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1. 发明授权

US07524397B2 Lower electrode design for higher uniformity 有权
公开(公告)号：US07524397B2
公开(公告)日：2009-04-28
申请号：US10040326
申请日：2002-01-03
申请人： Fangli Hao , Albert R. Ellingboe , Eric H. Lenz
发明人： Fangli Hao , Albert R. Ellingboe , Eric H. Lenz
IPC分类号： H01L21/306 , C23C16/00
CPC分类号： H01J37/32623 , H01J37/32642
摘要： A plasma processing system for processing a substrate is disclosed. The plasma processing system includes a process chamber within which a plasma is both ignited and sustained for processing. The plasma processing system further includes an electrode disposed at the lower end of the process chamber. The electrode is configured for generating an electric field inside the process chamber. The plasma processing system also includes a component for controlling an impedance between the electrode and the plasma. The impedance is arranged to affect the electric field to improve processing uniformity across the surface of the substrate.

2. 发明授权

US06363882B1 Lower electrode design for higher uniformity 有权
标题翻译：较低的电极设计，使均匀性更高
公开(公告)号：US06363882B1
公开(公告)日：2002-04-02
申请号：US09475824
申请日：1999-12-30
申请人： Fangli Hao , Albert R. Ellingboe , Eric H. Lenz
发明人： Fangli Hao , Albert R. Ellingboe , Eric H. Lenz
IPC分类号： C23C1600
CPC分类号： H01J37/32623 , H01J37/32642
摘要： A plasma processing system for processing a substrate is disclosed. The plasma processing system includes a process chamber within which a plasma is both ignited and sustained for processing. The plasma processing system further includes an electrode disposed at the lower end of the process chamber. The electrode is configured for generating an electric field inside the process chamber. The plasma processing system also includes a component for controlling an impedance between the electrode and the plasma. The impedance is arranged to affect the electric field to improve processing uniformity across the surface of the substrate.
摘要翻译：公开了一种用于处理衬底的等离子体处理系统。等离子体处理系统包括处理室，其中等离子体都被点燃并持续进行处理。等离子体处理系统还包括设置在处理室的下端的电极。电极被配置为在处理室内产生电场。等离子体处理系统还包括用于控制电极和等离子体之间的阻抗的部件。阻抗被布置成影响电场以改善跨衬底表面的加工均匀性。

3. 发明授权

US06669811B2 Linear drive system for use in a plasma processing system 有权
公开(公告)号：US06669811B2
公开(公告)日：2003-12-30
申请号：US10012265
申请日：2001-11-05
申请人： Fangli Hao , Keith Dawson , Eric H. Lenz
发明人： Fangli Hao , Keith Dawson , Eric H. Lenz
IPC分类号： H01L21306
CPC分类号： H01J37/32623 , H01J37/32568
摘要： A plasma processing system for processing a substrate is disclosed. The system includes a process component capable of effecting a plasma inside a process chamber. The system also includes a gear drive assembly for moving the process component in a linear direction during processing of the substrate.

4. 发明授权

US06863784B2 Linear drive system for use in a plasma processing system 有权
标题翻译：用于等离子体处理系统的线性驱动系统
公开(公告)号：US06863784B2
公开(公告)日：2005-03-08
申请号：US10702682
申请日：2003-11-05
申请人： Fangli Hao , Keith Dawson , Eric H. Lenz
发明人： Fangli Hao , Keith Dawson , Eric H. Lenz
IPC分类号： H05H1/46 , C23C16/509 , H01J37/32 , H01L21/205 , H01L21/3065 , C23C14/32 , B05D5/00 , C03C15/00
CPC分类号： H01J37/32623 , H01J37/32568
摘要： A plasma processing system for processing a substrate is disclosed. The system includes a process component capable of effecting a plasma inside a process chamber. The system also includes a gear drive assembly for moving the process component in a linear direction during processing of the substrate.
摘要翻译：公开了一种用于处理衬底的等离子体处理系统。该系统包括能够在处理室内实现等离子体的工艺部件。该系统还包括齿轮驱动组件，用于在处理衬底期间沿线性方向移动工艺部件。

