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1. 发明授权

US09704945B2 Carrier substrate and method for producing semiconductor chips 有权
公开(公告)号：US09704945B2
公开(公告)日：2017-07-11
申请号：US13984081
申请日：2012-02-07
申请人： Ewald Karl Michael Günther , Andreas Plöβl , Heribert Zull , Thomas Veit , Mathias Kämpf , Jens Dennemarck , Bernd Böhm , Korbinian Perzlmaier
发明人： Ewald Karl Michael Günther , Andreas Plöβl , Heribert Zull , Thomas Veit , Mathias Kämpf , Jens Dennemarck , Bernd Böhm , Korbinian Perzlmaier
IPC分类号： H01L29/06 , H01L25/16 , H01L29/66 , H01L23/60 , H01L27/02 , H01L27/14 , H01L27/15 , H01L33/00 , H01L33/64 , H01L33/38
CPC分类号： H01L29/0607 , H01L23/60 , H01L25/167 , H01L27/0248 , H01L27/14 , H01L27/15 , H01L29/66128 , H01L33/0079 , H01L33/382 , H01L33/641 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265
摘要： A carrier substrate includes a first major face and a second major face opposite the first major face. A diode structure is formed between the first major face and the second major face, which diode structure electrically insulates the first major face from the second major face at least with regard to one polarity of an electrical voltage.

2. 发明申请

US20120032306A1 Method for Patterning a Semiconductor Surface, and Semiconductor Chip 审中-公开
标题翻译：半导体表面图案化方法和半导体芯片
公开(公告)号：US20120032306A1
公开(公告)日：2012-02-09
申请号：US13148631
申请日：2010-01-22
申请人： Elmar Baur , Bernd Böhm , Alexander Heindl , Patrick Rode , Matthias Sabathil
发明人： Elmar Baur , Bernd Böhm , Alexander Heindl , Patrick Rode , Matthias Sabathil
IPC分类号： H01L29/12 , H01L21/312
CPC分类号： H01L33/22 , H01L33/0062
摘要： A method for patterning a semiconductor surface is specified. A photoresist is applied to an outer area of a second semiconductor wafer. A surface of the photoresist that is remote from the second semiconductor wafer is patterned by impressing a patterned surface of the first wafer into the photoresist. A patterning method is applied to the surface of the photoresist, wherein a structure applied on the photoresist is transferred at least in places to the outer area of the second semiconductor wafer.
摘要翻译：规定了图案化半导体表面的方法。光致抗蚀剂被施加到第二半导体晶片的外部区域。通过将第一晶片的图案化表面压印到光致抗蚀剂中，使光刻胶远离第二半导体晶片的表面被图案化。将图案化方法应用于光致抗蚀剂的表面，其中施加在光致抗蚀剂上的结构至少在第二半导体晶片的外部区域被转移。

3. 发明授权

US09147806B2 Optoelectronic semiconductor chip, method of fabrication and application in an optoelectronic component 有权
标题翻译：光电子半导体芯片，制造和应用于光电子器件的方法
公开(公告)号：US09147806B2
公开(公告)日：2015-09-29
申请号：US13825156
申请日：2011-09-15
申请人： Bernd Böhm , Gertrud Kräuter , Andreas Plöβl
发明人： Bernd Böhm , Gertrud Kräuter , Andreas Plöβl
IPC分类号： H01L33/22 , H01L33/44 , H01L31/0236 , H01L31/054
CPC分类号： H01L33/22 , H01L31/0236 , H01L31/02366 , H01L31/054 , H01L33/44 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/0091 , Y02E10/52 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic semiconductor chip includes an active layer with a first and a second major face, including a semiconductor material which emits or receives radiation when the semiconductor chip is in operation; a patterned layer including three-dimensional patterns for outcoupling or incoupling radiation and arranged on the first major face in a beam path of the radiation, wherein the patterned layer includes an inorganic-organic hybrid material.
摘要翻译：光电半导体芯片包括具有第一和第二主面的有源层，包括当半导体芯片工作时发射或接收辐射的半导体材料; 包括用于输出耦合或去耦辐射的三维图案并且布置在辐射的光束路径中的第一主面上的图案层，其中所述图案化层包括无机 - 有机杂化材料。

4. 发明授权

US06467175B2 Spoon 失效
标题翻译：勺
公开(公告)号：US06467175B2
公开(公告)日：2002-10-22
申请号：US09463310
申请日：2000-01-24
申请人： Bernd Böhm-Van Diggelen
发明人： Bernd Böhm-Van Diggelen
IPC分类号： A47J4328
CPC分类号： A47G21/04
摘要： The invention relates to a spoon for receiving soft or liquid food. Said spoon has a handle with an attached mouthpiece constructed of soft and flexible material. The aim of the invention is to significantly simplify the manner in which food is received by small children and people with facial paralysis. The spoon has a practical shape in that the mouthpiece is trough-shaped and concave and has a level defining upper edge, whereby the thickness of the mouthpiece in the front and on the lateral side is proportional so that its concave shape can be inverted by the pressure of the tongue (Z) during swallowing and the mouthpiece can adapt to the arched shape of the hard palate (G) in a sagital and transversal direction.
摘要翻译：本发明涉及一种用于接收柔软或液体食物的勺子。所述勺具有具有由柔软和柔性材料构成的附加接口的手柄。本发明的目的是大大简化小孩子和面部麻痹者接受食物的方式。勺具有实用的形状，因为接口是槽形和凹形的，并且具有限定上边缘的水平，由此口部在前侧和侧面上的厚度成比例，使得其凹形形状可以由吞咽期间舌头（Z）的压力和喉舌可以以矢状和横向方向适应硬腭（G）的拱形形状。

