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1. 发明授权

US06955720B2 Plasma deposition of spin chucks to reduce contamination of Silicon wafers 有权
标题翻译：旋转卡盘的等离子体沉积，以减少硅片的污染
公开(公告)号：US06955720B2
公开(公告)日：2005-10-18
申请号：US09874073
申请日：2001-06-04
申请人： Emir Gurer , Ed C. Lee , Richard Savage
发明人： Emir Gurer , Ed C. Lee , Richard Savage
IPC分类号： C23C16/30 , H01L21/00 , C23C16/00
CPC分类号： C23C16/30 , C23C16/308 , Y10S156/915 , Y10T279/11
摘要： An apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.
摘要翻译：用于将流体介质输送到晶片的装置包括限定处理室的壳体。流体介质输送构件联接到处理室。可旋转卡盘位于处理室中。可旋转卡盘具有涂覆有涂层材料的晶片支撑表面。真空供应线连接到可旋转卡盘。

2. 发明授权

US06242364B1 Plasma deposition of spin chucks to reduce contamination of silicon wafers 有权
标题翻译：旋转卡盘的等离子体沉积以减少硅晶片的污染
公开(公告)号：US06242364B1
公开(公告)日：2001-06-05
申请号：US09275360
申请日：1999-03-23
申请人： Emir Gurer , Ed C. Lee , Richard Savage
发明人： Emir Gurer , Ed C. Lee , Richard Savage
IPC分类号： H01L2131
CPC分类号： C23C16/30 , C23C16/308 , Y10S156/915 , Y10T279/11
摘要： An apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.
摘要翻译：用于将流体介质输送到晶片的装置包括限定处理室的壳体。流体介质输送构件联接到处理室。可旋转卡盘位于处理室中。可旋转卡盘具有涂覆有涂层材料的晶片支撑表面。真空供应线连接到可旋转卡盘。

3. 发明授权

US06905547B1 Method and apparatus for flexible atomic layer deposition 有权
标题翻译：柔性原子层沉积的方法和装置
公开(公告)号：US06905547B1
公开(公告)日：2005-06-14
申请号：US10175556
申请日：2002-06-17
申请人： Ana R. Londergan , Thomas E. Seidel , Lawrence D. Matthysse , Ed C. Lee
发明人： Ana R. Londergan , Thomas E. Seidel , Lawrence D. Matthysse , Ed C. Lee
IPC分类号： C23C16/00 , C23C16/455
CPC分类号： C23C16/45544 , C23C16/45536 , C23C16/45574 , C23C16/45576
摘要： An apparatus with a processing chamber subjects a substrate to atomic layer deposition and deposits a film layer. The processing chamber includes at least a first gas switching port. A gas switching manifold is coupled to the processing chamber and configured to mix reactants with a neutral carrier gas and provide gas switching functionality for ALD processes. An upstream gas source and pressure setting apparatus is coupled to the gas switching manifold. The upstream gas source and pressure setting apparatus includes at least a first reactant source, a second reactant source and a neutral gas source. Additionally, the upstream gas source and pressure setting apparatus is configured to provide a cascade of continuing, decreasing pressures.
摘要翻译：具有处理室的装置使基板进行原子层沉积并沉积膜层。处理室至少包括第一气体切换口。气体开关歧管联接到处理室并且被配置为将反应物与中性载气混合并为ALD工艺提供气体切换功能。上游气源和压力调节装置联接到气体开关歧管。上游气体源和压力设定装置至少包括第一反应物源，第二反应物源和中性气体源。另外，上游气体源和压力设定装置构造成提供连续的降低压力的级联。

