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1. 发明申请

US20120032306A1 Method for Patterning a Semiconductor Surface, and Semiconductor Chip 审中-公开
标题翻译：半导体表面图案化方法和半导体芯片
公开(公告)号：US20120032306A1
公开(公告)日：2012-02-09
申请号：US13148631
申请日：2010-01-22
申请人： Elmar Baur , Bernd Böhm , Alexander Heindl , Patrick Rode , Matthias Sabathil
发明人： Elmar Baur , Bernd Böhm , Alexander Heindl , Patrick Rode , Matthias Sabathil
IPC分类号： H01L29/12 , H01L21/312
CPC分类号： H01L33/22 , H01L33/0062
摘要： A method for patterning a semiconductor surface is specified. A photoresist is applied to an outer area of a second semiconductor wafer. A surface of the photoresist that is remote from the second semiconductor wafer is patterned by impressing a patterned surface of the first wafer into the photoresist. A patterning method is applied to the surface of the photoresist, wherein a structure applied on the photoresist is transferred at least in places to the outer area of the second semiconductor wafer.
摘要翻译：规定了图案化半导体表面的方法。光致抗蚀剂被施加到第二半导体晶片的外部区域。通过将第一晶片的图案化表面压印到光致抗蚀剂中，使光刻胶远离第二半导体晶片的表面被图案化。将图案化方法应用于光致抗蚀剂的表面，其中施加在光致抗蚀剂上的结构至少在第二半导体晶片的外部区域被转移。

2. 发明申请

US20120070927A1 METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT 有权
标题翻译：生产光电半导体元件的方法
公开(公告)号：US20120070927A1
公开(公告)日：2012-03-22
申请号：US13322662
申请日：2010-05-03
申请人： Elmar Baur , Alexander Heindl , Bernd Böhm , Patrick Rode , Heribert Zull
发明人： Elmar Baur , Alexander Heindl , Bernd Böhm , Patrick Rode , Heribert Zull
IPC分类号： H01L33/48
CPC分类号： H01L33/22 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L33/005 , H01L33/20
摘要： A method for producing an optoelectronic semiconductor component includes providing a first wafer having a patterned surface, wherein the patterned surface is formed at least in places by elevations having first and second heights, wherein the first height is greater than the second height; providing a second wafer; applying a photoresist to outer areas of the second wafer; patterning a surface of the photoresist facing away from the second wafer by impressing the patterned surface of the first wafer into the photoresist, wherein the elevations are impressed as trenches having a first and second depth into the photoresist; applying a patterning method to the patterned surface of the photoresist, wherein the structure applied on the photoresist is transferred at least in places to the outer area of the second wafer.
摘要翻译：一种用于制造光电子半导体部件的方法包括提供具有图案化表面的第一晶片，其中所述图案化表面至少在具有第一和第二高度的高度的位置形成，其中所述第一高度大于所述第二高度; 提供第二晶片; 将光致抗蚀剂施加到第二晶片的外部区域; 通过将第一晶片的图案化表面压印到光致抗蚀剂中，将光致抗蚀剂的表面图案化为远离第二晶片，其中，将高度作为具有第一和第二深度的沟槽印刷到光致抗蚀剂中; 将图案化方法应用于光致抗蚀剂的图案化表面，其中施加在光致抗蚀剂上的结构至少在第二晶片的外部区域被转移。

