermost wafer sheet layer is registered and the deposition of the wafer sheets for the remaining wafer sheet layers is controlled by the succession of said wafer sheet edges. The butt joints of the wafer sheets in the individual wafer sheet layers are offset relative to each other in the direction of conveyance or are arranged exactly in register. For registering the wafer sheet edges, the edges of consecutive wafer sheets are displaced or pivotally moved relative to each other or pulled apart to form a gap. Each wafer sheet for the additional wafer sheet layers is moved to a waiting position in the wafer sheet applicator, which succeeds the coating head for applying a cream layer, and in dependence on the succession of the wafer sheet edges of the lowermost wafer sheet layer is applied to the adjacent cream layer and is then forced against the same. The resulting wafer laminate is used as an intermediate product for making small wafer slices.
    • PCT No.PCT / AT82 / 00017 Sec。 371日期:1982年9月29日 102(e)1982年9月29日PCT PCT 1982年5月19日PCT公布。 出版物WO82 / 03969 日期:1982年11月25日。连续制造具有均匀宽度并由单个晶片片层和中间霜层组成的无限晶片层叠体的方法和设备。 为了提高这种晶片层叠体的生产率,本发明的目的在于,记录最下面的晶片薄片层的晶圆片的边缘,并且控制剩下的晶片薄片层的晶片片的沉积 通过所述晶片片边缘的连续。 各个晶片片层中的晶片片的对接接头在输送方向上相对于彼此偏移或精确地排列在对齐中。 为了记录晶片片边缘,连续晶片片的边缘相对于彼此移位或枢转运动或拉开以形成间隙。 用于附加晶片片层的每个晶片片移动到晶片片施加器中的等待位置,晶片片施加器成功地覆盖用于施加奶油层的涂覆头,并且依赖于最下面的晶片片层的晶片片边缘的连续 施加到相邻的奶油层,然后被强制反对。 所得到的晶片层压板用作制造小晶片切片的中间产品。
    • 6. 发明授权
    • Interstage wafer block accumulation
    • 阶段晶片块积累
    • US5201403A
    • 1993-04-13
    • US830800
    • 1992-02-06
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • A21C15/02
    • A21C15/02
    • An interstage wafer block accumulator for a plant for the production and further processing of wafer blocks. In an interstage wafer block accumulator comprising at least one conveyor and a plurality of accumulator units, each of which accommodates one or more wafer blocks and is disposed between a feed station and a delivery station, it is proposed that said accumulator units for the wafer blocks accommodated in each accumulator unit should be consecutively arranged in the direction of travel of the wafer blocks. Each of said accumulator units comprises a separate horizontal conveyor for accommodating and forwarding wafer block stacks, each of which comprises one wafer block or a plurality of superimposed wafer block stacks. The interstage wafer block accumulator may have a plurality of superimposed storage levels. The accumulator units may be consecutively arranged on said plurality of storage levels in the direction of travel of the wafer blocks. In the interstage wafer block accumulator the accumulators may be arranged on one level or on each of a plurality of superimposed storage levels in a plurality of routes, which adjoin at an angle or are parallel to each other.
    • 一种用于生产和进一步加工晶片块的设备的级间晶片块式蓄电池。 在包括至少一个输送机和多个蓄电池单元的级间晶片块蓄能器中,每个蓄电池单元容纳一个或多个晶片块,并且设置在进料站和输送站之间,提出用于晶片块的所述累加器单元 容纳在每个蓄电池单元中应当沿着晶片块的行进方向连续布置。 每个所述蓄压器单元包括用于容纳和转发晶片块堆叠的单独的水平输送器,每个晶片块包括一个晶片块或多个叠加的晶片块堆叠。 级间晶片块累加器可以具有多个叠加的存储电平。 蓄电池单元可以在晶片块的行进方向上连续布置在所述多个存储水平上。 在级间晶片块累加器中,可以将多个叠加的存储器级别中的一个级别或多个叠加的存储器级别中的每一个布置在级间晶片块累加器中,该多个路由以一定角度相邻或彼此平行。
    • 7. 发明授权
    • Process for making rolled wafer cones
    • 轧制晶圆锥的制造工艺
    • US4624855A
    • 1986-11-25
    • US727006
    • 1985-04-25
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • A23G3/02A21B5/00A21B5/02A21D8/00A21D13/00A21D13/08A21C15/02
    • A21B5/026A21C15/025
    • In a process of making a rolled wafer cone from a baked flat wafer blank made from a sugar-containing wafer dough, the baked wafer blank is rolled to form a wafer cone in a winding mold while the wafer blank is still in a soft, deformable state after the baking operation. Thereafter the rolled wafer cone is permitted to harden. In order to ensure the production of wafer cones having consistently exactly the same shape, it is proposed that the wafer cone which is unrestrained at least in part is shortened in the winding mold to a predetermined length while the wafer cone is adapted to be plastically deformed. For this purpose the rolled wafer cone disposed in the winding mold is subjected to a plastic deformation only at one end or only at both ends. The process can be carried out by means of winding devices, which are mounted on a rotary frame and each of which comprises a conical winding core, which is secured to a winding shaft that is displaceable relative to the rotary frame to move the conical winding into and out of the winding mold. In that apparatus each winding device is provided with at least one sizing device, which is associated with the rim of the wafer cone and comprises at least one pressure-applying finger, which is adapted to be introduced between the winding mold and the winding core.
