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    • 5. 发明申请
    • METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE FILM AND ELECTRICALLY CONDUCTIVE FILM
    • 生产电导膜和电导膜的方法
    • US20160086688A1
    • 2016-03-24
    • US14962441
    • 2015-12-08
    • FUJIFILM Corporation
    • Yushi HONGOMisato SASADAYuuichi HAYATA
    • H01B1/22
    • H01B1/22
    • Provided is a method for producing an electrically conductive film including a coating film forming step of forming a coating film by applying an electrically conductive film forming composition including copper oxide particles, copper particles, and an organic compound having at least one functional group selected from the group consisting of a hydroxy group and an amino group and having a temperature at which a mass reduction rate when the film is heated at a temperature rising rate of 10° C./min is 50% within a range of 120° C. to 350° C. to a resin substrate, and an electrically conductive film forming step of forming an electrically conductive film containing metal copper by performing a heat treatment for heating the coating film to a heating temperature of 140° C. to 400° C. at a temperature rising rate of 30° C./min to 10,000° C./min, and an electrically conductive film.
    • 提供一种导电膜的制造方法,其包括通过涂布含有氧化铜颗粒,铜颗粒和具有至少一个选自下列的官能团的有机化合物的导电膜形成组合物形成涂膜的涂膜形成步骤: 由羟基和氨基组成的组,并且具有以10℃/分钟的升温速度加热薄膜时的质量减少率为120℃至350℃的温度的温度 以及导电膜形成步骤,通过进行用于将涂膜加热至140℃至400℃的加热温度的热处理,形成含有金属铜的导电膜, 升温速度为30℃/分钟至10,000℃/分钟,导电膜。