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    • 1. 发明申请
    • Apparatus and methods for optically inspecting a sample for anomalies
    • 用于光学检查样品异常的装置和方法
    • US20050092899A1
    • 2005-05-05
    • US10993473
    • 2004-11-18
    • Ralph WolfEva BenitezDongsheng (Don) ChenJohn GreeneJamie SullivanEric VellaKhiem Vo
    • Ralph WolfEva BenitezDongsheng (Don) ChenJohn GreeneJamie SullivanEric VellaKhiem Vo
    • G01B11/30G01N21/47G01N21/88G01N21/95G01N21/956H01J40/14
    • G01N21/956G01N21/47G01N21/9501
    • Disclosed are methods and apparatus for detecting a relatively wide dynamic range of intensity values from a beam (e.g., scattered light, reflected light, or secondary electrons) originating from a sample, such as a semiconductor wafer. In other words, the inspection system provides detected output signals having wide dynamic ranges. The detected output signals may then be analyzed to determine whether defects are present on the sample. For example, the intensity values from a target die are compared to the intensity values from a corresponding portion of a reference die, where a significant intensity difference may be defined as a defect. In a specific embodiment, an inspection system for detecting defects on a sample is disclosed. The system includes a beam generator for directing an incident beam towards a sample surface and a detector positioned to detect a detected beam originating from the sample surface in response to the incident beam. The detector has a sensor for detecting the detected beam and generating a detected signal based on the detected beam and a non-linear component coupled to the sensor. The non-linear component is arranged to generate a non-linear detected signal based on the detected signal. The detector further includes a first analog-to-digital converter (ADC) coupled to the non-linear component. The first ADC is arranged to digitize the non-linear detected signal into a digitized detected signal.
    • 公开了用于检测来自诸如半导体晶片的样品的光束(例如,散射光,反射光或二次电子)的相对宽的动态范围的方法和装置。 换句话说,检查系统提供检测到的具有宽动态范围的输出信号。 然后可以分析检测到的输出信号,以确定样品中是否存在缺陷。 例如,将来自目标管芯的强度值与来自参考管芯的相应部分的强度值进行比较,其中将显着的强度差定义为缺陷。 在具体实施例中,公开了一种用于检测样品上的缺陷的检查系统。 该系统包括用于将入射光束引向样品表面的光束发生器,以及响应入射光束检测来自样品表面的检测光束的检测器。 检测器具有用于检测检测到的光束并基于检测到的光束产生检测信号的传感器和耦合到传感器的非线性分量。 非线性分量被布置成基于检测到的信号产生非线性检测信号。 检测器还包括耦合到非线性分量的第一模数转换器(ADC)。 第一ADC被布置成将非线性检测信号数字化为数字化的检测信号。
    • 7. 发明授权
    • Electro-optic interconnect circuit board
    • 电光互连电路板
    • US06795624B2
    • 2004-09-21
    • US10352472
    • 2003-01-28
    • Randy W. WickmanGary P. O'ConnorJohn GreeneDaniel C. MansurDavid Barneson
    • Randy W. WickmanGary P. O'ConnorJohn GreeneDaniel C. MansurDavid Barneson
    • G02B643
    • G02B6/4249G02B6/4201G02B6/4224G02B6/423
    • A method and apparatus are provided for aligning a plurality of transmission paths of an array of optical devices with a plurality of optical fibers. The method includes the steps of disposing the optical array on a first side of the transparent substrate with the plurality of optical transmission paths passing directly through the substrate, disposing a signal processor on the first side of the transparent substrate adjacent the array of optical devices, disposing a set of alignment guides on a second side of the transparent substrate parallel to the plurality of transmission paths for aligning the plurality of optical fibers with the plurality of transmission paths and coupling a plurality of signals processed by the processor through the plurality of transmission paths between the optical array and plurality of optical fibers.
    • 提供了一种用于将光学器件阵列的多个传输路径与多根光纤对准的方法和装置。 该方法包括以下步骤:将多个光传输路径直接穿过基板,在透明基板的第一侧上设置光学阵列,在与该光学器件阵列相邻的透明基板的第一侧上设置信号处理器, 在所述多个传输路径平行于所述透明基板的第二侧设置一组对准引导件,用于使所述多个光纤与所述多个传输路径对准,并且通过所述多个传输路径耦合由所述处理器处理的多个信号 在光学阵列和多个光纤之间。