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1. 发明申请

US20100171215A1 Method of Producing Optoelectronic Components and Optoelectronic Component 审中-公开
标题翻译：生产光电子元件和光电元件的方法
公开(公告)号：US20100171215A1
公开(公告)日：2010-07-08
申请号：US12663669
申请日：2008-05-07
申请人： Helmut Fischer , Dieter Eissler , Alexander Heindl
发明人： Helmut Fischer , Dieter Eissler , Alexander Heindl
IPC分类号： H01L23/48 , H01L21/50
CPC分类号： H01L25/0753 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L23/3114 , H01L24/12 , H01L24/81 , H01L24/83 , H01L24/90 , H01L24/95 , H01L24/97 , H01L33/0079 , H01L33/22 , H01L33/382 , H01L33/44 , H01L2221/68322 , H01L2221/68354 , H01L2221/68363 , H01L2221/68377 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/05669 , H01L2224/13111 , H01L2224/13124 , H01L2224/13144 , H01L2224/13155 , H01L2224/13169 , H01L2224/16225 , H01L2224/29144 , H01L2224/2919 , H01L2224/81001 , H01L2224/81801 , H01L2224/83851 , H01L2224/90 , H01L2224/95001 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10158 , H01L2924/10329 , H01L2924/12041 , H01L2924/181 , H01L2924/01032 , H01L2924/0105 , H01L2224/81 , H01L2924/00014 , H01L2924/00
摘要： A method of producing optoelectronic components is indicated, in which a plurality of semiconductor bodies, each with a semiconductor layer sequence, are provided. In addition, a component carrier assembly with a plurality of connection pads is provided. The semiconductor bodies are positioned relative to the component carrier assembly. An electrically conductive connection is produced between the connection pads and the associated semiconductor bodies and the semiconductor bodies are attached to the component carrier assembly. The optoelectronic components are finished in that one component carrier (30) is formed from the component carrier assembly, to which the semiconductor bodies are attached, for each optoelectronic component.
摘要翻译：表示制造光电子部件的方法，其中提供了各自具有半导体层序列的多个半导体本体。另外，提供具有多个连接焊盘的部件载体组件。半导体本体相对于分量载体组件定位。在连接焊盘和相关的半导体主体之间产生导电连接，并且半导体主体附接到部件载体组件。光电子部件的完成是，对于每个光电子部件，单分量载体（30）由与半导体主体相连的分量载体组件形成。

2. 发明授权

US07906352B2 Chip and method for producing a chip 有权
标题翻译：用于制造芯片的芯片和方法
公开(公告)号：US07906352B2
公开(公告)日：2011-03-15
申请号：US12064556
申请日：2006-07-20
申请人： Herbert Brunner , Dieter Eissler , Helmut Fischer , Ewald Karl Michael Guenther , Alexander Heindl
发明人： Herbert Brunner , Dieter Eissler , Helmut Fischer , Ewald Karl Michael Guenther , Alexander Heindl
IPC分类号： H01L21/00 , H01L33/00
CPC分类号： H01L33/505 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.
摘要翻译：公开了一种方法，其中准备了包括用于LED芯片并适于发射电磁辐射的层序列的基体。盖层施加到基体的至少一个主表面。空腔被引入盖层中，并且被完全或部分地填充有发光转换材料。发光转换材料包括至少一种荧光体。还公开了一种方法，其中盖层包括光可固化材料和至少一种磷光体，使得其能够用作发光转换材料并且可以直接光致结构化。还描述了可通过该方法生产的LED芯片。

