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1. 发明申请

US20110292124A1 LAMINATE CONSTRUCTS FOR MICRO-FLUID EJECTION DEVICES 有权
标题翻译：微流体喷射装置的层压结构
公开(公告)号：US20110292124A1
公开(公告)日：2011-12-01
申请号：US12788462
申请日：2010-05-27
申请人： Frank Edward Anderson , Richard Corley , Michael John Dixon , Jiandong Fang , Jeanne Mariee Saldanha Singh
发明人： Frank Edward Anderson , Richard Corley , Michael John Dixon , Jiandong Fang , Jeanne Mariee Saldanha Singh
IPC分类号： B41J2/135
CPC分类号： B41J2/1433 , B41J2/14 , B41J2/14072 , B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1632 , B41J2/1634 , B41J2/1643 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , H01L2224/48091 , H01L2224/73265 , H01L2924/10155 , H01L2924/00014
摘要： A micro-fluid ejection head has an ejection chip to expel fluid. It connects to a laminate construct. The construct has vertically configured wiring layers interspersed with non-conductive layers, such as carbon fiber layers. An upper of the wiring layers electrically connects to the ejection chip. The upper layer may also support a planar undersurface of the chip directly on a surface or in a recessed pocket. The two can connect with a die bond, such as one having silica or boron nitride. Fluid connections exist between ink feed slots of the chip and the laminate construct. A silicon tile or other material may also fluidly interconnect with the two. A plastic manifold optionally supports the laminate construct and may fluidly connect to it. The wiring layers of the laminate contemplate ground, power, and various bond pads. Other construct layers contemplate prepreg or core FR4 layers.
摘要翻译：微流体喷射头具有排出流体的喷射芯片。它连接到层压结构。该构造具有垂直配置的布线层，其散布有诸如碳纤维层之类的非导电层。布线层的上部电连接到排出芯片。上层还可以直接在表面上或凹陷的口袋中支撑芯片的平面下表面。两者可以与管芯接合，例如具有二氧化硅或氮化硼的管芯接合。在芯片的供墨槽和层叠结构之间存在流体连接。硅砖或其他材料也可以与两者流体互连。塑料歧管任选地支撑层压结构并且可以流体地连接到它。层叠体的布线层考虑地面，功率和各种接合垫。其他构造层考虑了预浸料或核心FR4层。

2. 发明授权

US08622524B2 Laminate constructs for micro-fluid ejection devices 有权
标题翻译：用于微流体喷射装置的层压结构
公开(公告)号：US08622524B2
公开(公告)日：2014-01-07
申请号：US12788462
申请日：2010-05-27
申请人： Frank Edward Anderson , Richard Corley , Michael John Dixon , Jiandong Fang , Jeanne Marie Saldanha Singh
发明人： Frank Edward Anderson , Richard Corley , Michael John Dixon , Jiandong Fang , Jeanne Marie Saldanha Singh
IPC分类号： B41J2/045
CPC分类号： B41J2/1433 , B41J2/14 , B41J2/14072 , B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1632 , B41J2/1634 , B41J2/1643 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , H01L2224/48091 , H01L2224/73265 , H01L2924/10155 , H01L2924/00014
摘要： A micro-fluid ejection head has an ejection chip to expel fluid. It connects to a laminate construct. The construct has vertically configured wiring layers interspersed with non-wiring layers, such as carbon fiber layers. An upper of the wiring layers electrically connects to the ejection chip. The upper layer may also support a planar undersurface of the chip directly on a surface or in a recessed pocket. The two can connect with a die bond, such as one having silica or boron nitride. Fluid connections exist between ink feed slots of the chip and the laminate construct. A silicon tile or other material may also fluidly interconnect with the two. A plastic manifold optionally supports the laminate construct and may fluidly connect to it. The wiring layers of the laminate contemplate ground, power, and various bond pads. Other construct layers contemplate prepreg or core FR4 layers.
摘要翻译：微流体喷射头具有排出流体的喷射芯片。它连接到层压结构。该结构具有垂直配置的布线层，其布置有诸如碳纤维层之类的非布线层。布线层的上部电连接到排出芯片。上层还可以直接在表面上或凹陷的口袋中支撑芯片的平面下表面。两者可以与管芯接合，例如具有二氧化硅或氮化硼的管芯接合。在芯片的供墨槽和层叠结构之间存在流体连接。硅砖或其他材料也可以与两者流体互连。塑料歧管任选地支撑层压结构并且可以流体地连接到它。层叠体的布线层考虑地面，功率和各种接合垫。其他构造层考虑了预浸料或核心FR4层。