3. 发明授权

US08569079B2 Method for producing an optoelectronic semiconductor component 有权
标题翻译：光电半导体元件的制造方法
公开(公告)号：US08569079B2
公开(公告)日：2013-10-29
申请号：US13322662
申请日：2010-05-03
申请人： Elmar Baur , Alexander Heindl , Bernd Bohm , Patrick Rode , Heribert Zull
发明人： Elmar Baur , Alexander Heindl , Bernd Bohm , Patrick Rode , Heribert Zull
IPC分类号： H01L21/00
CPC分类号： H01L33/22 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L33/005 , H01L33/20
摘要： A method for producing an optoelectronic semiconductor component includes providing a first wafer having a patterned surface, wherein the patterned surface is formed at least in places by elevations having first and second heights, wherein the first height is greater than the second height; providing a second wafer; applying a photoresist to outer areas of the second wafer; patterning a surface of the photoresist facing away from the second wafer by impressing the patterned surface of the first wafer into the photoresist, wherein the elevations are impressed as trenches having a first and second depth into the photoresist; applying a patterning method to the patterned surface of the photoresist, wherein the structure applied on the photoresist is transferred at least in places to the outer area of the second wafer.
摘要翻译：一种用于制造光电子半导体部件的方法包括提供具有图案化表面的第一晶片，其中所述图案化表面至少在具有第一和第二高度的高度的位置形成，其中所述第一高度大于所述第二高度; 提供第二晶片; 将光致抗蚀剂施加到第二晶片的外部区域; 通过将第一晶片的图案化表面压印到光致抗蚀剂中，将光致抗蚀剂的表面图案化为远离第二晶片，其中，将高度作为具有第一和第二深度的沟槽印刷到光致抗蚀剂中; 将图案化方法应用于光致抗蚀剂的图案化表面，其中施加在光致抗蚀剂上的结构至少在第二晶片的外部区域被转移。

4. 发明授权

US08476644B2 Optoelectronic component and method for the manufacture of a plurality of optoelectronic components 有权
标题翻译：用于制造多个光电子部件的光电子部件和方法
公开(公告)号：US08476644B2
公开(公告)日：2013-07-02
申请号：US12597682
申请日：2008-04-25
申请人： Stefan Illek , Andreas Ploessl , Alexander Heindl , Patrick Rode , Dieter Eissler
发明人： Stefan Illek , Andreas Ploessl , Alexander Heindl , Patrick Rode , Dieter Eissler
IPC分类号： H01L27/15 , H01L33/00 , H01L21/00
CPC分类号： H01L33/382 , H01L33/20 , H01L33/46 , H01L33/505 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic component with a semiconductor body includes an active region suitable for generating radiation, and two electrical contacts arranged on the semiconductor body. The contacts are electrically connected to the active region. The contacts each have a connecting face that faces away from the semiconductor body. The contact faces are located on a connection side of the component and a side of the component that is different from the connection side is mirror-coated. A method for the manufacture of multiple components of this sort is also disclosed.
摘要翻译：具有半导体本体的光电子部件包括适于产生辐射的有源区和布置在半导体本体上的两个电触头。触头电连接到有源区。触点各自具有面向远离半导体主体的连接面。接触面位于部件的连接侧，并且与连接侧不同的部件的一侧被镜面涂覆。还公开了用于制造这种多个部件的方法。

5. 发明申请

US20100117111A1 Optoelectronic Component and Method for the Manufacture of a Plurality of Optoelectronic Components 有权
标题翻译：用于制造多种光电子元件的光电元件和方法
公开(公告)号：US20100117111A1
公开(公告)日：2010-05-13
申请号：US12597682
申请日：2008-04-25
申请人： Stefan Illek , Andreas Ploessl , Alexander Heindl , Patrick Rode , Dieter Eissler
发明人： Stefan Illek , Andreas Ploessl , Alexander Heindl , Patrick Rode , Dieter Eissler
IPC分类号： H01L33/00
CPC分类号： H01L33/382 , H01L33/20 , H01L33/46 , H01L33/505 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic component with a semiconductor body includes an active region suitable for generating radiation, and two electrical contacts arranged on the semiconductor body. The contacts are electrically connected to the active region. The contacts each have a connecting face that faces away from the semiconductor body. The contact faces are located on a connection side of the component and a side of the component that is different from the connection side is mirror-coated. A method for the manufacture of multiple components of this sort is also disclosed.
摘要翻译：具有半导体本体的光电子部件包括适于产生辐射的有源区和布置在半导体本体上的两个电触头。触头电连接到有源区。触点各自具有面向远离半导体主体的连接面。接触面位于部件的连接侧，并且与连接侧不同的部件的一侧被镜面涂覆。还公开了用于制造这种多个部件的方法。

