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    • 4. 发明授权
    • Variable volume between flexible structure and support surface
    • 柔性结构和支撑表面之间的可变体积
    • US07710371B2
    • 2010-05-04
    • US11014490
    • 2004-12-16
    • Ping MeiJurgen DanielJames B. BoyceKathleen Dore Boyce, legal representativeJackson HoRachel LauYu Wang
    • Ping MeiJurgen DanielJames B. BoyceJackson HoRachel LauYu Wang
    • G09G3/34C25B9/00F04B17/00B41J2/14G02F1/153H04R19/00
    • C25D5/02C23C18/28C25D5/56H04R19/04
    • Cells can include variable volumes defined between a flexible structure, such as a polymer layer, and a support surface, with the flexible structure and support surface being attached in a first region that surrounds a second region in which they are unattached. Various adhesion structures can attach the flexible structure and the support surface. When unstretched, the flexible structure can lie in a flat position on the support surface. In response to a stretching force away from the support surface, the flexible structure can move out of the flat position, providing the variable volume. Electrodes, such as on the flexible structure, on the support surface, and over the flexible structure, can have charge levels that couple with each other and with the variable volume. A support structure can include a device layer with signal circuitry that provides a signal path between an electrode and external circuitry. One or more ducts can provide fluid communication with each cell's variable volume. Arrays of such cells can be implemented for various applications, such as optical modulators, displays, printheads, and microphones.
    • 细胞可以包括在诸如聚合物层的柔性结构和支撑表面之间限定的可变体积,其中柔性结构和支撑表面附接在围绕其未连接的第二区域的第一区域中。 各种粘合结构可以附接柔性结构和支撑表面。 当未拉伸时,柔性结构可以位于支撑表面上的平坦位置。 响应于远离支撑表面的拉伸力,柔性结构可以移出平坦位置,从而提供可变的体积。 诸如柔性结构的电极,在支撑表面上以及柔性结构上的电极可以具有彼此耦合并且具有可变体积的电荷水平。 支撑结构可以包括具有提供电极和外部电路之间的信号路径的信号电路的器件层。 一个或多个管道可以提供与每个电池的可变体积的流体连通。 可以对诸如光学调制器,显示器,打印头和麦克风的各种应用来实现这种单元的阵列。
    • 10. 发明申请
    • Organic thin-film transistor backplane with multi-layer contact structures and data lines
    • 具有多层接触结构和数据线的有机薄膜晶体管背板
    • US20070158644A1
    • 2007-07-12
    • US11316551
    • 2005-12-21
    • Michael ChabinycRene LujanAna AriasJackson Ho
    • Michael ChabinycRene LujanAna AriasJackson Ho
    • H01L29/08
    • H01L27/283H01L51/0037H01L51/0541H01L51/0545H01L51/105
    • A backplane circuit includes an array of organic thin-film transistors (OTFTs), each OTFT including a source contact, a drain contact, and an organic semiconductor region extending between the source and drain contacts. The drain contacts in each row are connected to an address line. The source and drain contacts and the address lines are fabricated using a multi-layer structure including a relatively thick base portion formed of a relatively inexpensive metal (e.g., aluminum or copper), and a relatively thin contact layer formed of a high work function, low oxidation metal (e.g., gold) that exhibits good electrical contact to the organic semiconductor, is formed opposite at least one external surface of the base, and is located at least partially in an interface region where the organic semiconductor contacts an underlying dielectric layer.
    • 背板电路包括有机薄膜晶体管(OTFT)的阵列,每个OTFT包括源极接触,漏极接触以及在源极和漏极接触之间延伸的有机半导体区域。 每行的漏极触点连接到地址线。 源极和漏极触点和地址线使用包括由相对便宜的金属(例如,铝或铜)形成的相对厚的基部的多层结构以及由高功函数形成的相对较薄的接触层制造, 与有机半导体呈现良好的电接触的低氧化金属(例如,金)形成在与基底的至少一个外表面相对的位置,并且至少部分地位于有机半导体与下面的介电层接触的界面区域中。