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    • 1. 发明授权
    • Inspection tool
    • 检验工具
    • US07106434B1
    • 2006-09-12
    • US10628626
    • 2003-07-28
    • Evan R. MapolesRalph Wolf
    • Evan R. MapolesRalph Wolf
    • G01B11/24
    • G01R31/2894G01R31/2893
    • An integrated inspection system adapted to inspect a substrate. A first inspection station performs a first inspection of the substrate at a first resolution, and identifies defect candidate sites. A controller determines position information associated with each of the identified defect candidate sites. A second inspection station performs a second inspection of the defect candidate sites at a second resolution, where the second resolution is higher than the first resolution. A substrate stage moves the substrate between the first inspection station and the second inspection station, and indexes the substrate under both the first inspection station and the second inspection station.
    • 适用于检查基板的综合检查系统。 第一检查站以第一分辨率执行基板的第一次检查,并且识别缺陷候选位置。 控制器确定与所识别的缺陷候选位置中的每一个相关联的位置信息。 第二检查站以第二分辨率执行第二分辨率高于第一分辨率的缺陷候选位置的第二次检查。 衬底台在第一检查站和第二检查站之间移动衬底,并且在第一检查站和第二检查站两者下对衬底进行索引。
    • 2. 发明授权
    • Paintbrush stylus for capacitive touch sensor pad
    • 用于电容式触摸传感器垫的画笔触控笔
    • US5488204A
    • 1996-01-30
    • US324438
    • 1994-10-17
    • Carver A. MeadRalph WolfTimothy P. Allen
    • Carver A. MeadRalph WolfTimothy P. Allen
    • G06F3/023G06F3/033G06F3/041G06F3/044G06F3/048G08C21/00
    • G06F3/04855G06F3/041G06F3/044G06F3/0488G06F3/04883G06F3/04892G06K9/00335
    • A proximity sensor system includes a touch-sensor pad with a sensor matrix array having a characteristic capacitance on horizontal and vertical conductors connected to sensor pads. The capacitance changes as a function of the proximity of an object or objects to the sensor matrix. The change in capacitance of each node in both the X and Y directions of the matrix due to the approach of an object is converted to a set of voltages in the X and Y directions. These voltages are processed by circuitry to develop electrical signals representative of the centroid of the profile of the object, i.e, its position in the X and Y dimensions. Noise reduction and background level setting techniques inherently available in the architecture are employed. A conductive paintbrush-type stylus is used to produce paint-like strokes on a display associated with the touch-sensor pad.
    • 接近传感器系统包括具有传感器矩阵阵列的触摸传感器焊盘,该传感器阵列在连接到传感器焊盘的水平和垂直导体上具有特征电容。 电容根据物体或传感器矩阵的接近度而变化。 由于物体的接近,矩阵的X和Y方向上的每个节点的电容的变化被转换成在X和Y方向上的一组电压。 这些电压由电路处理以产生表示物体轮廓的质心的电信号,即其在X和Y尺寸中的位置。 采用本构架中固有可用的降噪和背景设置技术。 导电画笔型触笔用于在与触摸传感器垫相关联的显示器上产生油漆状笔触。
    • 7. 发明申请
    • Apparatus and methods for optically inspecting a sample for anomalies
    • 用于光学检查样品异常的装置和方法
    • US20050092899A1
    • 2005-05-05
    • US10993473
    • 2004-11-18
    • Ralph WolfEva BenitezDongsheng (Don) ChenJohn GreeneJamie SullivanEric VellaKhiem Vo
    • Ralph WolfEva BenitezDongsheng (Don) ChenJohn GreeneJamie SullivanEric VellaKhiem Vo
    • G01B11/30G01N21/47G01N21/88G01N21/95G01N21/956H01J40/14
    • G01N21/956G01N21/47G01N21/9501
    • Disclosed are methods and apparatus for detecting a relatively wide dynamic range of intensity values from a beam (e.g., scattered light, reflected light, or secondary electrons) originating from a sample, such as a semiconductor wafer. In other words, the inspection system provides detected output signals having wide dynamic ranges. The detected output signals may then be analyzed to determine whether defects are present on the sample. For example, the intensity values from a target die are compared to the intensity values from a corresponding portion of a reference die, where a significant intensity difference may be defined as a defect. In a specific embodiment, an inspection system for detecting defects on a sample is disclosed. The system includes a beam generator for directing an incident beam towards a sample surface and a detector positioned to detect a detected beam originating from the sample surface in response to the incident beam. The detector has a sensor for detecting the detected beam and generating a detected signal based on the detected beam and a non-linear component coupled to the sensor. The non-linear component is arranged to generate a non-linear detected signal based on the detected signal. The detector further includes a first analog-to-digital converter (ADC) coupled to the non-linear component. The first ADC is arranged to digitize the non-linear detected signal into a digitized detected signal.