3. 发明授权

US08777376B2 Skewed nozzle arrays on ejection chips for micro-fluid applications 失效
标题翻译：用于微流体应用的排出芯片上的倾斜喷嘴阵列
公开(公告)号：US08777376B2
公开(公告)日：2014-07-15
申请号：US12788446
申请日：2010-05-27
申请人： Frank Edward Anderson , Richard Earl Corley , Jiandong Fang
发明人： Frank Edward Anderson , Richard Earl Corley , Jiandong Fang
IPC分类号： B41J2/14
CPC分类号： B41J2/155 , B41J2202/20
摘要： A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along skewed fluid vias to enable seamless stitching of fluid ejections. The firing elements are energized to eject fluid and ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Singulating chips from larger wafers provide still further embodiments.
摘要翻译：微流体喷射头具有相邻连接的多个喷射芯片，以跨越待成像的介质产生冗长的阵列。芯片具有沿倾斜的流体通孔布置的流体激发元件，以实现流体喷射的无缝缝合。激发元件通电以喷射流体，并且根据颜色或流体类型间隔开。重叠的发射元件在成像期间为冗余努力提供可靠的打印质量。可变芯片尺寸和形状被公开为不同颜色的液体通孔之间的关系。倾斜角度各不相同，具有明显的优点。从较大的晶片制造芯片提供了另外的实施例。

4. 发明申请

US20110292122A1 SKEWED NOZZLE ARRAYS ON EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS 失效
标题翻译：用于微流体应用的喷射嘴上的喷嘴喷嘴阵列
公开(公告)号：US20110292122A1
公开(公告)日：2011-12-01
申请号：US12788446
申请日：2010-05-27
申请人： Frank Edward Anderson , Richard Earl Corley , Jiandong Fang
发明人： Frank Edward Anderson , Richard Earl Corley , Jiandong Fang
IPC分类号： B41J2/21 , B41J2/145
CPC分类号： B41J2/155 , B41J2202/20
摘要： A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along skewed fluid vias to enable seamless stitching of fluid ejections. The firing elements are energized to eject fluid and ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Singulating chips from larger wafers provide still further embodiments.
摘要翻译：微流体喷射头具有相邻连接的多个喷射芯片，以跨越待成像的介质产生冗长的阵列。芯片具有沿倾斜的流体通孔布置的流体激发元件，以实现流体喷射的无缝缝合。激发元件通电以喷射流体，并且根据颜色或流体类型间隔开。重叠的发射元件在成像期间为冗余努力提供可靠的打印质量。可变芯片尺寸和形状被公开为不同颜色的液体通孔之间的关系。倾斜角度各不相同，具有明显的优点。从较大的晶片制造芯片提供了另外的实施例。

5. 发明申请

US20110292123A1 CHEVRON EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS 有权
标题翻译：用于微流体应用的CHEVRON喷射咀
公开(公告)号：US20110292123A1
公开(公告)日：2011-12-01
申请号：US12822233
申请日：2010-06-24
申请人： Jiandong Fang , Frank Anderson , Richard Corley
发明人： Jiandong Fang , Frank Anderson , Richard Corley
IPC分类号： B41J2/21
CPC分类号： B41J2/155 , B41J2/14145 , B41J2/16 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1646 , B41J2002/14419 , B41J2002/14459 , B41J2202/20
摘要： A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along multiple fluid vias skewed variously to enable seamless stitching of fluid ejections. The firing elements are energized to eject fluid and individual ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes, including chevrons, are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Singulating chips from larger wafers provide still further embodiments as does increased usage of the wafer.
摘要翻译：微流体喷射头具有相邻连接的多个喷射芯片，以跨越待成像的介质产生冗长的阵列。芯片具有沿多个流体通道排列的流体发射元件，各种不同的倾斜状态使得能够无缝地缝合流体喷射。激发元件通电以喷射流体，并且单个的元件根据颜色或流体类型间隔开。重叠的发射元件在成像期间为冗余努力提供可靠的打印质量。可变芯片尺寸和形状（包括人字形）被公开为不同颜色的液体通孔之间的关系。倾斜角度各不相同，具有明显的优点。从较大的晶片制造芯片可以提供更多的实施例，因为晶片的使用增加。

