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    • 1. 发明授权
    • Display device, thin film transistor array substrate and thin film transistor having oxide semiconductor
    • 显示装置,薄膜​​晶体管阵列基板和具有氧化物半导体的薄膜晶体管
    • US08723172B2
    • 2014-05-13
    • US12699058
    • 2010-02-03
    • Fang-An ShuLee-Tyng ChenHenry WangWei-Chou LanTung-Liang Lin
    • Fang-An ShuLee-Tyng ChenHenry WangWei-Chou LanTung-Liang Lin
    • H01L29/10H01L29/12H01L29/04H01L31/00H01L21/00H01L21/16
    • H01L29/7869H01L27/1225
    • A display device including a thin film transistor array substrate, transparent electrode substrate and a display medium layer disposed therebetween is provided. The thin film transistor array substrate includes a plurality of thin film transistors with an oxide semiconductor layer respectively. In each thin film transistor, a gate electrode and a gate insulating layer are disposed on a substrate sequentially and the gate electrode is covered by the gate insulating layer. The oxide semiconductor layer is conformably covering on the gate insulating layer and has a channel region located above the gate electrode. A source electrode and a drain electrode of each thin film transistor are disposed on the oxide semiconductor layer and at one side of the channel region respectively. Since the oxide semiconductor layer is made of transparent material, the patterning process of the oxide semiconductor layer can be omitted during the manufacturing process of the reflective display device. Thus, the cost and time-consumed of manufacturing process of the reflective display device can be reduced.
    • 提供了包括薄膜晶体管阵列基板,透明电极基板和设置在其间的显示介质层的显示装置。 薄膜晶体管阵列基板分别具有多个具有氧化物半导体层的薄膜晶体管。 在每个薄膜晶体管中,栅极电极和栅极绝缘层依次设置在衬底上,并且栅电极被栅极绝缘层覆盖。 氧化物半导体层被顺应地覆盖在栅绝缘层上并且具有位于栅电极上方的沟道区。 每个薄膜晶体管的源电极和漏电极分别设置在氧化物半导体层和沟道区的一侧。 由于氧化物半导体层由透明材料制成,所以在反射式显示装置的制造过程中可以省略氧化物半导体层的构图工艺。 因此,能够降低反射型显示装置的制造工序的成本和耗时。
    • 2. 发明授权
    • Digital X-ray detecting panel and method for manufacturing the same
    • 数字X射线检测面板及其制造方法
    • US08242495B2
    • 2012-08-14
    • US12699033
    • 2010-02-02
    • Fang-An ShuLee-Tyng ChenHenry WangWei-Chou Lan
    • Fang-An ShuLee-Tyng ChenHenry WangWei-Chou Lan
    • H01L29/10H01L29/12H01L27/01H01L27/12
    • H01L31/105H01L27/14659H01L31/1085H01L31/115
    • A digital X-ray detecting panel includes a wavelength transforming layer and a photoelectric detecting plate. The wavelength transforming layer is configured for transforming X-ray into visible light. The photoelectric detecting plate is disposed under the wavelength transforming layer. The photoelectric detecting plate includes a substrate and a number of photoelectric detecting units disposed on the substrate and arranged in an array. Each of the photoelectric detecting units includes a thin film transistor and a photodiode electrically connected to the thin film transistor. The thin film transistor has an oxide semiconductor layer. The digital X-ray detecting panel can avoid a photocurrent in the thin film transistor, and thereby improving detecting accuracy of the digital X-ray detecting panel. A method for manufacturing the digital X-ray detecting panel is also provided.