    • 公开了用于检测来自诸如半导体晶片的样品的光束(例如,散射光,反射光或二次电子)的相对宽的动态范围的方法和装置。 换句话说,检查系统提供检测到的具有宽动态范围的输出信号。 然后可以分析检测到的输出信号,以确定样品中是否存在缺陷。 例如,将来自目标管芯的强度值与来自参考管芯的相应部分的强度值进行比较,其中将显着的强度差定义为缺陷。 在具体实施例中,公开了一种用于检测样品上的缺陷的检查系统。 该系统包括用于将入射光束引向样品表面的光束发生器,以及响应入射光束检测来自样品表面的检测光束的检测器。 检测器具有用于检测检测到的光束并基于检测到的光束产生检测信号的传感器和耦合到传感器的非线性分量。 非线性分量被布置成基于检测到的信号产生非线性检测信号。 检测器还包括耦合到非线性分量的第一模数转换器(ADC)。 第一ADC被布置成将非线性检测信号数字化为数字化的检测信号。
    • 8. 发明授权
    • Particle detection on a patterned or bare wafer surface
    • 在图案或裸晶圆表面上进行粒子检测
    • US5076692A
    • 1991-12-31
    • US531132
    • 1990-05-31
    • Armand P. NeukermansPeter C. JannRalph WolfDavid WolzeStanley Stokowski
    • Armand P. NeukermansPeter C. JannRalph WolfDavid WolzeStanley Stokowski
    • H01L21/66G01N21/94H01L21/027
    • G01N21/94G01N21/4788
    • A method and apparatus for predicting the number of contaminant particles in circuit area of a patterned semiconductor wafer having a number of reflective circuit areas. The method includes forming on a wafer in specified areas, a grating test pattern, such as a line grating. The grating patterns are formed at the same time and in the same manner that repetitive circuit patterns are formed on the wafer. The wafer is then scanned by a light beam. Since the diffraction pattern caused by the grating test patterns is known, it is possible to detect when the light beam is scanning one of the known grating patterns. The diffraction pattern may be inspected for fabrication derived variations. In response to detecting a known grating pattern, a detection mechanism is activated. Since the diffraction pattern is known it may be spatially separated. In this way only light scattered by particles or defects in the pattern are collected and detected. From the scattered light that is collected and detected, a particle count may be determined for the grating pattern area. From this particle count an accurate prediction of the number of particles in the circuit patterns may be made. The apparatus may also inspect bare areas. In this manner real time inspection may be performed on patterned wafers.
    • 一种用于预测具有多个反射电路区域的图案化半导体晶片的电路区域中的污染物颗粒数量的方法和装置。 该方法包括在特定区域的晶片上形成光栅测试图案,例如线光栅。 光栅图案是以与在晶片上形成重复电路图案相同的方式形成的。 然后通过光束扫描晶片。 由于由光栅测试图案引起的衍射图案是已知的,因此可以检测光束何时扫描已知光栅图案之一。 可以检查衍射图案以进行制造衍生的变化。 响应于检测到已知的光栅图案,检测机构被激活。 由于衍射图案是已知的,它可以在空间上分离。 以这种方式,仅收集并检测由图案中的颗粒或缺陷散射的光。 从收集和检测的散射光中,可以确定光栅图案区域的粒子数。 从该粒子计数可以进行电路图案中的粒子数量的准确预测。 该设备还可以检查裸露的区域。 以这种方式,可以对图案化的晶片进行实时检查。