6. 发明授权

US08393712B2 Chevron ejection chips for micro-fluid applications 有权
标题翻译：雪佛龙喷射芯片用于微流体应用
公开(公告)号：US08393712B2
公开(公告)日：2013-03-12
申请号：US12822233
申请日：2010-06-24
申请人： Jiandong Fang , Frank Anderson , Richard Corley
发明人： Jiandong Fang , Frank Anderson , Richard Corley
IPC分类号： B41J2/155
CPC分类号： B41J2/155 , B41J2/14145 , B41J2/16 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1646 , B41J2002/14419 , B41J2002/14459 , B41J2202/20
摘要： A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along multiple fluid vias skewed variously to enable seamless stitching of fluid ejections. The firing elements are energized to eject fluid and individual ones are spaced according to colors or fluid types. Overlapping firing elements serve redundancy efforts during imaging for reliable print quality. Variable chips sizes and shapes, including chevrons, are disclosed as are relationships between differently colored fluid vias. Skew angles range variously each with noted advantages. Singulating chips from larger wafers provide still further embodiments as does increased usage of the wafer.
摘要翻译：微流体喷射头具有相邻连接的多个喷射芯片，以跨越待成像的介质产生冗长的阵列。芯片具有沿多个流体通道排列的流体发射元件，各种不同的倾斜状态使得能够无缝地缝合流体喷射。激发元件通电以喷射流体，并且单个的元件根据颜色或流体类型间隔开。重叠的发射元件在成像期间为冗余努力提供可靠的打印质量。可变芯片尺寸和形状（包括人字形）被公开为不同颜色的液体通孔之间的关系。倾斜角度各不相同，具有明显的优点。从较大的晶片制造芯片可以提供更多的实施例，因为晶片的使用增加。

7. 发明授权

US08430484B2 Nozzle covering for ejection chips in micro-fluid applications 有权
标题翻译：用于微流体应用中喷射芯片的喷嘴盖
公开(公告)号：US08430484B2
公开(公告)日：2013-04-30
申请号：US12824358
申请日：2010-06-28
申请人： Jiandong Fang
发明人： Jiandong Fang
IPC分类号： B41J2/05
CPC分类号： B41J2/1404 , B41J2202/19 , B41J2202/20
摘要： A micro-fluid ejection head conveys fluid to firing elements at differing heights in differing layers. The ejection head includes a base substrate. The firing elements are configured on the substrate to eject fluid upon activation. Individual elements are arrayed closer or farther to a common fluid via. A multiple-layer covering on the substrate defines nozzles openings corresponding to each firing element. A lower layer of the covering directs fluid to either the closer or farther elements while a higher layer directs fluid to the other elements. The lower and higher layers define channels to direct the fluid from the fluid via. The higher layer covers the channels in the lower layer, while a topmost layer covers the channels in the higher layer. Also, the topmost layer defines the nozzle openings in large and small opening sizes. Holes in the underlying layers register with the nozzle openings, but are oppositely sized.
摘要翻译：微流体喷射头将流体输送到不同高度的不同高度的发射元件。喷射头包括基底。激发元件配置在基板上以在激活时喷射流体。单独的元件被排列成更接近或更远地与普通的流体通道。衬底上的多层覆盖物限定了与每个击发元件对应的喷嘴开口。覆盖层的下层将流体引导到更靠近或更远的元件，而较高层将流体引导到其它元件。下层和更高层限定了将流体从流体通道引导的通道。较高层覆盖下层中的通道，而最上层覆盖较高层中的通道。此外，最上层限定了大而小的开口尺寸的喷嘴开口。底层中的孔与喷嘴开口对齐，但尺寸相反。

8. 发明授权

US08657411B2 Fluid ejection device and method for fabricating fluid ejection device 有权
标题翻译：流体喷射装置和制造流体喷射装置的方法
公开(公告)号：US08657411B2
公开(公告)日：2014-02-25
申请号：US13160568
申请日：2011-06-15
申请人： Frank Anderson , Jiandong Fang
发明人： Frank Anderson , Jiandong Fang
IPC分类号： B41J2/14 , B41J2/05
CPC分类号： B41J2/162 , B41J2/1433 , B41J2/1606 , B41J2/1632
摘要： Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles. Further, the fluid ejection device includes a flow feature layer. The flow feature layer includes a plurality of flow features. The fluid ejection device further includes an ejection unit. The ejection unit includes a first layer. The first layer includes a plurality of fluid vias. Further, the ejection unit includes a second layer. The second layer includes a plurality of fluid channels. Further, the second layer is attached to the first layer through a first intermediate silicon oxide layer. The ejection unit also includes a third layer. The third layer includes a plurality of ports. The third layer is also attached to the second layer through a second intermediate silicon oxide layer. Further disclosed are an ejection unit for a fluid ejection device and a method for fabricating the fluid ejection device.
摘要翻译：公开了一种包括喷嘴板的流体喷射装置。喷嘴板包括多个喷嘴。此外，流体喷射装置包括流动特征层。流动特征层包括多个流动特征。流体喷射装置还包括喷射单元。喷射单元包括第一层。第一层包括多个流体通孔。此外，喷射单元包括第二层。第二层包括多个流体通道。此外，第二层通过第一中间氧化硅层附着到第一层。喷射单元还包括第三层。第三层包括多个端口。第三层也通过第二中间氧化硅层附着到第二层。还公开了一种用于流体喷射装置的喷射单元和用于制造流体喷射装置的方法。