4. 发明授权

US07208262B2 Yield and line width performance for liquid polymers and other materials 有权
公开(公告)号：US07208262B2
公开(公告)日：2007-04-24
申请号：US11006876
申请日：2004-12-07
申请人： Emir Gurer , Ed C. Lee , Murthy Krishna , Reese Reynolds , John Salois , Royal Cherry
发明人： Emir Gurer , Ed C. Lee , Murthy Krishna , Reese Reynolds , John Salois , Royal Cherry
IPC分类号： G03F7/30
CPC分类号： G03F7/322 , B05B7/0884 , B05C5/027 , B05C11/08 , G03F7/3021 , H01L21/67051
摘要： Systems and methods are described for improved yield and line width performance for liquid polymers and other materials. A method for minimizing precipitation of developing reactant by lowering a sudden change in pH includes: developing at least a portion of a polymer layer on a substrate with an initial charge of a developer fluid; then rinsing the polymer with an additional charge of the developer fluid so as to controllably minimize a subsequent sudden change in pH; and then rinsing the polymer with a charge of another fluid. An apparatus for minimizing fluid impingement force on a polymer layer to be developed on a substrate includes: a nozzle including: a developer manifold adapted to supply a developer fluid; a plurality of developer fluid conduits coupled to the developer manifold; a rinse manifold adapted to supply a rinse fluid; and a plurality of rinse fluid conduits coupled to the developer manifold. The developer manifold and the rinse manifold can be staggered so as to reduce an external width of the nozzle compared to a nominal external width of the nozzle achievable without either intersecting the fluid manifold and the another manifold or staggering the fluid manifold and the another manifold. The systems and methods provide advantages including improve yield via reduced process-induced defect and partial counts, and improved critical dimension (CD) control capability.

5. 发明授权

US06844027B1 Environment exchange control for material on a wafer surface 有权
标题翻译：晶圆表面材料的环境交换控制
公开(公告)号：US06844027B1
公开(公告)日：2005-01-18
申请号：US09563775
申请日：2000-05-02
申请人： Emir Gurer , Ed C. Lee , Tom Zhong , Kevin Golden , John W. Lewellen , Scott C. Wackerman , Reese Reynolds
发明人： Emir Gurer , Ed C. Lee , Tom Zhong , Kevin Golden , John W. Lewellen , Scott C. Wackerman , Reese Reynolds
IPC分类号： G03F7/039 , G03F7/16 , G03F7/20 , G03F7/26 , G03F7/38 , H01L21/027 , B05D3/12
CPC分类号： G03F7/70866 , G03F7/168 , G03F7/26 , G03F7/38
摘要： Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
摘要翻译：描述了用于晶片表面上的聚合物的环境交换控制的系统和方法。用于控制位于环境中的晶片表面上的环境和聚合物之间的交换的装置包括：适于保持晶片的腔室，限定环境，并将聚合物保持在与环境相邻的关系中; 以及耦合到所述室的加热器。提高旋涂材料的性能的方法包括：在晶片的表面上形成旋涂材料; 然后将旋涂材料定位在环境中，使得所述环境与所述旋涂材料相邻; 然后控制旋涂材料和所述环境之间的交换。系统和方法提供了优点，因为通过仔细控制环境温度和环境物质分压（例如相对湿度）来减轻不适当的脱保护。