3. 发明申请

US20090212308A1 METHOD FOR PRODUCING AN LED CHIP AND LED CHIP 有权
标题翻译：生产LED芯片和LED芯片的方法
公开(公告)号：US20090212308A1
公开(公告)日：2009-08-27
申请号：US12064556
申请日：2006-07-20
申请人： Herbert Brunner , Dieter Eissler , Helmut Fischer , Ewald Karl Michael Guenther , Alexander Heindl
发明人： Herbert Brunner , Dieter Eissler , Helmut Fischer , Ewald Karl Michael Guenther , Alexander Heindl
IPC分类号： H01L33/00 , H01L21/56
CPC分类号： H01L33/505 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： A method is disclosed in which a base body is prepared that comprises a layer sequence intended for the LED chip and suitable for emitting electromagnetic radiation. A cap layer is applied to at least one main surface of the base body. A cavity is introduced into the cap layer and is completely or partially filled with a luminescence conversion material. The luminescence conversion material comprises at least one phosphor. A method is also disclosed in which the cap layer comprises photostructurable material and at least one phosphor, such that it is able to function as a luminescence conversion material and can be photostructured directly. LED chips that are producible by means of the method are also described.
摘要翻译：公开了一种方法，其中准备了包括用于LED芯片并适于发射电磁辐射的层序列的基体。盖层施加到基体的至少一个主表面。空腔被引入盖层中，并且被完全或部分地填充有发光转换材料。发光转换材料包括至少一种荧光体。还公开了一种方法，其中盖层包括光可固化材料和至少一种磷光体，使得其能够用作发光转换材料并且可以直接光致结构化。还描述了可通过该方法生产的LED芯片。

4. 发明授权

US08476644B2 Optoelectronic component and method for the manufacture of a plurality of optoelectronic components 有权
标题翻译：用于制造多个光电子部件的光电子部件和方法
公开(公告)号：US08476644B2
公开(公告)日：2013-07-02
申请号：US12597682
申请日：2008-04-25
申请人： Stefan Illek , Andreas Ploessl , Alexander Heindl , Patrick Rode , Dieter Eissler
发明人： Stefan Illek , Andreas Ploessl , Alexander Heindl , Patrick Rode , Dieter Eissler
IPC分类号： H01L27/15 , H01L33/00 , H01L21/00
CPC分类号： H01L33/382 , H01L33/20 , H01L33/46 , H01L33/505 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic component with a semiconductor body includes an active region suitable for generating radiation, and two electrical contacts arranged on the semiconductor body. The contacts are electrically connected to the active region. The contacts each have a connecting face that faces away from the semiconductor body. The contact faces are located on a connection side of the component and a side of the component that is different from the connection side is mirror-coated. A method for the manufacture of multiple components of this sort is also disclosed.
摘要翻译：具有半导体本体的光电子部件包括适于产生辐射的有源区和布置在半导体本体上的两个电触头。触头电连接到有源区。触点各自具有面向远离半导体主体的连接面。接触面位于部件的连接侧，并且与连接侧不同的部件的一侧被镜面涂覆。还公开了用于制造这种多个部件的方法。

5. 发明申请

US20100117111A1 Optoelectronic Component and Method for the Manufacture of a Plurality of Optoelectronic Components 有权
标题翻译：用于制造多种光电子元件的光电元件和方法
公开(公告)号：US20100117111A1
公开(公告)日：2010-05-13
申请号：US12597682
申请日：2008-04-25
申请人： Stefan Illek , Andreas Ploessl , Alexander Heindl , Patrick Rode , Dieter Eissler
发明人： Stefan Illek , Andreas Ploessl , Alexander Heindl , Patrick Rode , Dieter Eissler
IPC分类号： H01L33/00
CPC分类号： H01L33/382 , H01L33/20 , H01L33/46 , H01L33/505 , H01L2924/0002 , H01L2924/00
摘要： An optoelectronic component with a semiconductor body includes an active region suitable for generating radiation, and two electrical contacts arranged on the semiconductor body. The contacts are electrically connected to the active region. The contacts each have a connecting face that faces away from the semiconductor body. The contact faces are located on a connection side of the component and a side of the component that is different from the connection side is mirror-coated. A method for the manufacture of multiple components of this sort is also disclosed.
摘要翻译：具有半导体本体的光电子部件包括适于产生辐射的有源区和布置在半导体本体上的两个电触头。触头电连接到有源区。触点各自具有面向远离半导体主体的连接面。接触面位于部件的连接侧，并且与连接侧不同的部件的一侧被镜面涂覆。还公开了用于制造这种多个部件的方法。