5. 再颁专利

USRE43508E1 Plasma confinement by use of preferred RF return path 有权
标题翻译：通过使用优选的RF返回路径等离子体的限制
公开(公告)号：USRE43508E1
公开(公告)日：2012-07-17
申请号：US11196842
申请日：2005-08-04
申请人： Eric H. Lenz
发明人： Eric H. Lenz
IPC分类号： C23F1/00 , H01L21/306 , C23C16/00
CPC分类号： H01J37/32623 , H01J37/32642
摘要： A confinement assembly for confining a discharge within an interaction space of a plasma processing apparatus comprising a stack of rings and at least one electrically conductive member. The rings are spaced apart from each other to form slots therebetween and are positioned to surround the interaction space. At least one electrically conductive member electrically couples each ring. The electrically conductive member contacts each ring at least at a point inside of the outer circumference of each ring.
摘要翻译：一种用于将放电限制在包括一叠环和至少一个导电构件的等离子体处理装置的相互作用空间内的限制组件。环彼此间隔开以在它们之间形成槽，并且定位成围绕相互作用空间。至少一个导电构件电耦合每个环。导电构件至少在每个环的外周的内侧接触每个环。

6. 发明授权

US07455748B2 Magnetic enhancement for mechanical confinement of plasma 有权
标题翻译：磁力增强用于等离子体的机械约束
公开(公告)号：US07455748B2
公开(公告)日：2008-11-25
申请号：US10600191
申请日：2003-06-20
申请人： Douglas L. Keil , Lumin Li , Eric A. Hudson , Reza Sadjadi , Eric H. Lenz , Rajinder Dhindsa , Ji Soo Kim
发明人： Douglas L. Keil , Lumin Li , Eric A. Hudson , Reza Sadjadi , Eric H. Lenz , Rajinder Dhindsa , Ji Soo Kim
IPC分类号： C23F1/00 , H01L21/306 , C23C16/00
CPC分类号： H01J37/3266 , H01J37/32431 , H01J37/32623
摘要： A plasma processing apparatus for processing a substrate is provided. A plasma processing chamber with chamber walls is provided. A substrate support is provided within the chamber walls. At least one confinement ring is provided, where the confinement ring and the substrate support define a plasma volume. A magnetic source for generating a magnetic field for magnetically enhancing physical confinement provided by the at least one confinement ring is provided.
摘要翻译：提供了一种用于处理衬底的等离子体处理装置。提供具有室壁的等离子体处理室。在室壁内提供衬底支撑件。提供至少一个限制环，其中限制环和衬底支撑件限定等离子体体积。提供了一种用于产生用于磁力增强由至少一个限制环提供的物理限制的磁场的磁源。

7. 发明授权

US6019060A Cam-based arrangement for positioning confinement rings in a plasma processing chamber 失效
标题翻译：用于在等离子体处理室中定位限制环的基于凸轮的布置
公开(公告)号：US6019060A
公开(公告)日：2000-02-01
申请号：US104158
申请日：1998-06-24
申请人： Eric H. Lenz
发明人： Eric H. Lenz
IPC分类号： H01J37/32 , C30C2/00
CPC分类号： H01J37/32623 , Y10S156/915
摘要： A cam-based arrangement configured to move a confinement ring along a first axis of a plasma processing chamber. The confinement ring is disposed in a plane that is orthogonal to the first axis. The cam-based arrangement includes a cam ring having a plurality of cam regions formed on a first surface of the cam ring. There is further included a plurality of cam followers in rolling contact with the first surface of the cam ring. There is also included a plurality of plungers oriented parallel to the first axis, each of the plurality of plungers being coupled to one of the plurality of cam followers and to the confinement ring, wherein the plurality of plungers move in an orchestrated manner parallel to the first axis as the cam ring is rotated and the plurality of cam followers stay in the rolling contact with the first surface of the cam ring.
摘要翻译：一种基于凸轮的装置，其构造成沿着等离子体处理室的第一轴线移动限制环。约束环设置在与第一轴正交的平面中。凸轮的布置包括凸轮环，凸轮环具有形成在凸轮环的第一表面上的多个凸轮区域。还包括与凸轮环的第一表面滚动接触的多个凸轮从动件。还包括多个平行于第一轴定向的柱塞，多个柱塞中的每个柱塞联接到多个凸轮从动件中的一个和限制环，其中多个柱塞以协调的方式平行于当凸轮环旋转时，第一轴线和多个凸轮从动件与凸轮环的第一表面保持滚动接触。

