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    • 3. 发明授权
    • Environment exchange control for material on a wafer surface
    • 晶圆表面材料的环境交换控制
    • US06780461B2
    • 2004-08-24
    • US09798345
    • 2001-03-01
    • Emir GurerEd C. LeeTom ZhongKevin GoldenJohn W. LewellenScott C. WackermanReese Reynolds
    • Emir GurerEd C. LeeTom ZhongKevin GoldenJohn W. LewellenScott C. WackermanReese Reynolds
    • B05D304
    • G03F7/70866G03F7/168G03F7/26G03F7/38
    • Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
    • 描述了用于晶片表面上的聚合物的环境交换控制的系统和方法。 用于控制位于环境中的晶片表面上的环境和聚合物之间的交换的装置包括:适于保持晶片的腔室,限定环境,并将聚合物保持在与环境相邻的关系中; 以及耦合到所述室的加热器。 提高旋涂材料的性能的方法包括:在晶片的表面上形成旋涂材料; 然后将旋涂材料定位在环境中,使得所述环境与所述旋涂材料相邻; 然后控制旋涂材料和所述环境之间的交换。 系统和方法提供了优点,因为通过仔细控制环境温度和环境物质分压(例如相对湿度)来减轻不适当的脱保护。
    • 4. 发明授权
    • Environment exchange control for material on a wafer surface
    • 晶圆表面材料的环境交换控制
    • US06468586B1
    • 2002-10-22
    • US09566605
    • 2000-05-08
    • Emir GurerEd C. LeeTom ZhongKevin GoldenJohn W. LewellenScott C. WackermanReese Reynolds
    • Emir GurerEd C. LeeTom ZhongKevin GoldenJohn W. LewellenScott C. WackermanReese Reynolds
    • B05D304
    • G03F7/70866G03F7/168G03F7/26G03F7/38
    • Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
    • 描述了用于晶片表面上的聚合物的环境交换控制的系统和方法。 用于控制位于环境中的晶片表面上的环境和聚合物之间的交换的装置包括:适于保持晶片的腔室,限定环境,并将聚合物保持在与环境相邻的关系中; 以及耦合到所述室的加热器。 提高旋涂材料的性能的方法包括:在晶片的表面上形成旋涂材料; 然后将旋涂材料定位在环境中,使得所述环境与所述旋涂材料相邻; 然后控制旋涂材料和所述环境之间的交换。 系统和方法提供了优点,因为通过仔细控制环境温度和环境物质分压(例如相对湿度)来减轻不适当的脱保护。
    • 5. 发明授权
    • Environment exchange control for material on a wafer surface
    • 晶圆表面材料的环境交换控制
    • US06254936B1
    • 2001-07-03
    • US09222117
    • 1998-12-29
    • Emir GurerEd C. LeeTom ZhongKevin GoldenJohn W. LewellenReese ReynoldsScott C. Wackerman
    • Emir GurerEd C. LeeTom ZhongKevin GoldenJohn W. LewellenReese ReynoldsScott C. Wackerman
    • B05D300
    • G03F7/70866G03F7/168G03F7/26G03F7/38
    • Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
    • 描述了用于晶片表面上的聚合物的环境交换控制的系统和方法。 用于控制位于环境中的晶片表面上的环境和聚合物之间的交换的装置包括:适于保持晶片的腔室,限定环境,并将聚合物保持在与环境相邻的关系中; 以及耦合到所述室的加热器。 提高旋涂材料的性能的方法包括:在晶片的表面上形成旋涂材料; 然后将旋涂材料定位在环境中,使得所述环境与所述旋涂材料相邻; 然后控制旋涂材料和所述环境之间的交换。 系统和方法提供了优点,因为通过仔细控制环境温度和环境物质分压(例如相对湿度)来减轻不适当的脱保护。
    • 8. 发明授权
    • Field emission cathode gating for RF electron guns and planar focusing cathodes
    • 用于射频电子枪和平面聚焦阴极的场发射阴极门控
    • US07394201B2
    • 2008-07-01
    • US11248661
    • 2005-10-11
    • John W. LewellenJohn Noonan
    • John W. LewellenJohn Noonan
    • H01J25/00
    • H01J3/14H01J3/021H01J23/06
    • A novel method of gating electron emission from field-emitter cathodes for radio frequency (RF) electrode guns and a novel cathode that provides a focused electron beam without the need for magnetic fields or a curved cathode surface are provided. The phase and strength of a predefined harmonic field, such as the 3rd harmonic field, are adjusted relative to a fundamental field to cause a field emission cathode to emit electrons at predefined times for the generation of high-brightness electron beams. The emission time is gated responsive to the combined harmonic and fundamental fields and the response of the FE cathode to the combined fields. A planar focusing cathode includes a selected dielectric material, such as a ceramic material, to provide an electron beam emission surface. Metal surfaces are provided both radially around and behind the dielectric material to shape the electric fields that accelerate and guide the beam from the cathode surface.
    • 提供了一种用于射频(RF)电极枪的场发射极阴极的电子发射的新颖方法和提供聚焦电子束而不需要磁场或弯曲阴极表面的新型阴极。 预定谐波场(例如三次谐波场)的相位和强度相对于基波场被调整,以使场致发射阴极在预定时间内发射电子以产生高亮度电子束。 发射时间响应于组合谐波和基波场以及FE阴极对组合场的响应而选通。 平面聚焦阴极包括选择的介电材料,例如陶瓷材料,以提供电子束发射表面。 在电介质材料的周围和后面设置金属表面,以形成加速和引导来自阴极表面的光束的电场。