6. 发明授权

US08314430B2 Optoelectronic component and method for the manufacture of a plurality of optoelectronic components 有权
公开(公告)号：US08314430B2
公开(公告)日：2012-11-20
申请号：US12597682
申请日：2008-04-25
申请人： Stefan Illek , Andreas Ploessl , Alexander Heindl , Patrick Rode , Dieter Eissler
发明人： Stefan Illek , Andreas Ploessl , Alexander Heindl , Patrick Rode , Dieter Eissler
IPC分类号： H01L27/15 , H01L33/00 , H01L21/00
摘要： An optoelectronic component with a semiconductor body includes an active region suitable for generating radiation, and two electrical contacts arranged on the semiconductor body. The contacts are electrically connected to the active region. The contacts each have a connecting face that faces away from the semiconductor body. The contact faces are located on a connection side of the component and a side of the component that is different from the connection side is mirror-coated. A method for the manufacture of multiple components of this sort is also disclosed.

7. 发明授权

US08946761B2 Radiation-emitting semiconductor chip and method for producing a radiation-emitting semiconductor chip 有权
标题翻译：辐射发射半导体芯片及其制造方法
公开(公告)号：US08946761B2
公开(公告)日：2015-02-03
申请号：US13811847
申请日：2011-07-15
申请人： Dieter Eissler , Andreas Ploessl
发明人： Dieter Eissler , Andreas Ploessl
IPC分类号： H01L33/00 , H01L33/62 , H01L33/38 , H01L33/20 , H01L33/22
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/20 , H01L33/22 , H01L33/382 , H01L2924/0002 , H01L2924/00
摘要： A radiation-emitting semi-conductor chip has a substrate and a semiconductor body arranged on the substrate and with a semiconductor layer sequence that includes an active region provided for producing radiation, an n-type region, and a covering layer arranged on a side of the n-type region that faces away from said active region. There is a contact structure arranged on the covering layer for the external electrical contacting of the n-type region. The covering layer has at least one recess through which the contact structure extends to the n-type region.
摘要翻译：辐射发射半导体芯片具有基板和布置在基板上的半导体本体，并具有半导体层序列，该半导体层序列包括设置用于产生辐射的有源区，n型区和覆盖层，远离所述有源区域的n型区域。存在用于n型区域的外部电接触的覆盖层上的接触结构。覆盖层具有至少一个凹部，接触结构通过该凹槽延伸到n型区域。

8. 发明授权

US08502204B2 Optoelectronic module 有权
标题翻译：光电模块
公开(公告)号：US08502204B2
公开(公告)日：2013-08-06
申请号：US12922199
申请日：2009-05-13
申请人： Dieter Eissler , Siegfried Herrmann
发明人： Dieter Eissler , Siegfried Herrmann
IPC分类号： H01L29/08 , H01L35/24 , H01L51/00
CPC分类号： H01S5/0261 , H01L25/167 , H01L27/32 , H01L2924/0002 , H01S5/36 , H01S5/4025 , H01L2924/00
摘要： An optoelectronic module includes a layer structure having a plurality of semiconductor layers including a substrate layer, a first layer arrangement and a second layer arrangement, wherein 1) the first layer arrangement has a light-emitting layer arranged on the substrate layer, 2) the second layer arrangement contains at least one circuit that controls an operating state of the light-emitting layer, and 3) the second layer arrangement is arranged on the substrate layer and/or surrounded by the substrate layer.
摘要翻译：光电子模块包括具有多个半导体层的层结构，包括基底层，第一层布置和第二层布置，其中1）第一层布置具有布置在基底层上的发光层，2）第二层布置包含至少一个控制发光层的工作状态的电路，以及3）第二层布置被布置在基板层上和/或被基板层包围。