    • 数字X射线检测面板包括波长转换层和光电检测板。 波长转换层被配置为将X射线转换成可见光。 光电检测板设置在波长转换层的下方。 光电检测板包括基板和设置在基板上并排列成阵列的多个光电检测单元。 每个光电检测单元包括薄膜晶体管和与薄膜晶体管电连接的光电二极管。 薄膜晶体管具有氧化物半导体层。 数字X射线检测面板可以避免薄膜晶体管中的光电流,从而提高数字X射线检测面板的检测精度。 还提供了一种用于制造数字X射线检测面板的方法。
    • 3. 发明授权
    • Method for forming oxide thin film transistor
    • 氧化物薄膜晶体管的形成方法
    • US08748222B2
    • 2014-06-10
    • US12774562
    • 2010-05-05
    • Ted-Hong ShinnHenry WangFang-An ShuYao-Chou Tsai
    • Ted-Hong ShinnHenry WangFang-An ShuYao-Chou Tsai
    • H01L21/00H01L29/786H01L29/10H01L21/34
    • H01L29/78693H01L21/34H01L29/1083H01L29/78609
    • A method for manufacturing oxide thin film transistors includes steps of: forming a gate, a drain electrode, a source electrode, and an oxide semiconductor layer respectively. The oxide semiconductor layer is formed on the gate electrode; the drain electrode and the source electrode are formed at two opposite sides of the oxide semiconductor layer. The method further includes a step of depositing a dielectric layer of silicon oxide, and a reacting gas for depositing the silicon oxide includes silane and nitrous oxide. A flow rate of nitrous oxide is in a range from 10 to 200 standard cubic centimeters per minute (SCCM). Oxide thin film transistors manufactured by above method has advantages of low leakage, high mobility, and other integrated circuit member can be directly formed on the thin film transistor array substrate of a display device.
    • 制造氧化物薄膜晶体管的方法包括以下步骤:分别形成栅极,漏极,源电极和氧化物半导体层。 氧化物半导体层形成在栅电极上; 漏电极和源电极形成在氧化物半导体层的两个相对侧。 该方法还包括沉积氧化硅的介电层的步骤,并且用于沉积氧化硅的反应气体包括硅烷和一氧化二氮。 一氧化二氮的流量在10至200标准立方厘米每分钟(SCCM)的范围内。 通过上述方法制造的氧化物薄膜晶体管具有漏电流低,迁移率高的优点,其他集成电路元件可以直接形成在显示器件的薄膜晶体管阵列基板上。
    • 10. 发明申请
    • SEMICONDUCTOR STRUCTURE
    • 半导体结构
    • US20140021473A1
    • 2014-01-23
    • US13620725
    • 2012-09-15
    • Tzung-Wei YuFang-An ShuYao-Chou TsaiKuan-Yi Lin
    • Tzung-Wei YuFang-An ShuYao-Chou TsaiKuan-Yi Lin
    • H01L29/786
    • H01L29/7869H01L29/78609H01L29/78633
    • A semiconductor structure includes a gate, an oxide channel layer, a gate insulating layer, a source, a drain and a dielectric stacked layer. The oxide channel layer is stacked over the gate, with the gate insulting layer disposed therebetween. The source and the drain are disposed on a side of the oxide channel layer and in parallel to each other. A portion of the oxide channel layer is exposed between the source and the drain. The dielectric stacked layer is disposed on the substrate and includes plural of first inorganic dielectric layers with a first refraction index and plural of second inorganic dielectric layers with a second refraction index that are stacked alternately. At least one of the first inorganic dielectric layers directly covers the source, the drain and the portion of the oxide channel layer. The first refraction index is smaller than the second refraction index.
    • 半导体结构包括栅极,氧化物沟道层,栅极绝缘层,源极,漏极和电介质层叠层。 氧化物沟道层堆叠在栅极上,栅极绝缘层位于它们之间。 源极和漏极设置在氧化物沟道层的一侧并且彼此平行。 氧化物通道层的一部分暴露在源极和漏极之间。 电介质堆叠层设置在基板上,并且包括具有第一折射率的多个第一无机电介质层和交替堆叠的具有第二折射率的多个第二无机电介质层。 第一无机电介质层中的至少一个直接覆盖源极,漏极和氧化物沟道层的部分。 第一折射率小于第二折射率。