9. 发明申请

US20120293584A1 FLUID EJECTION DEVICES AND METHODS FOR FABRICATING FLUID EJECTION DEVICES 有权
标题翻译：流体喷射装置和用于制造流体喷射装置的方法
公开(公告)号：US20120293584A1
公开(公告)日：2012-11-22
申请号：US13112278
申请日：2011-05-20
申请人： Jiandong Fang , Xiaoming Wu
发明人： Jiandong Fang , Xiaoming Wu
IPC分类号： B41J2/135 , B05D3/10 , C23F1/02
CPC分类号： B41J2/1404 , B41J2/14145 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1645 , B41J2/1646
摘要： Disclosed is a fluid ejection device for an inkjet printer that includes a substrate having at least one fluid flow channel configured within a bottom portion of the substrate. Each fluid flow channel of the at least one fluid flow channel is configured by etching the bottom portion. The substrate also includes a plurality of fluid flow vias configured within a top portion of the substrate. Each fluid flow via of the plurality of fluid flow vias is configured by etching the top portion. The each fluid flow via is further configured to be in fluid communication with a corresponding fluid flow channel through an isotropically etched cavity configured below the each fluid flow via and fluidically coupled to the corresponding fluid flow channel. The fluid ejection device also includes a flow feature to layer and a nozzle plate. Further disclosed are methods for fabricating fluid ejection devices.
摘要翻译：公开了一种用于喷墨打印机的流体喷射装置，其包括具有构造在基板的底部内的至少一个流体流动通道的基板。通过蚀刻底部部分来配置至少一个流体流动通道的每个流体流动通道。衬底还包括配置在衬底的顶部部分内的多个流体流动通孔。通过蚀刻顶部部分来配置多个流体流动通孔的每个流体流通道。每个流体流动通道进一步构造成通过各向同性蚀刻的空腔与相应的流体流动通道流体连通，每个流体流动通道配置在每个流体流动下方并流体耦合到相应的流体流动通道。流体喷射装置还包括到层的流动特征和喷嘴板。进一步公开了制造流体喷射装置的方法。

10. 发明申请

US20120274707A1 EJECTION DEVICES FOR INKJET PRINTERS AND METHOD FOR FABRICATING EJECTION DEVICES 审中-公开
标题翻译：用于喷墨打印机的喷射装置和用于制造喷射装置的方法
公开(公告)号：US20120274707A1
公开(公告)日：2012-11-01
申请号：US13097594
申请日：2011-04-29
申请人： Xiaorong Cai , Jiandong Fang , Xiaoming Wu , Elaine Yeap Money , Eunki Hong , Yimin Guan , Burton Joyner, II , Sean Terrance Weaver , David Graham , Zach Reitmeier
发明人： Xiaorong Cai , Jiandong Fang , Xiaoming Wu , Elaine Yeap Money , Eunki Hong , Yimin Guan , Burton Joyner, II , Sean Terrance Weaver , David Graham , Zach Reitmeier
IPC分类号： B41J2/14 , B23P17/00
CPC分类号： B41J2/1628 , B41J2/14032 , B41J2/1603 , B41J2/1606 , B41J2/162 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/164 , Y10T29/49401
摘要： Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.
摘要翻译：公开了一种喷墨打印机的喷射装置，其包括具有基板和至少一个流体喷射元件的喷射芯片。喷射装置还包括配置在喷射芯片上的流体结构。流体结构包括由有机材料构成并包括多个喷嘴的喷嘴板。流体结构还包括配置在喷射芯片和喷嘴板之间的流动特征层。流动特征层由有机材料组成并且包括多个流动特征。此外，流体结构包括封装喷嘴板的衬垫层。衬垫层还至少部分地封装多个流动特征的每个流动特征。衬层由无机材料构成。进一步公开了一种制造喷射装置的方法。

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