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1. 发明申请

US20140001611A1 SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：半导体封装
公开(公告)号：US20140001611A1
公开(公告)日：2014-01-02
申请号：US13613797
申请日：2012-09-13
申请人： Eun Jung Jo , Jae Hyun Lim , Tae Hyun Kim , Young Ho Sohn
发明人： Eun Jung Jo , Jae Hyun Lim , Tae Hyun Kim , Young Ho Sohn
IPC分类号： H01L23/495
CPC分类号： H01L23/49531 , H01L23/49537 , H01L23/49575 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/48472 , H01L2224/49171 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2924/00014 , H01L2224/49111
摘要： There is provided a semiconductor package capable of significantly reducing a size of a power semiconductor package including a power semiconductor device and a control device. The semiconductor package includes a lead frame including a first frame and a second frame; at least one first electronic device mounted on the first frame; a substrate engaged with the second frame and having one surface on which a wiring pattern is formed; and at least one second electronic device mounted on the substrate and electrically connected to the wiring pattern, a portion of the wiring pattern electrically connected to the at least one second electronic device being formed to have a line width smaller than an internal lead of the lead frame.
摘要翻译：提供了能够显着地减小包括功率半导体器件和控制装置的功率半导体封装的尺寸的半导体封装。所述半导体封装包括引线框架，所述引线框架包括第一框架和第二框架; 安装在第一框架上的至少一个第一电子装置; 基板，与所述第二框架接合并且具有形成有布线图案的一个表面; 以及安装在所述基板上并电连接到所述布线图案的至少一个第二电子设备，所述布线图案的电连接到所述至少一个第二电子设备的部分形成为具有小于所述引线的内部引线的线宽帧。

2. 发明申请

US20130001759A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：半导体封装和制造半导体封装的方法
公开(公告)号：US20130001759A1
公开(公告)日：2013-01-03
申请号：US13614555
申请日：2012-09-13
申请人： Tae Hyun Kim , Eun Jung Jo , Jae Hyun Lim , Joon Seok Chae , Young Ho Sohn
发明人： Tae Hyun Kim , Eun Jung Jo , Jae Hyun Lim , Joon Seok Chae , Young Ho Sohn
IPC分类号： H01L23/495 , H01L21/58
CPC分类号： H01L23/49537 , H01L23/3107 , H01L23/36 , H01L23/49562 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/291 , H01L2224/29139 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2924/01029 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00012 , H01L2924/014
摘要： Disclosed herein is a semiconductor package including: first power device; second power device formed in an upper portion of the first power device; a first lead frame formed in a lower portion of the first power device; a second lead frame formed in the upper portion of the first power device and a lower portion of the second power device; a third lead frame formed in an upper portion of the second power device; a fourth lead frame electrically connected to at least one of the power device and the second power device; and a sealing substance exposing a part of the first through fourth lead frames and sealing the other parts thereof.
摘要翻译：本文公开了一种半导体封装，包括：第一功率器件; 第二动力装置，形成在所述第一动力装置的上部; 形成在所述第一功率器件的下部的第一引线框架; 形成在第一功率器件的上部的第二引线框架和第二功率器件的下部; 第三引线框架，形成在所述第二电力设备的上部; 电连接到所述功率器件和所述第二功率器件中的至少一个的第四引线框架; 以及暴露第一至第四引线框架的一部分并密封其它部分的密封材料。

3. 发明授权

US09153514B2 Power module package 有权
标题翻译：电源模块封装
公开(公告)号：US09153514B2
公开(公告)日：2015-10-06
申请号：US13610680
申请日：2012-09-11
申请人： Young Ho Sohn , Young Hoon Kwak , Jong Man Kim , Kyu Hwan Oh , Tae Hyun Kim
发明人： Young Ho Sohn , Young Hoon Kwak , Jong Man Kim , Kyu Hwan Oh , Tae Hyun Kim
IPC分类号： H01L29/72 , H01L23/31 , H01L23/373 , H01L23/433 , H01L23/495
CPC分类号： H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one surface of the first substrate; a third substrate contacting one side of the other surface of the first substrate; a first lead frame contacting the other side of the other surface of the first substrate; and a second lead frame electrically connected to the third substrate.
摘要翻译：本文公开了一种功率模块封装，包括：具有一个表面和另一个表面的第一基板; 第二基板，与第一基板的一个表面接触; 第三基板，其接触所述第一基板的另一表面的一侧; 与所述第一基板的另一表面的另一侧接触的第一引线框架; 以及电连接到第三基板的第二引线框架。