6. 发明授权

US08314430B2 Optoelectronic component and method for the manufacture of a plurality of optoelectronic components 有权
公开(公告)号：US08314430B2
公开(公告)日：2012-11-20
申请号：US12597682
申请日：2008-04-25
申请人： Stefan Illek , Andreas Ploessl , Alexander Heindl , Patrick Rode , Dieter Eissler
发明人： Stefan Illek , Andreas Ploessl , Alexander Heindl , Patrick Rode , Dieter Eissler
IPC分类号： H01L27/15 , H01L33/00 , H01L21/00
摘要： An optoelectronic component with a semiconductor body includes an active region suitable for generating radiation, and two electrical contacts arranged on the semiconductor body. The contacts are electrically connected to the active region. The contacts each have a connecting face that faces away from the semiconductor body. The contact faces are located on a connection side of the component and a side of the component that is different from the connection side is mirror-coated. A method for the manufacture of multiple components of this sort is also disclosed.

7. 发明授权

US06948071B2 Method for activating or deactivating data stored in a memory arrangement of a microcomputer system 失效
标题翻译：用于激活或去激活存储在微计算机系统的存储装置中的数据的方法
公开(公告)号：US06948071B2
公开(公告)日：2005-09-20
申请号：US10159214
申请日：2002-05-31
申请人： Klaus Schneider , Ralf Angerbauer , Alexander Heindl
发明人： Klaus Schneider , Ralf Angerbauer , Alexander Heindl
IPC分类号： G06F12/14 , G06F21/57 , G06F21/72 , G06F21/74 , G06F21/79 , G06F13/00
CPC分类号： G06F21/79 , G06F21/575 , G06F21/72 , G06F21/74 , G06F2221/2105 , G06F2221/2129 , G06F2221/2141 , G06F2221/2147 , H04L9/3247 , H04L2209/84
摘要： A method is for activating or deactivating at least one part of data stored in a memory arrangement of a microcomputer system, in particular one part of a program stored there. In the event of a manipulation of data stored in the memory arrangement by unauthorized third parties, a method having the following method steps may prevent utilization of the manipulated data reliably and effectively:a microcomputer-individual identifier is stored in a signed or encoded fashion a specifiable memory area of the memory arrangement;when the microcomputer system is started up, the signature of the identifier is checked or the identifier is decoded; andas a function of the result of the identifier, one part of the data is activated or deactivated.
摘要翻译：一种用于激活或去激活存储在微计算机系统的存储器装置中的数据的至少一部分的方法，特别是存储在其中的程序的一部分。在由未授权的第三方对存储在存储装置中的数据进行操作的情况下，具有以下方法步骤的方法可以有效地防止对被操纵的数据的利用：将微型计算机单独标识符以有符号或编码的方式存储存储器布置的可指定存储区; 当微型计算机系统启动时，检查标识符的签名或解码标识符; 并且根据标识符的结果，数据的一部分被激活或去激活。

