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1. 发明授权

US09412727B2 Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion 有权
标题翻译：使用具有压力调节的可逆粘合的微结构弹性体表面印刷可转印部件
公开(公告)号：US09412727B2
公开(公告)日：2016-08-09
申请号：US13237375
申请日：2011-09-20
申请人： Etienne Menard , John A. Rogers , Seok Kim , Andrew Carlson
发明人： Etienne Menard , John A. Rogers , Seok Kim , Andrew Carlson
IPC分类号： B29C59/02 , H01L21/683 , H01L25/00 , H01L23/482
CPC分类号： H01L21/67132 , B32B9/005 , B32B37/025 , B32B37/16 , B32B41/00 , B32B2313/00 , B32B2457/14 , B41F16/00 , H01L21/67144 , H01L21/6835 , H01L23/4821 , H01L25/50 , H01L2221/68368 , H01L2221/68381 , H01L2224/32145 , H01L2224/83192
摘要： In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.
摘要翻译：在印刷可转印部件的方法中，包括具有从其表面突出的三维浮雕特征的弹性体柱的印模被压制在供体基板上的部件上，该第一压力足以使浮雕特征机械地变形，并且位于浮雕特征之间的柱的区域，以在第一接触区域上接触部件。印模从供体基板缩回，使得该部件粘附到印模上。包括附着在其上的部件的印模被压在接受基板上，第二压力小于在小于第一接触面积的第二接触面积上接触部件的第一压力。然后将印模从接收基板缩回以从印模分离该部件并将该部件打印到接收基板上。还讨论了相关装置和邮票。

2. 发明申请

US20130069275A1 PRINTING TRANSFERABLE COMPONENTS USING MICROSTRUCTURED ELASTOMERIC SURFACES WITH PRESSURE MODULATED REVERSIBLE ADHESION 有权
标题翻译：使用压力调节可逆粘合的微结构弹性表面印刷可转移组分
公开(公告)号：US20130069275A1
公开(公告)日：2013-03-21
申请号：US13237375
申请日：2011-09-20
申请人： Etienne Menard , John A. Rogers , Seok Kim , Andrew Carlson
发明人： Etienne Menard , John A. Rogers , Seok Kim , Andrew Carlson
IPC分类号： B29C59/02
CPC分类号： H01L21/67132 , B32B9/005 , B32B37/025 , B32B37/16 , B32B41/00 , B32B2313/00 , B32B2457/14 , B41F16/00 , H01L21/67144 , H01L21/6835 , H01L23/4821 , H01L25/50 , H01L2221/68368 , H01L2221/68381 , H01L2224/32145 , H01L2224/83192
摘要： In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.
摘要翻译：在印刷可转印组件的方法中，包括具有从其表面突出的三维浮雕特征的弹性体柱的印模被压制在供体基板上的部件上，该第一压力足以使浮雕特征机械地变形，并且位于浮雕特征之间的柱的区域，以在第一接触区域上接触部件。印模从供体基板缩回，使得该部件粘附到印模上。包括附着在其上的部件的印模被压在接受基板上，第二压力小于在小于第一接触面积的第二接触面积上接触部件的第一压力。然后将印模从接收基板缩回以从印模分离该部件并将该部件打印到接收基板上。还讨论了相关装置和邮票。

3. 发明授权

US08729524B2 Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics 有权
标题翻译：半导体互连中的受控弯曲结构和用于可拉伸电子学的纳米膜
公开(公告)号：US08729524B2
公开(公告)日：2014-05-20
申请号：US13441598
申请日：2012-04-06
申请人： John A. Rogers , Matthew Meitl , Yugang Sun , Heung Cho Ko , Andrew Carlson , Won Mook Choi , Mark Stoykovich , Hanqing Jiang , Yonggang Huang , Ralph G. Nuzzo , Zhengtao Zhu , Etienne Menard , Dahl-Young Khang
发明人： John A. Rogers , Matthew Meitl , Yugang Sun , Heung Cho Ko , Andrew Carlson , Won Mook Choi , Mark Stoykovich , Hanqing Jiang , Yonggang Huang , Ralph G. Nuzzo , Zhengtao Zhu , Etienne Menard , Dahl-Young Khang
IPC分类号： H01L29/72
CPC分类号： H01L29/72 , H01L21/02422 , H01L21/02628 , H01L21/4846 , H01L21/8258 , H01L23/5387 , H01L27/12 , H01L29/0657 , H01L2924/12041 , H01L2924/13091 , H05K1/0283 , H05K3/20 , H05K3/22 , H05K2201/0133 , H05K2201/09045 , H05K2203/0271 , H01L2924/00
摘要： In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
摘要翻译：一方面，本发明提供了拉伸，压缩，弯曲或其它变形时能够提供良好性能的可拉伸和可选择的可印刷的部件，例如半导体和电子电路，以及制造或调谐这种可拉伸部件的相关方法。对于一些应用而言，优选的可拉伸半导体和电子电路除了是可拉伸的之外是柔性的，因此能够沿着一个或多个轴显着地伸长，弯曲，弯曲或其它变形。此外，本发明的可拉伸半导体和电子电路适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

