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    • 1. 发明授权
    • CMOS image sensor having anti-absorption layer
    • CMOS图像传感器具有抗吸收层
    • US08629486B2
    • 2014-01-14
    • US13171946
    • 2011-06-29
    • Jung-chak AhnEun-sub ShimBum-suk KimKyung-ho Lee
    • Jung-chak AhnEun-sub ShimBum-suk KimKyung-ho Lee
    • H01L27/146
    • H01L27/1462H01L27/14625H01L27/1464H01L27/14645H01L27/14685H01L31/02161H01L31/1868Y02E10/50
    • A complementary metal-oxide-semiconductor (CMOS) image sensor, including a wiring layer, a photodiode stacked with the wiring layer, a micro-lens stacked on the photodiode, an anti-reflection layer stacked on the photodiode. An anti-absorption layer may be provided between the photodiode and the anti-reflection layer. The photodiode may include a first portion and a second portion. Light may be focused on the first portion by the micro-lens and the second portion may at least partially surround the first portion. A material of the first portion may have a refractive index higher than a refractive index of a material of the second portion. The anti-absorption layer may include a compound semiconductor having an energy band gap greater than an energy band gap of a semiconductor included in the photodiode.
    • 包括布线层的互补金属氧化物半导体(CMOS)图像传感器,堆叠有布线层的光电二极管,堆叠在光电二极管上的微透镜,堆叠在光电二极管上的抗反射层。 可以在光电二极管和抗反射层之间设置抗吸收层。 光电二极管可以包括第一部分和第二部分。 光可以通过微透镜聚焦在第一部分上,并且第二部分可以至少部分地围绕第一部分。 第一部分的材料可以具有比第二部分的材料的折射率高的折射率。 抗吸收层可以包括具有比包含在光电二极管中的半导体的能带隙大的能带隙的化合物半导体。
    • 2. 发明授权
    • Backside illuminated active pixel sensor array and backside illuminated image sensor including the same
    • 背面照明的有源像素传感器阵列和背面照明的图像传感器包括它们
    • US08508013B2
    • 2013-08-13
    • US13252560
    • 2011-10-04
    • Eun-sub ShimJung-chak AhnBum-suk KimKyung-ho Lee
    • Eun-sub ShimJung-chak AhnBum-suk KimKyung-ho Lee
    • H01L21/00
    • H01L27/14683H01L27/14621H01L27/14627H01L27/1463H01L27/1464H01L27/14687
    • A backside-illuminated active pixel sensor array in which crosstalk between adjacent pixels is prevented, a method of manufacturing the backside-illuminated active pixel sensor array, and a backside-illuminated image sensor including the backside-illuminated active pixel sensor array are provided. The backside-illuminated active pixel sensor array includes a semiconductor substrate of a first conductive type that comprises a front surface and a rear surface, light-receiving devices for generating charges in response to light incident via the rear surface, and one or more pixel isolating layers for forming boundaries between pixels by being disposed between the adjacent light-receiving devices, a wiring layer disposed on the front surface of the semiconductor substrate, and a light filter layer disposed on the rear surface of the semiconductor substrate, wherein a thickness of the one or more pixel isolating layers decreases from a point in the semiconductor substrate toward the rear surface.
    • 提供一种其中防止相邻像素之间的串扰的背面照明的有源像素传感器阵列,制造背面照射的有源像素传感器阵列的方法以及包括背面照射的有源像素传感器阵列的背面照明的图像传感器。 背面照明有源像素传感器阵列包括第一导电类型的半导体衬底,其包括前表面和后表面,用于响应于经由后表面入射的光而产生电荷的光接收装置,以及一个或多个像素隔离 通过配置在相邻的光接收装置之间形成像素之间的边界的层,设置在半导体衬底的前表面上的布线层和设置在半导体衬底的后表面上的滤光层, 一个或多个像素隔离层从半导体衬底中的一个点向后表面减小。