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    • 5. 发明申请
    • PROCESS FOR PRODUCING ELECTRICALLY CONDUCTIVE SURFACES
    • 生产电导电表面的方法
    • US20120156391A1
    • 2012-06-21
    • US13391779
    • 2010-08-24
    • Frank Kleine JaegerJuergen KaczunUdo Lehmann
    • Frank Kleine JaegerJuergen KaczunUdo Lehmann
    • B29B13/08
    • H05K3/10
    • The invention relates to a process for producing structured or full-area, electrically conductive surfaces on a substrate (1), comprising the following steps: (a) transferring electrolessly and/or electrolytically coatable particles or a dispersion (3) comprising electrolessly and/or electrolytically coatable particles from a transfer medium (5) onto the substrate (1), (b) fixing the electrolessly and/or electrolytically coatable particles on the substrate (1), wherein the transfer in step (a) is promoted by virtue of the particles being magnetic or magnetizable or, in the case of transfer or a dispersion, magnetic or magnetizable particles being present in the dispersion, and a magnetic field (9) is applied.
    • 本发明涉及一种用于在基底(1)上生产结构化或全面积导电表面的方法,包括以下步骤:(a)将无电解和/或电解可涂覆的颗粒或分散体(3)转移到包含无电解和/ 或电解涂覆的颗粒从转印介质(5)到基材(1)上,(b)将无电解和/或可电解涂覆的颗粒固定在基材(1)上,其中步骤(a)中的转移由于 这些颗粒是磁性或可磁化的,或者在转移或分散的情况下,存在于分散体中的磁性或可磁化颗粒,并施加磁场(9)。
    • 8. 发明申请
    • ELECTROPLATING DEVICE AND METHOD
    • 电镀设备和方法
    • US20090101511A1
    • 2009-04-23
    • US12297864
    • 2007-04-17
    • Rene LochtmanJuergen KaczunNorbert SchneiderJuergen PfisterGert PohlNorbert Wagner
    • Rene LochtmanJuergen KaczunNorbert SchneiderJuergen PfisterGert PohlNorbert Wagner
    • C25D17/28C25D5/00
    • C25D17/14C25D5/06C25D5/54C25D7/0621C25D17/005C25D17/12H05K3/241
    • The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate (8) or a structured or full-surface electrically conductive surface on a nonconductive substrate (8), which comprises at least one bath, one anode and one cathode (1), the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the surface to be coated of the substrate and the substrate is transported through the bath. The cathode comprises at least one band (2) having at least one electrically conductive section (12), which is guided around at least two rotatable shafts (3). The invention furthermore relates to a method for the electrolytic coating of at least substrate, which is carried out in a device according to the invention, the band resting on the substrate for the coating and being circulated with a circulation speed which corresponds to the speed with which the substrate is guided through the bath. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.
    • 本发明涉及一种用于至少一个导电基板(8)或非导电基板(8)上的结构化或全表面导电表面的电解涂层的装置,其包括至少一个槽,一个阳极和一个阴极 (1),所述浴含有含有至少一种金属盐的电解质溶液,金属离子沉积在基板的导电表面上以形成金属层,同时使阴极与待涂覆的表面接触 衬底和衬底被输送通过浴。 阴极包括至少一个具有至少一个导电部分(12)的带(2),该导电部分围绕至少两个可旋转的轴(3)被引导。 本发明还涉及至少一种基材的电解涂覆方法,该方法是在根据本发明的装置中进行的,该带在基材上被放置并涂覆并循环,循环速度对应于与 衬底被引导通过浴。 最后,本发明还涉及根据本发明的装置在不导电支撑件上的导电结构的电解涂层的用途。