4. 发明申请

US20110042699A1 Substrate for light emitting diode package and light emitting diode package having the same 审中-公开
标题翻译：用于发光二极管封装的衬底和具有该发光二极管封装的发光二极管封装
公开(公告)号：US20110042699A1
公开(公告)日：2011-02-24
申请号：US12654431
申请日：2009-12-18
申请人： Sung Keun Park , Seog Moon Choi , Young Ho Sohn , Tae Hyun Kim , Young Ki Lee
发明人： Sung Keun Park , Seog Moon Choi , Young Ho Sohn , Tae Hyun Kim , Young Ki Lee
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L24/97 , H01L33/60 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/4848 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014 , H01L2924/00 , H01L2224/48465
摘要： A substrate for a light emitting diode (LED) package, and an LED package having the same are disclosed. The substrate for an LED package includes: a metal plate; an insulation oxide layer formed on a portion of the surface of the metal plate; a first conductive pattern formed at one region of the insulation oxide layer and providing a light emitting diode mounting area; and a second conductive pattern formed at another region of the insulation oxide layer such that it is separated from the first conductive pattern. In the substrate for an LED package, because regions of the insulation oxide layer other than regions for insulating conductive patterns are removed, heat generated from the light emitting diode can be effectively released. In addition, degradation of reflexibility and luminance of the LED due to the insulation oxide layer can be prevented.
摘要翻译：公开了一种用于发光二极管（LED）封装的衬底和具有该衬底的LED封装。用于LED封装的衬底包括：金属板; 绝缘氧化物层，形成在所述金属板的所述表面的一部分上; 形成在所述绝缘氧化物层的一个区域并提供发光二极管安装区域的第一导电图案; 以及形成在所述绝缘氧化物层的另一区域处的第二导电图案，使得其与所述第一导电图案分离。在LED封装用基板中，除去绝缘性导电图案以外的绝缘氧化物层的区域，能够有效地释放从发光二极管产生的热量。此外，可以防止由于绝缘氧化物层导致的LED的反射性和亮度的劣化。

5. 发明授权

US08570797B2 Magnetic random access memory (MRAM) read with reduced disturb failure 有权
标题翻译：磁性随机存取存储器（MRAM）以减少的干扰故障读取
公开(公告)号：US08570797B2
公开(公告)日：2013-10-29
申请号：US13035006
申请日：2011-02-25
申请人： Jung Pill Kim , Tae Hyun Kim , Kangho Lee
发明人： Jung Pill Kim , Tae Hyun Kim , Kangho Lee
IPC分类号： G11C11/14
CPC分类号： G11C11/1673 , G11C11/1693
摘要： Magnetic tunnel junctions (MTJs) in magnetic random access memory (MRAM) are subject to read disturb events when the current passing through the MTJ causes a spontaneous switching of the MTJ due to spin transfer torque (STT) from a parallel state to an anti-parallel state or from an anti-parallel state to a parallel state. Because the state of the MTJ corresponds to stored data, a read disturb event may cause data loss in MRAM devices. Read disturb events may be reduced by controlling the direction of current flow through the MTJ. For example, the current direction through a reference MTJ may be selected based on the state of the reference MTJ. In another example, the current direction through a data or reference MTJ may be alternated such that the MTJ is only subject to read disturb events during approximately half the read operations on the MTJ.
摘要翻译：磁流体随机存取存储器（MRAM）中的磁隧道结（MTJ）在经过MTJ的电流导致由于自旋转移转矩（STT）从平行状态到抗反射的MTJ自发切换时，受到读取干扰事件，平行状态或从反平行状态到并行状态。因为MTJ的状态对应于存储的数据，读取干扰事件可能导致MRAM设备中的数据丢失。通过控制通过MTJ的电流的方向可以减少读取干扰事件。例如，可以基于参考MTJ的状态来选择通过参考MTJ的当前方向。在另一示例中，可以交替通过数据或参考MTJ的当前方向，使得MTJ仅在MTJ上的大约一半的读取操作期间经受读取干扰事件。