6. 发明授权

US07255975B2 Yield and line width performance for liquid polymers and other materials 有权
标题翻译：液体聚合物和其他材料的产量和线宽性能
公开(公告)号：US07255975B2
公开(公告)日：2007-08-14
申请号：US10664095
申请日：2003-09-16
申请人： Emir Gurer , Ed C. Lee , Murthy Krishna , Reese Reynolds , John Salois , Royal Cherry
发明人： Emir Gurer , Ed C. Lee , Murthy Krishna , Reese Reynolds , John Salois , Royal Cherry
IPC分类号： G03F7/30
CPC分类号： G03F7/322 , B05B7/0884 , B05C5/027 , B05C11/08 , G03F7/3021 , H01L21/67051
摘要： Systems and methods are described for improved yield and line width performance for liquid polymers and other materials. A method for minimizing precipitation of developing reactant by lowering a sudden change in pH includes: developing at least a portion of a polymer layer on a substrate with an initial charge of a developer fluid; then rinsing the polymer with an additional charge of the developer fluid so as to controllably minimize a subsequent sudden change in pH; and then rinsing the polymer with a charge of another fluid. An apparatus for minimizing fluid impingement force on a polymer layer to be developed on a substrate includes: a nozzle including: a developer manifold adapted to supply a developer fluid; a plurality of developer fluid conduits coupled to the developer manifold; a rinse manifold adapted to supply a rinse fluid; and a plurality of rinse fluid conduits coupled to the developer manifold. The developer manifold and the rinse manifold can be staggered so as to reduce an external width of the nozzle compared to a nominal external width of the nozzle achievable without either intersecting the fluid manifold and the another manifold or staggering the fluid manifold and the another manifold. The systems and methods provide advantages including improve yield via reduced process-induced defect and partial counts, and improved critical dimension (CD) control capability.
摘要翻译：描述了用于提高液体聚合物和其它材料的产量和线宽性能的系统和方法。通过降低pH的突然变化来最小化显影反应物的沉淀的方法包括：用显影剂流体的初始电荷在基底上显影至少一部分聚合物层; 然后用额外的显影剂流体冲洗聚合物，以便可控地最小化随后的pH的突然变化; 然后用另一种流体的电荷冲洗聚合物。用于使要在基底上显影的聚合物层上的流体冲击力最小化的装置包括：喷嘴，包括：适于供应显影剂流体的显影剂歧管; 耦合到显影剂歧管的多个显影剂流体导管; 适于提供漂洗液的冲洗歧管; 以及耦合到显影剂歧管的多个冲洗流体导管。显影剂歧管和冲洗歧管可以交错，以便与可实现的喷嘴的标称外部宽度相比，减小喷嘴的外部宽度，而不用与流体歧管和另一歧管交叉或交错流体歧管和另一歧管。这些系统和方法提供了优点，包括通过减少的过程引起的缺陷和部分计数提高产量，以及改进的临界尺寸（CD）控制能力。

7. 发明授权

US06911091B2 Environment exchange control for material on a wafer surface 有权
公开(公告)号：US06911091B2
公开(公告)日：2005-06-28
申请号：US10161840
申请日：2002-06-03
申请人： Emir Gurer , Ed C. Lee , Tom Zhong , Kevin Golden , John W. Lewellen , Scott C. Wackerman , Reese Reynolds
发明人： Emir Gurer , Ed C. Lee , Tom Zhong , Kevin Golden , John W. Lewellen , Scott C. Wackerman , Reese Reynolds
IPC分类号： G03F7/039 , G03F7/16 , G03F7/20 , G03F7/26 , G03F7/38 , H01L21/027 , B05C11/00 , B05C11/02
CPC分类号： G03F7/70866 , G03F7/168 , G03F7/26 , G03F7/38
摘要： Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber.A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).

8. 发明授权

US06780461B2 Environment exchange control for material on a wafer surface 有权
标题翻译：晶圆表面材料的环境交换控制
公开(公告)号：US06780461B2
公开(公告)日：2004-08-24
申请号：US09798345
申请日：2001-03-01
申请人： Emir Gurer , Ed C. Lee , Tom Zhong , Kevin Golden , John W. Lewellen , Scott C. Wackerman , Reese Reynolds
发明人： Emir Gurer , Ed C. Lee , Tom Zhong , Kevin Golden , John W. Lewellen , Scott C. Wackerman , Reese Reynolds
IPC分类号： B05D304
CPC分类号： G03F7/70866 , G03F7/168 , G03F7/26 , G03F7/38
摘要： Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
摘要翻译：描述了用于晶片表面上的聚合物的环境交换控制的系统和方法。用于控制位于环境中的晶片表面上的环境和聚合物之间的交换的装置包括：适于保持晶片的腔室，限定环境，并将聚合物保持在与环境相邻的关系中; 以及耦合到所述室的加热器。提高旋涂材料的性能的方法包括：在晶片的表面上形成旋涂材料; 然后将旋涂材料定位在环境中，使得所述环境与所述旋涂材料相邻; 然后控制旋涂材料和所述环境之间的交换。系统和方法提供了优点，因为通过仔细控制环境温度和环境物质分压（例如相对湿度）来减轻不适当的脱保护。