9. 发明授权

US08399893B2 Luminous means 有权
标题翻译：发光的手段
公开(公告)号：US08399893B2
公开(公告)日：2013-03-19
申请号：US12992230
申请日：2009-08-07
申请人： Dieter Eissler , Siegfried Herrmann
发明人： Dieter Eissler , Siegfried Herrmann
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L25/0756 , H01L33/44 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A luminous means includes a first group of semiconductor chips and a second group of semiconductor chips, each group includes at least one semiconductor chip, wherein the first and second groups of semiconductor chips are arranged laterally alongside one another at least in part with respect to a main emission direction of the luminous means, and a third group of semiconductor chips which includes at least one semiconductor chip and is disposed downstream of the first and the second group with respect to the main emission direction, wherein each group of semiconductor chips emits electromagnetic radiation in wavelength ranges that differ from one another in pairs, radiation emitted by the third group of semiconductor chips has the shortest-wave wavelength range, radiation emitted by the first and second group of semiconductor chips at least partly passes into the at least one semiconductor chip of the third group, and mixed radiation is emitted by an emission area of the luminous means.
摘要翻译：发光装置包括第一组半导体芯片和第二组半导体芯片，每组包括至少一个半导体芯片，其中第一组半导体芯片和第二组半导体芯片相对于一个半导体芯片至少部分地彼此横向排列发光装置的主发射方向以及包括至少一个半导体芯片并且相对于主发射方向设置在第一组和第二组的下游的第三组半导体芯片，其中每组半导体芯片发射电磁辐射在成对地彼此不同的波长范围中，由第三组半导体芯片发射的辐射具有最短波长的波长范围，由第一和第二组半导体芯片发射的辐射至少部分地进入至少一个半导体芯片并且发光装置的发射区域发射混合的辐射。

10. 发明申请

US20090262773A1 Optoelectronic Semiconductor Component With Current Spreading Layer 有权
标题翻译：具有电流扩展层的光电半导体元件
公开(公告)号：US20090262773A1
公开(公告)日：2009-10-22
申请号：US11992706
申请日：2006-09-14
申请人： Magnus Ahlstedt , Dieter Eissler , Robert Walter , Ralph Wirth
发明人： Magnus Ahlstedt , Dieter Eissler , Robert Walter , Ralph Wirth
IPC分类号： H01S5/042 , H01L33/00 , H01L31/0224 , H01L21/02 , H01L21/00
CPC分类号： H01L31/022466 , H01L31/103 , H01L31/1884 , H01L33/0095 , H01L33/42 , H01L2224/48463 , H01S5/0421 , Y02E10/50
摘要： An optoelectronic semiconductor component comprising a semiconductor body (10) and a current spreading layer (3) is specified. The current spreading layer (3) is applied to the semiconductor body (10) at least in places. In this case, the current spreading layer (3) contains a metal (1) that forms a transparent electrically conductive metal oxide (2) in the current spreading layer, and the concentration (x) of the metal (1) decreases from that side of the current spreading layer (3) which faces the semiconductor body (10) toward that side of said current spreading layer which is remote from the semiconductor body (10). A method for producing such a semiconductor component is also disclosed.
摘要翻译：规定了包括半导体本体（10）和电流扩展层（3）的光电半导体部件。至少在某个地方将电流扩展层（3）施加到半导体本体（10）。在这种情况下，电流扩散层（3）包含在电流扩散层中形成透明导电金属氧化物（2）的金属（1），并且金属（1）的浓度（x）从该侧减小（10）面向半导体本体（10）的电流扩展层（3）的电流扩散层（3）的电流扩展层（5）。还公开了一种用于制造这种半导体部件的方法。

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