5. 发明授权

US06168434A Oral hygiene appliance 失效
标题翻译：口腔卫生用具
公开(公告)号：US06168434A
公开(公告)日：2001-01-02
申请号：US09341920
申请日：1999-07-21
申请人： Bernd Böhm-Van Diggelen
发明人： Bernd Böhm-Van Diggelen
IPC分类号： A61C300
CPC分类号： A46B5/0016 , A46B5/0008 , A46B9/005 , A46B15/0073 , A46B15/0075 , A46B2200/108 , A61C15/046
摘要： An oral hygiene appliance has a spring-elastic working piece, comprising a stamped element made from foam, on the head of an handle. The stamped element is made from closed-cell foam, and only the cells located on the stamping face are opened by the stamping process.
摘要翻译：口腔卫生用具具有弹性工作片，其包括在手柄的头部上由泡沫制成的冲压元件。冲压元件由闭孔泡沫制成，只有位于冲压面上的电池通过冲压工艺打开。

6. 发明申请

US20120070927A1 METHOD FOR PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT 有权
标题翻译：生产光电半导体元件的方法
公开(公告)号：US20120070927A1
公开(公告)日：2012-03-22
申请号：US13322662
申请日：2010-05-03
申请人： Elmar Baur , Alexander Heindl , Bernd Böhm , Patrick Rode , Heribert Zull
发明人： Elmar Baur , Alexander Heindl , Bernd Böhm , Patrick Rode , Heribert Zull
IPC分类号： H01L33/48
CPC分类号： H01L33/22 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L33/005 , H01L33/20
摘要： A method for producing an optoelectronic semiconductor component includes providing a first wafer having a patterned surface, wherein the patterned surface is formed at least in places by elevations having first and second heights, wherein the first height is greater than the second height; providing a second wafer; applying a photoresist to outer areas of the second wafer; patterning a surface of the photoresist facing away from the second wafer by impressing the patterned surface of the first wafer into the photoresist, wherein the elevations are impressed as trenches having a first and second depth into the photoresist; applying a patterning method to the patterned surface of the photoresist, wherein the structure applied on the photoresist is transferred at least in places to the outer area of the second wafer.
摘要翻译：一种用于制造光电子半导体部件的方法包括提供具有图案化表面的第一晶片，其中所述图案化表面至少在具有第一和第二高度的高度的位置形成，其中所述第一高度大于所述第二高度; 提供第二晶片; 将光致抗蚀剂施加到第二晶片的外部区域; 通过将第一晶片的图案化表面压印到光致抗蚀剂中，将光致抗蚀剂的表面图案化为远离第二晶片，其中，将高度作为具有第一和第二深度的沟槽印刷到光致抗蚀剂中; 将图案化方法应用于光致抗蚀剂的图案化表面，其中施加在光致抗蚀剂上的结构至少在第二晶片的外部区域被转移。

7. 发明申请

US20140145228A1 OPTOELECTRONIC SEMICONDUCTOR CHIP, METHOD OF FABRICATION AND APPLICATION IN AN OPTOELECTRONIC COMPONENT 有权
标题翻译：光电半导体芯片，光电元件制造方法及应用
公开(公告)号：US20140145228A1
公开(公告)日：2014-05-29
申请号：US13825156
申请日：2011-09-15
申请人： Bernd Böhm , Gertrud Kräuter , Andreas Plössl
发明人： Bernd Böhm , Gertrud Kräuter , Andreas Plössl
IPC分类号： H01L33/22 , H01L31/0236
CPC分类号： H01L33/22 , H01L31/0236 , H01L31/02366 , H01L31/054 , H01L33/44 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/0091 , Y02E10/52 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic semiconductor chip includes an active layer with a first and a second major face, including a semiconductor material which emits or receives radiation when the semiconductor chip is in operation; a patterned layer including three-dimensional patterns for outcoupling or incoupling radiation and arranged on the first major face in a beam path of the radiation, wherein the patterned layer includes an inorganic-organic hybrid material.
摘要翻译：光电子半导体芯片包括具有第一和第二主面的有源层，包括当半导体芯片工作时发射或接收辐射的半导体材料; 包括用于输出耦合或去耦辐射的三维图案并且布置在辐射的光束路径中的第一主面上的图案层，其中所述图案化层包括无机 - 有机杂化材料。

8. 发明申请

US20140008770A1 CARRIER SUBSTRATE AND METHOD FOR PRODUCING SEMICONDUCTOR CHIPS 有权
标题翻译：载体基板和制造半导体晶片的方法
公开(公告)号：US20140008770A1
公开(公告)日：2014-01-09
申请号：US13984081
申请日：2012-02-07
申请人： Ewald Karl Michael Günther , Andreas Plößl , Heribert Zull , Thomas Veit , Mathias Kämpf , Jens Dennemarck , Bernd Böhm , Korbinian Perzlmaier
发明人： Ewald Karl Michael Günther , Andreas Plößl , Heribert Zull , Thomas Veit , Mathias Kämpf , Jens Dennemarck , Bernd Böhm , Korbinian Perzlmaier
IPC分类号： H01L29/06 , H01L29/66
CPC分类号： H01L29/0607 , H01L23/60 , H01L25/167 , H01L27/0248 , H01L27/14 , H01L27/15 , H01L29/66128 , H01L33/0079 , H01L33/382 , H01L33/641 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265
摘要： A carrier substrate includes a first major face and a second major face opposite the first major face. A diode structure is formed between the first major face and the second major face, which diode structure electrically insulates the first major face from the second major face at least with regard to one polarity of an electrical voltage.
摘要翻译：载体基板包括第一主面和与第一主面相对的第二主面。在第一主面和第二主面之间形成二极管结构，该二极管结构至少关于电压的一个极性使第一主面与第二主面电绝缘。

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