4. 发明授权

US08217381B2 Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics 有权
标题翻译：半导体互连中的受控弯曲结构和用于可拉伸电子学的纳米膜
公开(公告)号：US08217381B2
公开(公告)日：2012-07-10
申请号：US11851182
申请日：2007-09-06
申请人： John A. Rogers , Matthew Meitl , Yugang Sun , Heung Cho Ko , Andrew Carlson , Won Mook Choi , Mark Stoykovich , Hanqing Jiang , Yonggang Huang , Ralph G. Nuzzo , Keon Jae Lee , Zhengtao Zhu , Etienne Menard , Dahl-Young Khang , Seong Jun Kang , Jong Hyun Ahn , Hoon-sik Kim
发明人： John A. Rogers , Matthew Meitl , Yugang Sun , Heung Cho Ko , Andrew Carlson , Won Mook Choi , Mark Stoykovich , Hanqing Jiang , Yonggang Huang , Ralph G. Nuzzo , Keon Jae Lee , Zhengtao Zhu , Etienne Menard , Dahl-Young Khang , Seong Jun Kang , Jong Hyun Ahn , Hoon-sik Kim
IPC分类号： H01L29/72
CPC分类号： H01L29/72 , H01L21/02422 , H01L21/02628 , H01L21/4846 , H01L21/8258 , H01L23/5387 , H01L27/12 , H01L29/0657 , H01L2924/12041 , H01L2924/13091 , H05K1/0283 , H05K3/20 , H05K3/22 , H05K2201/0133 , H05K2201/09045 , H05K2203/0271 , H01L2924/00
摘要： In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
摘要翻译：一方面，本发明提供了拉伸，压缩，弯曲或其它变形时能够提供良好性能的可拉伸和可选择的可印刷的部件，例如半导体和电子电路，以及制造或调谐这种可拉伸部件的相关方法。对于一些应用而言，优选的可拉伸半导体和电子电路除了是可拉伸的之外是柔性的，因此能够沿着一个或多个轴显着地伸长，弯曲，弯曲或其它变形。此外，本发明的可拉伸半导体和电子电路适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

5. 发明授权

US07943491B2 Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp 有权
标题翻译：图案转印通过动态控制粘附到弹性印章上
公开(公告)号：US07943491B2
公开(公告)日：2011-05-17
申请号：US11423192
申请日：2006-06-09
申请人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
IPC分类号： H01L29/72
CPC分类号： H01L29/0665 , B82Y10/00 , B82Y20/00 , H01L29/0673 , H01L29/1606 , H01L29/78603 , H01L31/035281 , H01L31/0392 , H01L31/03925 , H01L31/072 , H01L31/109 , H01L31/18 , H01L31/1804 , H01L31/1892 , H01L2924/12041 , H01L2924/13091 , Y02E10/547 , Y02P70/521 , H01L2924/00
摘要： The present invention provides methods, systems and system components for transferring, assembling and integrating features and arrays of features having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods of the present invention utilize principles of ‘soft adhesion’ to guide the transfer, assembly and/or integration of features, such as printable semiconductor elements or other components of electronic devices. Methods of the present invention are useful for transferring features from a donor substrate to the transfer surface of an elastomeric transfer device and, optionally, from the transfer surface of an elastomeric transfer device to the receiving surface of a receiving substrate. The present methods and systems provide highly efficient, registered transfer of features and arrays of features, such as printable semiconductor element, in a concerted manner that maintains the relative spatial orientations of transferred features.
摘要翻译：本发明提供用于传送，组装和集成特征的阵列的方法，系统和系统组件，其具有所选择的纳米尺寸和/或微尺寸的物理尺寸，形状和空间取向。本发明的方法利用“软粘附”的原理来引导诸如可印刷半导体元件或电子器件的其它部件的特征的转移，组装和/或集成。本发明的方法可用于将特征从供体基底转移到弹性体转移装置的转移表面，并且可选地从弹性体转移装置的转移表面转移到接收基底的接收表面。本方法和系统以一致的方式提供特征和特征阵列的高效，注册传输，例如可印刷半导体元件，其保持所传送特征的相对空间取向。