8. 发明授权

US5472565A Topology induced plasma enhancement for etched uniformity improvement 失效
标题翻译：拓扑诱导等离子体增强蚀刻均匀度改善
公开(公告)号：US5472565A
公开(公告)日：1995-12-05
申请号：US153084
申请日：1993-11-17
申请人： Randall S. Mundt , David R. Kerr , Eric H. Lenz
发明人： Randall S. Mundt , David R. Kerr , Eric H. Lenz
IPC分类号： C23F4/00 , H01J37/32 , H01L21/302 , B08B7/00 , C23F1/02
CPC分类号： H01J37/32009 , H01J37/3244 , H01J37/32541 , H01J37/32596
摘要： A plasma discharge electrode having a front surface with a central portion thereof including outlets for discharging reactant gas which forms a plasma and a peripheral portion substantially surrounding the outlets. The peripheral portion has at least one recess for locally enhancing a density of the plasma formed by the electrode. The recess can be formed in a replaceable insert and the electrode can be made from a single crystal of silicon.
摘要翻译：一种具有前表面的等离子体放电电极，其中心部分包括用于排出形成等离子体的反应气体的出口和基本上围绕出口的周边部分。周边部分具有用于局部增强由电极形成的等离子体的密度的至少一个凹部。凹槽可以形成在可替换的插入件中，并且电极可以由单晶硅制成。

9. 发明授权

US08703249B2 Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system 有权
标题翻译：用于降低等离子体处理系统的夹紧环中的电弧相关损伤的技术
公开(公告)号：US08703249B2
公开(公告)日：2014-04-22
申请号：US11201939
申请日：2005-08-10
申请人： Jose Tong , Eric H. Lenz
发明人： Jose Tong , Eric H. Lenz
IPC分类号： H05H1/24
CPC分类号： H01J37/32082 , H01L21/67069 , H01L21/68721
摘要： A clamping ring configured to be coupled to a chamber structure of a plasma processing chamber is disclosed. The clamping ring has a plurality of holes for accommodating a plurality of fasteners. The clamping ring includes a plurality of flanges disposed around an outer periphery of the clamping ring, adjacent flanges of the plurality of flanges being disposed such that a hole of the plurality of holes that is disposed in between the adjacent flanges is about equidistant from the adjacent flanges. The plurality of flanges are configured to mate with the chamber structure. The clamping ring and the flanges are dimensioned such that when the plurality of flanges mate with the chamber structure, recesses between adjacent ones of the plurality of flanges form gaps between the clamping ring and the chamber structure.
摘要翻译：公开了一种构造成耦合到等离子体处理室的室结构的夹紧环。夹紧环具有用于容纳多个紧固件的多个孔。夹紧环包括围绕夹紧环的外周设置的多个凸缘，多个凸缘的相邻凸缘被设置成使得设置在相邻凸缘之间的多个孔的孔距离相邻的凸缘大致等距离法兰。多个凸缘构造成与室结构配合。夹紧环和凸缘的尺寸使得当多个凸缘与室结构配合时，相邻的凸缘之间的凹槽在夹紧环和室结构之间形成间隙。

10. 发明授权

US08562272B2 Substrate load and unload mechanisms for high throughput 有权
标题翻译：衬底加载和卸载机制，用于高吞吐量
公开(公告)号：US08562272B2
公开(公告)日：2013-10-22
申请号：US12706397
申请日：2010-02-16
申请人： Eric H. Lenz
发明人： Eric H. Lenz
IPC分类号： B25J11/00 , B25J9/04 , H01L21/677
CPC分类号： H01L21/67196 , H01L21/6719 , H01L21/67742 , H01L21/67778
摘要： In various exemplary embodiments described herein, a system includes a plurality of carrier arms each having concentrically mounted midpoints between opposing ends of the carrier arms with a wafer carrier mounted on each of the opposing ends of the carrier arms. A hub includes a plurality of concentrically mounted drives where each of the plurality of drives is coupled near the midpoint of a respective one of the plurality of carrier arms. Each of the plurality of drives is configured to be controlled independently of the remaining plurality of concentrically mounted drives. A respective motor is coupled to each of the concentrically mounted drives and is configured to move the coupled carrier arm in a rotary manner. A linear wafer transport mechanism moves wafers to or from select ones of the wafer carriers on the plurality of carrier arms to an easy handoff location for a load/unload robot.
摘要翻译：在本文描述的各种示例性实施例中，系统包括多个承载臂，每个承载臂在承载臂的相对端之间具有同心安装的中点，其中晶片载体安装在承载臂的每个相对端上。集线器包括多个同心安装的驱动器，其中多个驱动器中的每一个驱动器在多个承载臂中的相应一个的臂的中点附近耦合。多个驱动器中的每一个被配置为独立于剩余的多个同心安装的驱动器被控制。相应的电动机联接到每个同心安装的驱动器并且被配置成以旋转方式移动联接的行星架臂。线性晶片传送机构将晶片移动到多个载体臂上的或从选定的晶片载体上移动到用于装载/卸载机器人的简单的切换位置。

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