9. 发明授权

US06669779B2 Yield and line width performance for liquid polymers and other materials 有权
公开(公告)号：US06669779B2
公开(公告)日：2003-12-30
申请号：US09800060
申请日：2001-03-05
申请人： Emir Gurer , Ed C. Lee , Murthy Krishna , Reese Reynolds , John Salois , Royal Cherry
发明人： Emir Gurer , Ed C. Lee , Murthy Krishna , Reese Reynolds , John Salois , Royal Cherry
IPC分类号： B05C500
CPC分类号： G03F7/322 , B05B7/0884 , B05C5/027 , B05C11/08 , G03F7/3021 , H01L21/67051
摘要： Systems and methods are described for improved yield and line width performance for liquid polymers and other materials. A method for minimizing precipitation of developing reactant by lowering a sudden change in pH includes: developing at least a portion of a polymer layer on a substrate with an initial charge of a developer fluid; then rinsing the polymer with an additional charge of the developer fluid so as to controllably minimize a subsequent sudden change in pH; and then rinsing the polymer with a charge of another fluid. An apparatus for minimizing fluid impingement force on a polymer layer to be developed on a substrate includes: a nozzle including: a developer manifold adapted to supply a developer fluid; a plurality of developer fluid conduits coupled to the developer manifold; a rinse manifold adapted to supply a rinse fluid; and a plurality of rinse fluid conduits coupled to the developer manifold. The developer manifold and the rinse manifold can be staggered so as to reduce an external width of the nozzle compared to a nominal external width of the nozzle achievable without either intersecting the fluid manifold and the another manifold or staggering the fluid manifold and the another manifold. The systems and methods provide advantages including improve yield via reduced process-induced defect and partial counts, and improved critical dimension (CD) control capability.

10. 发明授权

US06468586B1 Environment exchange control for material on a wafer surface 有权
标题翻译：晶圆表面材料的环境交换控制
公开(公告)号：US06468586B1
公开(公告)日：2002-10-22
申请号：US09566605
申请日：2000-05-08
申请人： Emir Gurer , Ed C. Lee , Tom Zhong , Kevin Golden , John W. Lewellen , Scott C. Wackerman , Reese Reynolds
发明人： Emir Gurer , Ed C. Lee , Tom Zhong , Kevin Golden , John W. Lewellen , Scott C. Wackerman , Reese Reynolds
IPC分类号： B05D304
CPC分类号： G03F7/70866 , G03F7/168 , G03F7/26 , G03F7/38
摘要： Systems and methods are described for environmental exchange control for a polymer on a wafer surface. An apparatus for controlling an exchange between an environment and a polymer on a surface of a wafer located in the environment includes: a chamber adapted to hold the wafer, define the environment, and maintain the polymer in an adjacent relationship with the environment; and a heater coupled to the chamber. A method for improving performance of a spin-on material includes: forming the spin-on material on a surface of a wafer; then locating the spin-on material in an environment so that said environment is adjacent said spin-on material; and then controlling an exchange between the spin-on material and said environment. The systems and methods provide advantages because inappropriate deprotection is mitigated by careful control of the environmental temperature and environmental species partial pressures (e.g. relative humidity).
摘要翻译：描述了用于晶片表面上的聚合物的环境交换控制的系统和方法。用于控制位于环境中的晶片表面上的环境和聚合物之间的交换的装置包括：适于保持晶片的腔室，限定环境，并将聚合物保持在与环境相邻的关系中; 以及耦合到所述室的加热器。提高旋涂材料的性能的方法包括：在晶片的表面上形成旋涂材料; 然后将旋涂材料定位在环境中，使得所述环境与所述旋涂材料相邻; 然后控制旋涂材料和所述环境之间的交换。系统和方法提供了优点，因为通过仔细控制环境温度和环境物质分压（例如相对湿度）来减轻不适当的脱保护。

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