6. 发明授权

US08526266B2 Row-decoder circuit and method with dual power systems 有权
标题翻译：具有双电源系统的行解码器电路和方法
公开(公告)号：US08526266B2
公开(公告)日：2013-09-03
申请号：US13032979
申请日：2011-02-23
申请人： Jung Pill Kim , Tae Hyun Kim , Seung H. Kang
发明人： Jung Pill Kim , Tae Hyun Kim , Seung H. Kang
IPC分类号： G11C8/00
CPC分类号： G11C11/1653 , G11C8/08 , G11C8/10 , G11C11/1657 , G11C11/1659 , G11C11/1673 , G11C11/1675 , G11C11/1693
摘要： A Spin-Transfer-Torque Magnetic Random Access Memory includes a dual-voltage row decoder with charge sharing for read operations. The dual-voltage row decoder with charge sharing for read operations reduces read-disturbance failure rates and provides a robust macro design with improved yields. Voltage from one of the power supplies can be applied during a write operation.
摘要翻译：旋转转矩磁性随机存取存储器包括具有用于读取操作的电荷共享的双电压行解码器。具有用于读取操作的电荷共享的双电压行解码器可降低读取干扰故障率，并提供强大的宏设计，提高产量。在写入操作期间可以应用来自其中一个电源的电压。

7. 发明授权

US08406072B2 System and method of reference cell testing 有权
标题翻译：参考细胞测试的系统和方法
公开(公告)号：US08406072B2
公开(公告)日：2013-03-26
申请号：US12861259
申请日：2010-08-23
申请人： Jung Pill Kim , Tae Hyun Kim , Hari M. Rao
发明人： Jung Pill Kim , Tae Hyun Kim , Hari M. Rao
IPC分类号： G11C29/00
CPC分类号： G11C7/062 , G06F17/50 , G11C11/16 , G11C29/24
摘要： Systems and methods of testing a reference cell in a memory array are disclosed. In a particular embodiment, a method of testing a reference cell in a memory array includes coupling a first reference cell of a first reference cell pair of the memory array to a first input of a first sense amplifier of the memory array. The method also includes providing a reference signal to a second input of the first sense amplifier. The reference signal is associated with a second reference cell pair of the memory array.
摘要翻译：公开了测试存储器阵列中的参考单元的系统和方法。在特定实施例中，测试存储器阵列中的参考单元的方法包括将存储器阵列的第一参考单元对的第一参考单元与存储器阵列的第一读出放大器的第一输入相耦合。该方法还包括向第一读出放大器的第二输入提供参考信号。参考信号与存储器阵列的第二参考单元对相关联。

8. 发明授权

US07910847B2 Switchgear apparatus 有权
标题翻译：开关装置
公开(公告)号：US07910847B2
公开(公告)日：2011-03-22
申请号：US12853930
申请日：2010-08-10
申请人： Osamu Takahara , Tae Hyun Kim , Tomotaka Yano , Akihiko Imagi
发明人： Osamu Takahara , Tae Hyun Kim , Tomotaka Yano , Akihiko Imagi
IPC分类号： H01H1/64
CPC分类号： H01H3/60 , H01H33/38 , H01H33/666
摘要： A switchgear apparatus is provided in which an impact induced by a close operation is mitigated, featuring space saving and high reliability with low costs.The switchgear apparatus includes a switching unit 3 that is composed of a fixed electrode 1 and a movable electrode 2; a movable shaft 4 that is extended from the movable electrode 2; an operating mechanism 5 that produces driving force and transfers the driving force to the movable shaft 4; a switching-unit holder 6 that holds the switching unit 3 and the movable shaft 4 thereinside; and a holder supporting unit 7 that has a fixing plane so as to fix the switching-unit holder 6 thereonto. The switchgear apparatus is arranged in such a manner that the holder supporting unit 7 serving as the fixing plane is constituted of a plurality of plates layered in the axial direction along the movable shaft 4. In a case of the close operation, because kinetic energy in the overall system is consumed by the friction generated between the layered plates owing to distortion of the layered plates, energy that allows the movable electrode 2 to bounce back and forth is lowered, so that it is possible to shorten a chattering time.
摘要翻译：提供了一种开关装置，其中减轻了由紧密操作引起的冲击，具有节省空间并且具有低成本的高可靠性。开关装置包括由固定电极1和可动电极2构成的开关单元3; 从可动电极2延伸的可动轴4; 产生驱动力并将驱动力传递到可动轴4的操作机构5; 切换单元保持器6，其将切换单元3和可动轴4保持在其内部; 以及具有固定平面以将切换单元保持器6固定在其上的保持器支撑单元7。开关装置的设置方式是，作为固定平面的保持器支撑单元7由沿着可动轴4的轴向层叠的多个板构成。在紧密操作的情况下，由于动能由于层叠板的变形，整体系统被层压板之间产生的摩擦所消耗，使得可动电极2来回弹性的能量降低，从而可以缩短抖动时间。