    • 在从含糖晶片面团制成的烘烤的平坦晶片坯料上制造卷状晶片圆锥的过程中,将烘烤的晶片坯料卷起以在卷绕模具中形成晶片锥体,同时晶片坯料仍然是柔软的,可变形的 烘烤后的状态。 此后,轧制的晶圆锥体被允许硬化。 为了确保具有一贯完全相同形状的晶片锥的生产,提出将至少部分无限制的晶圆锥体在卷绕模具中缩短到预定长度,同时晶片锥体适于塑性变形 。 为此,设置在卷绕模具中的轧制晶圆锥体仅在一端或仅在两端受到塑性变形。 该过程可以通过安装在旋转框架上的卷绕装置进行,每个卷绕装置包括圆锥形卷绕芯,其固定到相对于旋转框架可移位的卷轴上,以将锥形卷绕件移动到 并从绕组模具出来。 在该装置中,每个卷绕装置设置有至少一个施胶装置,其与晶圆锥体的边缘相关联,并且包括至少一个施加压力的手指,其适于引入卷绕模具和卷绕芯之间。
    • 9. 发明授权
    • Apparatus for conditioning wafers
    • 晶圆调理装置
    • US4524682A
    • 1985-06-25
    • US558936
    • 1983-12-07
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • A21C15/00A23B4/04
    • A21C15/00
    • Apparatus for conditioning wafers, such as wafer sheets, flat wafers, low hollow wafers and the like comprises an insulated conditioning chamber, which is closed except for a feed opening and a discharge opening, a revolving conveyor, which extends in the conditioning chamber adjacent to the feed opening and the discharge opening and is provided with successive compartments for receiving wafers, and air-guiding passages, which extend along the path of the compartments and are connected to an air-conditioning plant, which is preferably disposed outside the conditioning chamber. The clearance between the supporting elements which have been moved or swung toward each other is substantially one to 5 times, preferably 1.1 to two times, the wall thickness of a flat wafer or once to twice the height of a low hollow wafer. At least one of the two supporting elements rises above the received wafer at least with a projecting portion.
    • 用于调节晶片的装置,例如晶片,平片,低空心晶片等,包括除了进料口和排出口外的绝缘调节室,在调节室中延伸的循环输送器, 进料开口和排出口,并且设置有用于接收晶片的连续隔室和沿着隔室的路径延伸并且连接到空调设备的空气引导通道,空调设备优选地设置在调节室的外部。 相互移动或摆动的支撑元件之间的间隙基本上是平坦晶片的壁厚或一小至低两倍的低空心晶片的1至5倍,优选1.1至2倍。 两个支撑元件中的至少一个至少通过突出部分上升到接收的晶片之上。
    • 10. 发明授权
    • Wafer baking oven
    • 晶圆烤箱
    • US4438685A
    • 1984-03-27
    • US376954
    • 1982-05-11
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • Franz Haas, Sr.Franz Haas, Jr.Johann Haas
    • A21B5/02A47J37/00
    • A21B5/02
    • A wafer baking oven for making baked wafers from batter includes an elongated baking chamber with heating elements therein. A thermally insulated enclosure surrounds at least part of the baking chamber. The oven includes a front port adjoining the baking chamber. There are a plurality of baking tongs in the baking chamber, which baking tongs move through the baking chamber and into and out of the front port in a running direction. The baking prongs are openable when in the front port for the removal of baked wafers from the tongs and for charging the baking tongs with batter. The baking tongs are then closed and are moved through the baking chamber in the closed state. The front port includes a charging station for charging the baking tongs with batter and a discharge station for discharging baked wafers along a path. The insulated enclosure includes a pair of lateral walls defining the lateral sides of the baking chamber, a sealing wall defining the top side of the baking chamber and a rear wall defining the rear side of the baking chamber. The baking chamber has a baking chamber exhaust for exhausting gases from the baking chamber. The insulated enclosure substantially completely encloses at least the baking chamber on its two lateral sides, on its ceiling walls, and at its rear wall, with the exception of the baking chamber exhaust. The baking chamber is also substantially completely enclosed at its bottom side.
    • 用于从面糊制造烘烤的晶片的晶片烤箱包括其中具有加热元件的细长烘烤室。 绝热外壳围绕烘烤室的至少一部分。 烘箱包括邻近烘烤室的前端口。 烘烤室中有多个烘烤钳,烘烤钳沿烘烤室移动并沿着运行方向进入和离开前端口。 当在前端口中用于从夹钳中取出烘烤的晶片并且用面糊给烘烤钳充电时,烘烤插脚是可打开的。 烘烤钳然后关闭,并且在关闭状态下移动通过烘烤室。 前端口包括用于向面糊充电烘烤钳的充电站和用于沿着路径排放烘烤的晶片的放电站。 绝缘外壳包括限定烘烤室的侧面的一对侧壁,限定烘烤室的顶侧的密封壁和限定烘烤室后侧的后壁。 烘烤室具有用于从烘烤室排出气体的烘烤室排气口。 绝热外壳基本上完全包围其两个侧面上的烘烤室,其顶壁和除了烘烤室排气之外的其后壁。 烘烤室也在其底侧基本上完全封闭。