6. 发明授权

US07932123B2 Release strategies for making transferable semiconductor structures, devices and device components 有权
标题翻译：制定可转移半导体结构，器件和器件组件的策略
公开(公告)号：US07932123B2
公开(公告)日：2011-04-26
申请号：US11858788
申请日：2007-09-20
申请人： John A. Rogers , Ralph G. Nuzzo , Matthew Meitl , Heung Cho Ko , Jongseung Yoon , Etienne Menard , Alfred J. Baca
发明人： John A. Rogers , Ralph G. Nuzzo , Matthew Meitl , Heung Cho Ko , Jongseung Yoon , Etienne Menard , Alfred J. Baca
IPC分类号： H01L21/00 , H01L21/31
CPC分类号： H01L31/0735 , B81C1/0046 , B81C2201/0191 , B82Y10/00 , B82Y20/00 , B82Y40/00 , H01L21/7813 , H01L29/155 , H01L29/20 , H01L31/03046 , H01L31/068 , H01L31/0687 , H01L31/072 , H01L31/0725 , H01L31/184 , H01L31/1844 , H01L33/0079 , H01L2924/0002 , Y02E10/52 , Y02E10/544 , Y02E10/547 , Y02P70/521 , Y10T156/1195 , H01L2924/00
摘要： Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
摘要翻译：提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个可转让结构。可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。该方法和系统提供制造高质量和低成本的光伏器件，可转移的半导体结构（光电）器件和器件部件的手段。

7. 发明授权

US07622367B1 Methods and devices for fabricating and assembling printable semiconductor elements 有权
标题翻译：用于制造和组装可印刷半导体元件的方法和装置
公开(公告)号：US07622367B1
公开(公告)日：2009-11-24
申请号：US11145574
申请日：2005-06-02
申请人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
IPC分类号： H01L21/322
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
摘要翻译：本发明提供了用于制造可印刷半导体元件并将可印制半导体元件组装到衬底表面上的方法和装置。本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

8. 发明授权

US07557367B2 Stretchable semiconductor elements and stretchable electrical circuits 有权
标题翻译：可拉伸半导体元件和可拉伸电路
公开(公告)号：US07557367B2
公开(公告)日：2009-07-07
申请号：US11145542
申请日：2005-06-02
申请人： John A. Rogers , Dahl-Young Khang , Etienne Menard
发明人： John A. Rogers , Dahl-Young Khang , Etienne Menard
IPC分类号： H01L29/72
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
摘要翻译：本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

9. 发明授权

US07195733B2 Composite patterning devices for soft lithography 有权
标题翻译：用于软光刻的复合图案形成装置
公开(公告)号：US07195733B2
公开(公告)日：2007-03-27
申请号：US11115954
申请日：2005-04-27
申请人： John A. Rogers , Etienne Menard
发明人： John A. Rogers , Etienne Menard
IPC分类号： B29C67/00 , B29C35/08
CPC分类号： B82Y10/00 , B82Y30/00 , B82Y40/00 , C04B24/383 , C04B28/14 , C04B2111/00181 , G03F7/0002
摘要： The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions. The present invention provides composite patterning devices comprising a plurality of polymer layers each having selected mechanical properties, such as Young's Modulus and flexural rigidity, selected physical dimensions, such as thickness, surface area and relief pattern dimensions, and selected thermal properties, such as coefficients of thermal expansion, to provide high resolution patterning on a variety of substrate surfaces and surface morphologies.
摘要翻译：本发明提供用于在衬底表面上制造图案的方法，装置和器件部件，特别是包括具有一维，二维或三维尺寸选定长度的微小尺寸和/或纳米尺寸特征的结构的图案。本发明提供了复合图案形成装置，其包括多个聚合物层，每个聚合物层各自具有选择的机械性质，例如杨氏模量和弯曲刚度，所选择的物理尺寸，例如厚度，表面积和浮雕图案尺寸，以及选定的热性能，例如系数的热膨胀，以在各种基底表面和表面形态上提供高分辨率图案。

10. 发明申请

US20090294803A1 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 有权
标题翻译：用于制作和组装可印刷的半导体元件的方法和装置
公开(公告)号：US20090294803A1
公开(公告)日：2009-12-03
申请号：US11145574
申请日：2005-06-02
申请人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu
IPC分类号： H01L29/772 , H01L27/12 , H01L21/782 , H01L21/30 , H01L29/06 , H01L29/861
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
摘要翻译：本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

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