9. 发明授权

US07812273B2 Switchgear apparatus 有权
标题翻译：开关装置
公开(公告)号：US07812273B2
公开(公告)日：2010-10-12
申请号：US11835690
申请日：2007-08-08
申请人： Osamu Takahara , Tae Hyun Kim , Tomotaka Yano , Akihiko Imagi
发明人： Osamu Takahara , Tae Hyun Kim , Tomotaka Yano , Akihiko Imagi
IPC分类号： H01H1/64
CPC分类号： H01H3/60 , H01H33/38 , H01H33/666
摘要： A switchgear apparatus is provided in which an impact induced by a close operation is mitigated, featuring space saving and high reliability with low costs.The switchgear apparatus includes a switching unit 3 that is composed of a fixed electrode 1 and a movable electrode 2; a movable shaft 4 that is extended from the movable electrode 2; an operating mechanism 5 that produces driving force and transfers the driving force to the movable shaft 4; a switching-unit holder 6 that holds the switching unit 3 and the movable shaft 4 thereinside; and a holder supporting unit 7 that has a fixing plane so as to fix the switching-unit holder 6 thereonto. The switchgear apparatus is arranged in such a manner that the holder supporting unit 7 serving as the fixing plane is constituted of a plurality of plates layered in the axial direction along the movable shaft 4. In a case of the close operation, because kinetic energy in the overall system is consumed by the friction generated between the layered plates owing to distortion of the layered plates, energy that allows the movable electrode 2 to bounce back and forth is lowered, so that it is possible to shorten a chattering time.
摘要翻译：提供了一种开关装置，其中减轻了由紧密操作引起的冲击，具有节省空间并且具有低成本的高可靠性。开关装置包括由固定电极1和可动电极2构成的开关单元3; 从可动电极2延伸的可动轴4; 产生驱动力并将驱动力传递到可动轴4的操作机构5; 切换单元保持器6，其将切换单元3和可动轴4保持在其内部; 以及具有固定平面以将切换单元保持器6固定在其上的保持器支撑单元7。开关装置的设置方式是，作为固定平面的保持器支撑单元7由沿着可动轴4的轴向层叠的多个板构成。在紧密操作的情况下，由于动能由于层叠板的变形，整体系统被层压板之间产生的摩擦所消耗，使得可动电极2来回弹性的能量降低，从而可以缩短抖动时间。

10. 发明授权

US07633287B2 Current sensor 有权
标题翻译：电流传感器
公开(公告)号：US07633287B2
公开(公告)日：2009-12-15
申请号：US12255783
申请日：2008-10-22
申请人： Ryuichi Nishiura , Yo Makita , Hiroshi Nishizawa , Tadahiro Yoshida , Tae Hyun Kim
发明人： Ryuichi Nishiura , Yo Makita , Hiroshi Nishizawa , Tadahiro Yoshida , Tae Hyun Kim
IPC分类号： G01R15/18 , G01R1/20 , G01R15/20 , G01R19/20
CPC分类号： H01F3/10 , H01F3/14 , H01F17/0033 , H01F27/346 , H01F30/16 , H01F38/30 , H01F2027/2814
摘要： A core is divided by alternately arranging plural magnetic material portions and plural non-magnetic material portions in a circumferential direction of the core through which a primary conductor penetrates. A conductor is wound around the core under conditions in which each core cross section of the core intersects the magnetic material portion and the non-magnetic material portion, each core cross section including a cut end surface of each conductor of a secondary winding wound around the core, and a ratio of a magnetic material portion cross-sectional area of the magnetic material portion to a non-magnetic material portion cross-sectional area of the non-magnetic material portion at the core cross section is kept constant at each core cross section.
摘要翻译：通过在芯的圆周方向上交替布置多个磁性材料部分和多个非磁性材料部分来分割芯体，初级导体穿过芯部。在核心的每个芯横截面与磁性材料部分和非磁性材料部分相交的条件下，导体缠绕在芯体周围，每个芯部横截面包括缠绕在第二绕组上的次级绕组的每个导体的切割端面磁芯部分的磁性材料部分横截面积与芯部横截面处的非磁性材料部分的非磁性材料部分横截面积的比率在每个芯部横截面保持恒定。

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