8. 发明申请

US20100171215A1 Method of Producing Optoelectronic Components and Optoelectronic Component 审中-公开
标题翻译：生产光电子元件和光电元件的方法
公开(公告)号：US20100171215A1
公开(公告)日：2010-07-08
申请号：US12663669
申请日：2008-05-07
申请人： Helmut Fischer , Dieter Eissler , Alexander Heindl
发明人： Helmut Fischer , Dieter Eissler , Alexander Heindl
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L25/0753 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L23/3114 , H01L24/12 , H01L24/81 , H01L24/83 , H01L24/90 , H01L24/95 , H01L24/97 , H01L33/0079 , H01L33/22 , H01L33/382 , H01L33/44 , H01L2221/68322 , H01L2221/68354 , H01L2221/68363 , H01L2221/68377 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/13111 , H01L2224/13124 , H01L2224/13144 , H01L2224/13155 , H01L2224/13169 , H01L2224/16225 , H01L2224/29144 , H01L2224/2919 , H01L2224/81001 , H01L2224/81801 , H01L2224/83851 , H01L2224/90 , H01L2224/95001 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10158 , H01L2924/10329 , H01L2924/12041 , H01L2924/181 , H01L2924/01032 , H01L2924/0105 , H01L2224/81 , H01L2924/00014 , H01L2924/00
摘要： A method of producing optoelectronic components is indicated, in which a plurality of semiconductor bodies, each with a semiconductor layer sequence, are provided. In addition, a component carrier assembly with a plurality of connection pads is provided. The semiconductor bodies are positioned relative to the component carrier assembly. An electrically conductive connection is produced between the connection pads and the associated semiconductor bodies and the semiconductor bodies are attached to the component carrier assembly. The optoelectronic components are finished in that one component carrier (30) is formed from the component carrier assembly, to which the semiconductor bodies are attached, for each optoelectronic component.
摘要翻译：表示制造光电子部件的方法，其中提供了各自具有半导体层序列的多个半导体本体。另外，提供具有多个连接焊盘的部件载体组件。半导体本体相对于分量载体组件定位。在连接焊盘和相关的半导体主体之间产生导电连接，并且半导体主体附接到部件载体组件。光电子部件的完成是，对于每个光电子部件，单分量载体（30）由与半导体主体相连的分量载体组件形成。

9. 发明授权

US07906352B2 Chip and method for producing a chip 有权
标题翻译：用于制造芯片的芯片和方法
公开(公告)号：US07906352B2
公开(公告)日：2011-03-15
申请号：US12064556
申请日：2006-07-20
申请人： Herbert Brunner , Dieter Eissler , Helmut Fischer , Ewald Karl Michael Guenther , Alexander Heindl
发明人： Herbert Brunner , Dieter Eissler , Helmut Fischer , Ewald Karl Michael Guenther , Alexander Heindl
IPC分类号： H01L21/00 , H01L33/00
CPC分类号： H01L33/505 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.
摘要翻译：公开了一种方法，其中准备了包括用于LED芯片并适于发射电磁辐射的层序列的基体。盖层施加到基体的至少一个主表面。空腔被引入盖层中，并且被完全或部分地填充有发光转换材料。发光转换材料包括至少一种荧光体。还公开了一种方法，其中盖层包括光可固化材料和至少一种磷光体，使得其能够用作发光转换材料并且可以直接光致结构化。还描述了可通过该方法生产的LED芯片。

10. 发明申请

US20090212308A1 METHOD FOR PRODUCING AN LED CHIP AND LED CHIP 有权
标题翻译：生产LED芯片和LED芯片的方法
公开(公告)号：US20090212308A1
公开(公告)日：2009-08-27
申请号：US12064556
申请日：2006-07-20
申请人： Herbert Brunner , Dieter Eissler , Helmut Fischer , Ewald Karl Michael Guenther , Alexander Heindl
发明人： Herbert Brunner , Dieter Eissler , Helmut Fischer , Ewald Karl Michael Guenther , Alexander Heindl
IPC分类号： H01L33/00 , H01L21/56
CPC分类号： H01L33/505 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.
摘要翻译：公开了一种方法，其中准备了包括用于LED芯片并适于发射电磁辐射的层序列的基体。盖层施加到基体的至少一个主表面。空腔被引入盖层中，并且被完全或部分地填充有发光转换材料。发光转换材料包括至少一种荧光体。还公开了一种方法，其中盖层包括光可固化材料和至少一种磷光体，使得其能够用作发光转换材料并且可以直接光致结构化。还描述了可通过该方法生产的LED芯片。

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